Pang Tak; Shing Dick
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pang Tak; Shing Dick.The latest application filed is for "led back end assembly and method of manufacturing".
- Pang Tak; Shing Dick - Tsuen Wan HK
- Pang; Tak Shing (Dick) - Hong Kong N/A CN
- Pang; Tak Shing (Dick) - Hongkong CN
- Pang; Tak Shing (Dick) - Dick
| Patent | Date |
|---|---|
| LED back end assembly and method of manufacturing Grant 9,748,460 - Tam , et al. August 29, 2 | 2017-08-29 |
| Led Back End Assembly And Method Of Manufacturing App 20140239342 - Tam; Samuel ; et al. | 2014-08-28 |
| Camera module with molded tape flip chip imager mount and method of manufacture Grant 8,430,579 - Tam , et al. April 30, 2 | 2013-04-30 |
| Solar Cell Module On Molded Lead-frame And Methods Of Manufacture App 20130032203 - Tam; Samuel Waising ; et al. | 2013-02-07 |
| Camera module with molded tape flip chip imager mount and method of manufacture App 20110194023 - Tam; Samuel Waising ; et al. | 2011-08-11 |
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