Paneccasio; Vincent

Patent Applications and Registrations

Patent applications and USPTO patent grants for Paneccasio; Vincent.The latest application filed is for "leveler compositions for use in copper deposition in manufacture of microelectronics".

Company Profile

1.14.11

Paneccasio; Vincent - Waterbury CT
Paneccasio; Vincent - Madison CT
Paneccasio; Vincent - West Haven CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leveler compositions for use in copper deposition in manufacture of microelectronics Grant 11,168,406 - Paneccasio , et al. November 9, 2	2021-11-09
Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics App 20200063280 - Paneccasio; Vincent ; et al.	2020-02-27
Process for filling vias in the microelectronics Grant 10,103,029 - Richardson , et al. October 16, 2	2018-10-16
Electrodeposition of Copper App 20160281251 - Paneccasio; Vincent ; et al.	2016-09-29
Process for Filling Vias in the Microelectronics App 20160254156 - Richardson; Thomas B. ; et al.	2016-09-01
Defect reduction in electrodeposited copper for semiconductor applications Grant 9,222,188 - Commander , et al. December 29, 2	2015-12-29
Copper electrodeposition in microelectronics Grant 8,002,962 - Paneccasio , et al. August 23, 2	2011-08-23
Copper deposition for filling features in manufacture of microelectronic devices Grant 7,968,455 - Lin , et al. June 28, 2	2011-06-28
Manufacture of electroless cobalt deposition compositions for microelectronics applications Grant 7,704,306 - Chen , et al. April 27, 2	2010-04-27
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,615,491 - Chen , et al. November 10, 2	2009-11-10
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,611,988 - Chen , et al. November 3, 2	2009-11-03
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,611,987 - Chen , et al. November 3, 2	2009-11-03
Cobalt Capping Surface Preparation In Microelectronics Manufacture App 20080236619 - Chen; Qingyun ; et al.	2008-10-02
Defectivity and process control of electroless deposition in microelectronics applications Grant 7,410,899 - Chen , et al. August 12, 2	2008-08-12
Defect Reduction In Electrodeposited Copper For Semiconductor Applications App 20080121527 - Commander; John ; et al.	2008-05-29
Manufacture Of Electroless Cobalt Deposition Compositions For Microelectronics Applications App 20080090414 - Chen; Qingyun ; et al.	2008-04-17
Defect reduction in electrodeposited copper for semiconductor applications Grant 7,316,772 - Commander , et al. January 8, 2	2008-01-08
Copper electrodeposition in microelectronics Grant 7,303,992 - Paneccasio , et al. December 4, 2	2007-12-04
Defectivity and process control of electroless deposition in microelectronics applications App 20070062408 - Chen; Qingyun ; et al.	2007-03-22
Defectivity and process control of electroless deposition in microelectronics applications App 20070066058 - Chen; Qingyun ; et al.	2007-03-22
Defectivity and process control of electroless deposition in microelectronics applications App 20070066059 - Chen; Qingyun ; et al.	2007-03-22
Defectivity and process control of electroless deposition in microelectronics applications App 20070066057 - Chen; Qingyun ; et al.	2007-03-22
Defect reduction in electrodeposited copper for semiconductor applications App 20030168343 - Commander, John ; et al.	2003-09-11
Zinc plating solutions and method utilizing ethoxylated/propoxylated polyhydric alcohols Grant 4,512,856 - Paneccasio April 23, 1	1985-04-23

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