Pang; Xingshou
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pang; Xingshou.The latest application filed is for "protection from metal migration on ic packages".
- Pang; Xingshou - Tianjin CN
| Patent | Date |
|---|---|
| Protection from metal migration on IC packages Grant 11,417,541 - Bai , et al. August 16, 2 | 2022-08-16 |
| Protection From Metal Migration On Ic Packages App 20210066092 - Bai; Zhigang ; et al. | 2021-03-04 |
| Lead frame with bendable leads Grant 10,515,880 - Yao , et al. Dec | 2019-12-24 |
| Packaged integrated circuit having stacked die and method for therefor Grant 10,446,476 - Higgins, III , et al. Oc | 2019-10-15 |
| Lead Frame With Bendable Leads App 20190287883 - Yao; Jinzhong ; et al. | 2019-09-19 |
| Packaged Integrated Circuit Having Stacked Die And Method For Therefor App 20190088576 - HIGGINS, III; LEO M. ; et al. | 2019-03-21 |
| Lead frame for integrated circuit device having J-leads and Gull Wing leads Grant 10,217,700 - Bai , et al. Feb | 2019-02-26 |
| Lead frame for integrated circuit device having J-leads and gull wing leads Grant 10,181,434 - Pang , et al. Ja | 2019-01-15 |
| Lead frame with dummy leads for burr mitigation during encapsulation Grant 10,037,935 - Pang , et al. July 31, 2 | 2018-07-31 |
| Floating mold tool for semicondcutor packaging Grant 9,443,746 - Bai , et al. September 13, 2 | 2016-09-13 |
| Packaged semiconductor sensor device with lid Grant 9,416,002 - Xu , et al. August 16, 2 | 2016-08-16 |
| Quad flat non-leaded semiconductor package with wettable flank Grant 9,324,637 - Bai , et al. April 26, 2 | 2016-04-26 |
| Semiconductor Device With Inspectable Solder Joints App 20160056097 - Bai; Zhigang ; et al. | 2016-02-25 |
| Floating Mold Tool For Semicondcutor Packaging App 20160049318 - Bai; Zhigang ; et al. | 2016-02-18 |
| Packaged Semiconductor Sensor Device With Lid App 20160023894 - Xu; Nan ; et al. | 2016-01-28 |
| Stacked die semiconductor package Grant 8,692,387 - Qiu , et al. April 8, 2 | 2014-04-08 |
| Method of making semiconductor package with improved standoff Grant 8,481,369 - Luo , et al. July 9, 2 | 2013-07-09 |
| Qfn Device And Lead Frame Therefor App 20130049180 - XU; Nan ; et al. | 2013-02-28 |
| Stacked Die Semiconductor Package App 20130020690 - QIU; Shunan ; et al. | 2013-01-24 |
| Mram Device And Method Of Assembling Same App 20120193737 - Pang; Xingshou ; et al. | 2012-08-02 |
| Method Of Making Semiconductor Package With Improved Standoff App 20110189823 - Luo; Junhua ; et al. | 2011-08-04 |
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