Pang; Tak Shing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pang; Tak Shing.The latest application filed is for "solder deposition system and method for metal bumps".
- Pang; Tak Shing - Hong King CN
- Pang; Tak Shing - Hong Kong CN
- Pang; Tak Shing - Tsuen Wan NT HK
- Pang; Tak Shing - New Territories HK
| Patent | Date |
|---|---|
| Camera assembly with embedded components and redistribution layer interconnects Grant 10,069,018 - Tam , et al. September 4, 2 | 2018-09-04 |
| Imager module with molded packaging Grant 9,848,111 - Pang , et al. December 19, 2 | 2017-12-19 |
| Multiple camera alignment system with flexible substrates and stiffener members Grant 9,838,600 - Tam , et al. December 5, 2 | 2017-12-05 |
| Multiple camera alignment system with rigid substrates Grant 9,838,599 - Tam , et al. December 5, 2 | 2017-12-05 |
| Imager module with castellated interposer chip Grant 9,706,092 - Tam , et al. July 11, 2 | 2017-07-11 |
| Imager module with molded packaging Grant 9,681,032 - Tam , et al. June 13, 2 | 2017-06-13 |
| Protective coating for silicon substrate Grant 9,514,925 - Tam , et al. December 6, 2 | 2016-12-06 |
| Solar cell module on molded lead-frame and method of manufacture Grant 9,178,093 - Tam , et al. November 3, 2 | 2015-11-03 |
| Solder Deposition System And Method For Metal Bumps App 20130026212 - Tam; Samuel Waising ; et al. | 2013-01-31 |
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