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Patent applications and USPTO patent grants for PANDEY; Prativa.The latest application filed is for "diamond-based slurries with improved sapphire removal rate and surface roughness".
Patent | Date |
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Diamond-based Slurries With Improved Sapphire Removal Rate And Surface Roughness App 20180072916 - PANDEY; Prativa ;   et al. | 2018-03-15 |
Selective nitride slurries with improved stability and improved polishing characteristics Grant 9,597,768 - Pandey , et al. March 21, 2 | 2017-03-21 |
Selective Nitride Slurries With Improved Stability And Improved Polishing Characteristics App 20170066102 - PANDEY; Prativa ;   et al. | 2017-03-09 |
CMP compositions exhibiting reduced dishing in STI wafer polishing Grant 9,422,455 - Pallikkara Kuttiatoor , et al. August 23, 2 | 2016-08-23 |
Cmp Compositions Exhibiting Reduced Dishing In Sti Wafer Polishing App 20160168421 - PALLIKKARA KUTTIATOOR; Sudeep ;   et al. | 2016-06-16 |
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