Paneccasio, Jr.; Vincent
Patent Applications and Registrations
Patent applications and USPTO patent grants for Paneccasio, Jr.; Vincent.The latest application filed is for "composition and method for fabrication of nickel interconnects".
Company Profile
13.26.26
- Paneccasio, Jr.; Vincent - Madison CT
- Paneccasio, JR.; Vincent - Waterbury CT
Patent Activity
| Patent | Date |
|---|---|
| Cobalt filling of interconnects in microelectronics Grant 11,434,578 - Commander , et al. September 6, 2 | 2022-09-06 |
| Copper electrodeposition in microelectronics Grant RE49,202 - Paneccasio, Jr. , et al. September 6, 2 | 2022-09-06 |
| Cobalt filling of interconnects Grant 11,401,618 - Commander , et al. August 2, 2 | 2022-08-02 |
| Composition and Method for Fabrication of Nickel Interconnects App 20220064811 - Yakobson; Eric ; et al. | 2022-03-03 |
| Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20210388519 - Richardson; Thomas ; et al. | 2021-12-16 |
| Cobalt Filling of Interconnects App 20210332491 - Commander; John ; et al. | 2021-10-28 |
| Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics App 20210310141 - Paneccasio, JR.; Vincent ; et al. | 2021-10-07 |
| Copper deposition in wafer level packaging of integrated circuits Grant 11,124,888 - Richardson , et al. September 21, 2 | 2021-09-21 |
| Cobalt Filling of Interconnects in Microelectronics App 20210222314 - Commander; John ; et al. | 2021-07-22 |
| Cobalt filling of interconnects Grant 11,035,048 - Commander , et al. June 15, 2 | 2021-06-15 |
| Cobalt filling of interconnects in microelectronics Grant 10,995,417 - Commander , et al. May 4, 2 | 2021-05-04 |
| Cobalt Filling of Interconnects in Microelectronics App 20200040478 - Commander; John ; et al. | 2020-02-06 |
| Process for filling vias in the microelectronics Grant 10,541,140 - Richardson , et al. Ja | 2020-01-21 |
| Leveler compositions for use in copper deposition in manufacture of microelectronics Grant 10,519,557 - Paneccasio, Jr. , et al. Dec | 2019-12-31 |
| Copper Electrodeposition in Microelectronics App 20190390356 - Paneccasio, Jr.; Vincent ; et al. | 2019-12-26 |
| Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20190368064 - Richardson; Thomas ; et al. | 2019-12-05 |
| Levelers for copper deposition in microelectronics Grant 10,294,574 - Whitten , et al. | 2019-05-21 |
| Copper filling of through silicon vias Grant 10,221,496 - Richardson , et al. | 2019-03-05 |
| Cobalt Filling of Interconnects App 20190010624 - Commander; John ; et al. | 2019-01-10 |
| Copper Filling Of Through Silicon Vias App 20190003068 - Richardson; Thomas B. ; et al. | 2019-01-03 |
| Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics App 20170233883 - Paneccasio, JR.; Vincent ; et al. | 2017-08-17 |
| Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 9,613,858 - Paneccasio, Jr. , et al. April 4, 2 | 2017-04-04 |
| Copper Electrodeposition in Microelectronics App 20170029972 - Paneccasio, JR.; Vincent ; et al. | 2017-02-02 |
| Copper electrodeposition in microelectronics Grant 9,493,884 - Paneccasio, Jr. , et al. November 15, 2 | 2016-11-15 |
| Levelers For Copper Deposition In Microelectronics App 20160076160 - Whitten; Kyle ; et al. | 2016-03-17 |
| Method And Composition For Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20140322912 - Paneccasio, JR.; Vincent ; et al. | 2014-10-30 |
| Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 8,771,495 - Paneccasio, Jr. , et al. July 8, 2 | 2014-07-08 |
| Process For Filling Vias In The Microelectronics App 20140120722 - Richardson; Thomas B. ; et al. | 2014-05-01 |
| Copper Electrodeposition In Microelectronics App 20140102909 - Paneccasio, JR.; Vincent ; et al. | 2014-04-17 |
| Copper electrodeposition in microelectronics Grant 8,608,933 - Paneccasio, Jr. , et al. December 17, 2 | 2013-12-17 |
| Method And Composition For Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20130241060 - Paneccasio, JR.; Vincent ; et al. | 2013-09-19 |
| Copper Filling Of Through Silicon Vias App 20130199935 - Richardson; Thomas B. ; et al. | 2013-08-08 |
| Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers Grant 8,388,824 - Paneccasio, Jr. , et al. March 5, 2 | 2013-03-05 |
| Copper Electrodeposition In Microelectronics App 20120043218 - Paneccasio, JR.; Vincent ; et al. | 2012-02-23 |
| Surface preparation process for damascene copper deposition Grant 7,998,859 - Chen , et al. August 16, 2 | 2011-08-16 |
| Copper Deposition For Filling Features In Manufacture Of Microelectronic Devices App 20100285660 - Lin; Xuan ; et al. | 2010-11-11 |
| Copper electrodeposition in microelectronics Grant 7,815,786 - Paneccasio, Jr. , et al. October 19, 2 | 2010-10-19 |
| Electrodeposition Of Copper In Microelectronics With Dipyridyl-based Levelers App 20100126872 - Paneccasio, JR.; Vincent ; et al. | 2010-05-27 |
| Surface Preparation Process For Damascene Copper Deposition App 20100075496 - Chen; Qingyun ; et al. | 2010-03-25 |
| Copper metallization of through silicon via Grant 7,670,950 - Richardson , et al. March 2, 2 | 2010-03-02 |
| Copper Metallization Of Through Silicon Via App 20090035940 - Richardson; Thomas B. ; et al. | 2009-02-05 |
| Cobalt and nickel electroless plating in microelectronic devices Grant 7,332,193 - Valverde , et al. February 19, 2 | 2008-02-19 |
| Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect Grant 6,776,893 - Too , et al. August 17, 2 | 2004-08-17 |
| Method for applying a conductive paint coating and articles made thereby Grant 6,375,866 - Paneccasio, Jr. , et al. April 23, 2 | 2002-04-23 |
| Coatings for EMI/RFI shielding Grant 6,013,203 - Paneccasio, Jr. , et al. January 11, 2 | 2000-01-11 |
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