PANTUSO; Daniel

Patent Applications and Registrations

Patent applications and USPTO patent grants for PANTUSO; Daniel.The latest application filed is for "fabrication and use of through silicon vias on double sided interconnect device".

Company Profile

5.11.10

PANTUSO; Daniel - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication And Use Of Through Silicon Vias On Double Sided Interconnect Device App 20220130803 - MUELLER; Brennen K. ; et al.	2022-04-28
Fabrication and use of through silicon vias on double sided interconnect device Grant 11,251,156 - Mueller , et al. February 15, 2	2022-02-15
Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer Grant 11,195,719 - Pawashe , et al. December 7, 2	2021-12-07
Semiconductor fin design to mitigate fin collapse Grant 11,171,057 - Glass , et al. November 9, 2	2021-11-09
Fluid viscosity control during wafer bonding Grant 11,056,356 - Mueller , et al. July 6, 2	2021-07-06
Integrated thermoelectric cooling Grant 10,825,752 - Jiang , et al. November 3, 2	2020-11-03
Wafer to wafer bonding with low wafer distortion Grant 10,720,345 - Kobrinsky , et al.	2020-07-21
Compliant layer for wafer to wafer bonding Grant 10,707,186 - Kobrinsky , et al.	2020-07-07
Semiconductor Fin Design To Mitigate Fin Collapse App 20200066595 - GLASS; GLENN A. ; et al.	2020-02-27
Reducing In-plane Distortion From Wafer To Wafer Bonding Using A Dummy Wafer App 20190304784 - PAWASHE; Chytra ; et al.	2019-10-03
Fabrication And Use Of Through Silicon Vias On Double Sided Interconnect Device App 20180323174 - MUELLER; Brennen K. ; et al.	2018-11-08
Techniques for enhancing fracture resistance of interconnects Grant 9,691,716 - Jezewski , et al. June 27, 2	2017-06-27
Techniques For Enhancing Fracture Resistance Of Interconnects App 20160268218 - JEZEWSKI; CHRISTOPHER J. ; et al.	2016-09-15
Techniques for enhancing fracture resistance of interconnects Grant 9,343,411 - Jezewski , et al. May 17, 2	2016-05-17
Integrated Thermoelectric Cooling App 20160027717 - Jang; Lei ; et al.	2016-01-28
Techniques For Enhancing Fracture Resistance Of Interconnects App 20140210098 - Jezewski; Christopher J. ; et al.	2014-07-31
Thermally coupling electrically decoupling cooling device for integrated circuits Grant 6,646,340 - Deeter , et al. November 11, 2	2003-11-11
Thermally Coupling Electrically Decoupling Cooling Device For Integrated Circuits App 20030151131 - Deeter, Timothy L. ; et al.	2003-08-14
Thermally coupling electrically decoupling cooling device for integrated circuits Grant 6,525,419 - Deeter , et al. February 25, 2	2003-02-25

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