loadpatents
name:-0.0047488212585449
name:-0.016491889953613
name:-0.00037980079650879
The Panda Project Patent Filings

The Panda Project

Patent Applications and Registrations

Patent applications and USPTO patent grants for The Panda Project.The latest application filed is for "backplane system having high-density electrical connectors".

Company Profile
0.18.3
  • The Panda Project - Silicon Bandwidth, Inc.,
  • The Panda Project - Boca Raton FL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Backplane system having high-density electrical connectors
App 20080005442 - Crane; Stanford W. JR. ;   et al.
2008-01-03
Electrical connector having staggered hold-down tabs
App 20020042225 - Crane, Stanford W. JR. ;   et al.
2002-04-11
Multi-chip module having interconnect dies
App 20010040792 - Crane, Stanford W. JR. ;   et al.
2001-11-15
Electrical connector having staggered hold-down tabs
Grant 6,050,850 - Crane, Jr. , et al. April 18, 2
2000-04-18
Cooling system for semiconductor die carrier
Grant 6,031,720 - Crane, Jr. , et al. February 29, 2
2000-02-29
Multi-chip module having interconnect dies
Grant 6,016,256 - Crane, Jr. , et al. January 18, 2
2000-01-18
Interface optimized computer system architecture
Grant 5,951,665 - Crane, Jr. , et al. September 14, 1
1999-09-14
Low profile semiconductor die carrier
Grant 5,824,950 - Mosley , et al. October 20, 1
1998-10-20
Semiconductor die carrier having a dielectric epoxy between adjacent leads
Grant 5,821,457 - Mosley , et al. October 13, 1
1998-10-13
Contact beam for electrical interconnect component
Grant 5,791,947 - Crane, Jr. , et al. August 11, 1
1998-08-11
Computer system having a motorized door mechanism
Grant 5,781,408 - Crane, Jr. , et al. July 14, 1
1998-07-14
Method of manufacturing a semiconductor chip carrier affording a high-density external interface
Grant 5,696,027 - Crane, Jr. , et al. December 9, 1
1997-12-09
Computer system having color-coded printed circuit boards and corresponding slats
Grant 5,661,631 - Crane, Jr. August 26, 1
1997-08-26
Method of manufacturing an apparatus having inner layers supporting surface-mount components
Grant 5,659,953 - Crane, Jr. , et al. August 26, 1
1997-08-26
Electrical interconnect system having insulative shrouds for preventing mismating
Grant 5,637,019 - Crane, Jr. , et al. June 10, 1
1997-06-10
Computer cabinet with extending speakers
Grant D377,009 - Crane, Jr. , et al. December 31, 1
1996-12-31
Computer with two fans and two air circulation areas
Grant 5,576,931 - Crane, Jr. , et al. November 19, 1
1996-11-19
Apparatus having inner layers supporting surface-mount components
Grant 5,543,586 - Crane, Jr. , et al. August 6, 1
1996-08-06
Semiconductor chip carrier affording a high-density external interface
Grant 5,541,449 - Crane, Jr. , et al. July 30, 1
1996-07-30
Computer cabinet
Grant D369,923 - Crane, Jr. , et al. May 21, 1
1996-05-21
Computer cabinet
Grant D363,707 - Crane, Jr. , et al. October 31, 1
1995-10-31
Company Registrations

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