Paniagua; Jose Ricardo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Paniagua; Jose Ricardo.The latest application filed is for "backplane footprint for high speed, high density electrical connectors".

Company Profile

1.11.14

Paniagua; Jose Ricardo - Newmarket NH
Paniagua; Jose Ricardo - New Market NH
Paniagua; Jose Ricardo - Nashua NH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Backplane Footprint For High Speed, High Density Electrical Connectors App 20210329775 - Charbonneau; Marc Robert ; et al.	2021-10-21
Backplane footprint for high speed, high density electrical connectors Grant 11,096,270 - Charbonneau , et al. August 17, 2	2021-08-17
Backplane Footprint For High Speed, High Density Electrical Connectors App 20210219420 - Charbonneau; Marc Robert ; et al.	2021-07-15
Backplane footprint for high speed, high density electrical connectors Grant 10,993,314 - Charbonneau , et al. April 27, 2	2021-04-27
High Speed Connector App 20200266585 - Paniagua; Jose Ricardo ; et al.	2020-08-20
Backplane Footprint For High Speed, High Density Electrical Connectors App 20200229299 - Charbonneau; Marc Robert ; et al.	2020-07-16
Backplane footprint for high speed, high density electrical connectors Grant 10,638,599 - Charbonneau , et al.	2020-04-28
Backplane Footprint For High Speed, High Density Electrical Connectors App 20200068705 - Charbonneau; Marc Robert ; et al.	2020-02-27
Backplane footprint for high speed, high density electrical connectors Grant 10,485,097 - Charbonneau , et al. Nov	2019-11-19
Backplane Footprint For High Speed, High Density Electrical Connectors App 20190150273 - Charbonneau; Marc Robert ; et al.	2019-05-16
Backplane Footprint For High Speed, High Density Electrical Connectors App 20190110359 - Charbonneau; Marc Robert ; et al.	2019-04-11
Backplane footprint for high speed, high density electrical connectors Grant 10,201,074 - Charbonneau , et al. Fe	2019-02-05
Backplane footprint for high speed, high density electrical connectors Grant 10,187,972 - Charbonneau , et al. Ja	2019-01-22
Backplane Footprint For High Speed, High Density Electrical Connectors App 20180070439 - Charbonneau; Marc Robert ; et al.	2018-03-08
Backplane Footprint For High Speed, High Density Electrical Connectors App 20170265296 - Charbonneau; Marc Robert ; et al.	2017-09-14
Electrical connector with hybrid shield Grant 9,660,384 - Paniagua May 23, 2	2017-05-23
Electrical Connector With Hybrid Shield App 20150255926 - Paniagua; Jose Ricardo	2015-09-10
Electrical connector with hybrid shield Grant 9,004,942 - Paniagua April 14, 2	2015-04-14
High Performance Printed Circuit Board App 20140326495 - Paniagua; Jose Ricardo	2014-11-06
Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards Grant 8,481,866 - Chan , et al. July 9, 2	2013-07-09
Adjacent Plated Through Holes With Staggered Couplings For Crosstalk Reduction In High Speed Printed Circuit Boards App 20120000701 - CHAN; Jason Edward ; et al.	2012-01-05
Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards Grant 7,999,192 - Chan , et al. August 16, 2	2011-08-16
Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards App 20080227311 - Chan; Jason Edward ; et al.	2008-09-18

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