loadpatents
Patent applications and USPTO patent grants for Paneccasio, Jr.; Vincent.The latest application filed is for "composition and method for fabrication of nickel interconnects".
Patent | Date |
---|---|
Cobalt filling of interconnects in microelectronics Grant 11,434,578 - Commander , et al. September 6, 2 | 2022-09-06 |
Copper electrodeposition in microelectronics Grant RE49,202 - Paneccasio, Jr. , et al. September 6, 2 | 2022-09-06 |
Cobalt filling of interconnects Grant 11,401,618 - Commander , et al. August 2, 2 | 2022-08-02 |
Composition and Method for Fabrication of Nickel Interconnects App 20220064811 - Yakobson; Eric ;   et al. | 2022-03-03 |
Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20210388519 - Richardson; Thomas ;   et al. | 2021-12-16 |
Cobalt Filling of Interconnects App 20210332491 - Commander; John ;   et al. | 2021-10-28 |
Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics App 20210310141 - Paneccasio, JR.; Vincent ;   et al. | 2021-10-07 |
Copper deposition in wafer level packaging of integrated circuits Grant 11,124,888 - Richardson , et al. September 21, 2 | 2021-09-21 |
Cobalt Filling of Interconnects in Microelectronics App 20210222314 - Commander; John ;   et al. | 2021-07-22 |
Cobalt filling of interconnects Grant 11,035,048 - Commander , et al. June 15, 2 | 2021-06-15 |
Cobalt filling of interconnects in microelectronics Grant 10,995,417 - Commander , et al. May 4, 2 | 2021-05-04 |
Cobalt Filling of Interconnects in Microelectronics App 20200040478 - Commander; John ;   et al. | 2020-02-06 |
Process for filling vias in the microelectronics Grant 10,541,140 - Richardson , et al. Ja | 2020-01-21 |
Leveler compositions for use in copper deposition in manufacture of microelectronics Grant 10,519,557 - Paneccasio, Jr. , et al. Dec | 2019-12-31 |
Copper Electrodeposition in Microelectronics App 20190390356 - Paneccasio, Jr.; Vincent ;   et al. | 2019-12-26 |
Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20190368064 - Richardson; Thomas ;   et al. | 2019-12-05 |
Levelers for copper deposition in microelectronics Grant 10,294,574 - Whitten , et al. | 2019-05-21 |
Copper filling of through silicon vias Grant 10,221,496 - Richardson , et al. | 2019-03-05 |
Cobalt Filling of Interconnects App 20190010624 - Commander; John ;   et al. | 2019-01-10 |
Copper Filling Of Through Silicon Vias App 20190003068 - Richardson; Thomas B. ;   et al. | 2019-01-03 |
Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics App 20170233883 - Paneccasio, JR.; Vincent ;   et al. | 2017-08-17 |
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 9,613,858 - Paneccasio, Jr. , et al. April 4, 2 | 2017-04-04 |
Copper Electrodeposition in Microelectronics App 20170029972 - Paneccasio, JR.; Vincent ;   et al. | 2017-02-02 |
Copper electrodeposition in microelectronics Grant 9,493,884 - Paneccasio, Jr. , et al. November 15, 2 | 2016-11-15 |
Levelers For Copper Deposition In Microelectronics App 20160076160 - Whitten; Kyle ;   et al. | 2016-03-17 |
Method And Composition For Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20140322912 - Paneccasio, JR.; Vincent ;   et al. | 2014-10-30 |
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 8,771,495 - Paneccasio, Jr. , et al. July 8, 2 | 2014-07-08 |
Process For Filling Vias In The Microelectronics App 20140120722 - Richardson; Thomas B. ;   et al. | 2014-05-01 |
Copper Electrodeposition In Microelectronics App 20140102909 - Paneccasio, JR.; Vincent ;   et al. | 2014-04-17 |
Copper electrodeposition in microelectronics Grant 8,608,933 - Paneccasio, Jr. , et al. December 17, 2 | 2013-12-17 |
Method And Composition For Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20130241060 - Paneccasio, JR.; Vincent ;   et al. | 2013-09-19 |
Copper Filling Of Through Silicon Vias App 20130199935 - Richardson; Thomas B. ;   et al. | 2013-08-08 |
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 8,388,824 - Paneccasio, Jr. , et al. March 5, 2 | 2013-03-05 |
Copper Electrodeposition In Microelectronics App 20120043218 - Paneccasio, JR.; Vincent ;   et al. | 2012-02-23 |
Surface preparation process for damascene copper deposition Grant 7,998,859 - Chen , et al. August 16, 2 | 2011-08-16 |
Copper Deposition For Filling Features In Manufacture Of Microelectronic Devices App 20100285660 - Lin; Xuan ;   et al. | 2010-11-11 |
Copper electrodeposition in microelectronics Grant 7,815,786 - Paneccasio, Jr. , et al. October 19, 2 | 2010-10-19 |
Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20100126872 - Paneccasio, JR.; Vincent ;   et al. | 2010-05-27 |
Surface Preparation Process For Damascene Copper Deposition App 20100075496 - Chen; Qingyun ;   et al. | 2010-03-25 |
Copper metallization of through silicon via Grant 7,670,950 - Richardson , et al. March 2, 2 | 2010-03-02 |
Copper Metallization Of Through Silicon Via App 20090035940 - Richardson; Thomas B. ;   et al. | 2009-02-05 |
Cobalt and nickel electroless plating in microelectronic devices Grant 7,332,193 - Valverde , et al. February 19, 2 | 2008-02-19 |
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect Grant 6,776,893 - Too , et al. August 17, 2 | 2004-08-17 |
Method for applying a conductive paint coating and articles made thereby Grant 6,375,866 - Paneccasio, Jr. , et al. April 23, 2 | 2002-04-23 |
Coatings for EMI/RFI shielding Grant 6,013,203 - Paneccasio, Jr. , et al. January 11, 2 | 2000-01-11 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.