Pan; Yi-Hsiu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pan; Yi-Hsiu.The latest application filed is for "conductive polymer composite material and capacitor".
- Pan; Yi-Hsiu - Hsinchu County TW
- Pan; Yi-Hsiu - Nantou County TW
- - Nantou County TW
| Patent | Date |
|---|---|
| Conductive polymer composite material and capacitor Grant 10,790,072 - Du , et al. September 29, 2 | 2020-09-29 |
| Conductive Polymer Composite Material And Capacitor App 20200043628 - Du; Yi-Chang ; et al. | 2020-02-06 |
| Decoupling device with three-dimensional lead frame and fabricating method thereof Grant 9,214,284 - Pan , et al. December 15, 2 | 2015-12-15 |
| Decoupling device including a plurality of capacitor unit arrayed in a same plane Grant 9,058,933 - Cheng , et al. June 16, 2 | 2015-06-16 |
| Decoupling device and fabricating method thereof Grant 08922976 - | 2014-12-30 |
| Decoupling device and fabricating method thereof Grant 8,922,976 - Pan , et al. December 30, 2 | 2014-12-30 |
| Decoupling Device App 20140233158 - Cheng; Cheng-Liang ; et al. | 2014-08-21 |
| Solid electrolytic capacitor Grant 8,773,844 - Cheng , et al. July 8, 2 | 2014-07-08 |
| Decoupling Device With Three-dimensional Lead Frame And Fabricating Method Thereof App 20140071591 - Pan; Yi-Hsiu ; et al. | 2014-03-13 |
| Decoupling Device And Fabricating Method Thereof App 20130120903 - Pan; Yi-Hsiu ; et al. | 2013-05-16 |
| Decoupling Device App 20120162852 - Cheng; Cheng-Liang ; et al. | 2012-06-28 |
| Solid electrolytic capacitor and lead frame thereof Grant 7,447,000 - Cheng , et al. November 4, 2 | 2008-11-04 |
| Solid Electrolytic Capacitor And Lead Frame Thereof App 20080158782 - Cheng; Cheng-Liang ; et al. | 2008-07-03 |
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