Pan; Sheng-Liang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pan; Sheng-Liang.The latest application filed is for "semiconductor device and method".

Company Profile

16.39.32

Pan; Sheng-Liang - Hsinchu TW
Pan; Sheng-Liang - Hsinchu City TW
Pan; Sheng-Liang - Hsin-Chu TW
Pan, Sheng-Liang - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device and Method App 20220293741 - Wang; Po-Chuan ; et al.	2022-09-15
DC bias in plasma process Grant 11,404,245 - Pan , et al. August 2, 2	2022-08-02
Tuning Threshold Voltage Through Meta Stable Plasma Treatment App 20220139712 - Wu; Shao-Jyun ; et al.	2022-05-05
Interconnect Structure for Semiconductor Devices App 20220102138 - Wang; Po-Chuan ; et al.	2022-03-31
Tuning threshold voltage through meta stable plasma treatment Grant 11,239,083 - Wu , et al. February 1, 2	2022-02-01
Semiconductor Device and Method App 20210358811 - Wu; Shao-Jyun ; et al.	2021-11-18
Fin Field-effect Transistor And Method Of Forming The Same App 20210359104 - Pan; Sheng-Liang ; et al.	2021-11-18
Layer for side wall passivation Grant 11,121,025 - Hsu , et al. September 14, 2	2021-09-14
Semiconductor device and method Grant 11,081,396 - Wu , et al. August 3, 2	2021-08-03
Fin Field-Effect Transistor Device and Method App 20210104443 - Wu; Shao-Jyun ; et al.	2021-04-08
Semiconductor Device and Method App 20210082768 - Wu; Shao-Jyun ; et al.	2021-03-18
Fin field-effect transistor device and method Grant 10,872,826 - Wu , et al. December 22, 2	2020-12-22
Metal Contacts on Metal Gates and Methods Thereof App 20200388504 - Chang; Pang-Sheng ; et al.	2020-12-10
Shared Contact Structure and Methods for Forming the Same App 20200381298 - Hsu; Leo ; et al.	2020-12-03
Tuning Threshold Voltage Through Meta Stable Plasma Treatment App 20200294805 - Wu; Shao-Jyun ; et al.	2020-09-17
Metal contacts on metal gates and methods thereof Grant 10,755,945 - Chang , et al. A	2020-08-25
Shared contact structure and methods for forming the same Grant 10,755,978 - Hsu , et al. A	2020-08-25
Fin Field-Effect Transistor Device and Method App 20200135588 - Wu; Shao-Jyun ; et al.	2020-04-30
Layer for Side Wall Passivation App 20200105586 - Hsu; Yun-Chang ; et al.	2020-04-02
Dry Ashing by Secondary Excitation App 20200098588 - Kuo; Jack Kuo-Ping ; et al.	2020-03-26
Shared Contact Structure and Methods for Forming the Same App 20200090999 - Hsu; Leo ; et al.	2020-03-19
Metal Contacts on Metal Gates and Methods Thereof App 20200020541 - Chang; Pang-Sheng ; et al.	2020-01-16
Tuning threshold voltage through meta stable plasma treatment Grant 10,535,524 - Wu , et al. Ja	2020-01-14
Dry ashing by secondary excitation Grant 10,510,553 - Kuo , et al. Dec	2019-12-17
Shared contact structure and methods for forming the same Grant 10,510,600 - Hsu , et al. Dec	2019-12-17
Dry Ashing by Secondary Excitation App 20190371619 - Kuo; Jack Kuo-Ping ; et al.	2019-12-05
DC Bias in Plasma Process App 20190267211 - Pan; Sheng-Liang ; et al.	2019-08-29
Method and system for patterning alignment marks on a transparent substrate Grant 7,838,386 - Jang , et al. November 23, 2	2010-11-23
Method and system for wafer backside alignment Grant 7,611,960 - Liu , et al. November 3, 2	2009-11-03
Method And System For Patterning Alignment Marks On A Transparent Substrate App 20090098283 - JANG; Ruei-Hung ; et al.	2009-04-16
Method and system for patterning alignment marks on a transparent substrate Grant 7,450,296 - Jang , et al. November 11, 2	2008-11-11
Methods For Patterning Indium Tin Oxide Films App 20080061030 - Liu; Sheng-Chieh ; et al.	2008-03-13
Method and system for wafer backside alignment App 20070249137 - Liu; Sheng-Chieh ; et al.	2007-10-25
Method and system for patterning alignment marks on a transparent substrate App 20070177244 - Jang; Ruei-Hung ; et al.	2007-08-02
Spacer fabrication process for manufacturing reflective stealth mirrors and other MEMS devices Grant 7,180,651 - Wu , et al. February 20, 2	2007-02-20
H20 Plasma And H20 Vapor Methods For Releasing Charges App 20060199393 - Lee; Yuan-Bang ; et al.	2006-09-07
Photo resist stripping and de-charge method for metal post etching to prevent metal corrosion App 20060175290 - Lee; Yuan-Bang ; et al.	2006-08-10
Material to improve image sensor yield during wafer sawing Grant 7,071,032 - Hsu , et al. July 4, 2	2006-07-04
High transmittance overcoat for microlens arrays in semiconductor color imagers Grant 7,009,772 - Hsiao , et al. March 7, 2	2006-03-07
Spacer fabrication process for manufacturing reflective stealth mirrors and other MEMS devices App 20060001945 - Wu; Shan-Hua ; et al.	2006-01-05
Method and apparatus for measuring gripping strength of a vacuum wand Grant 6,971,270 - Jang , et al. December 6, 2	2005-12-06
Toxic waste receptacle App 20050230407 - Fang, Chun-Li ; et al.	2005-10-20
Method and apparatus for measuring gripping strength of a vacuum wand App 20050183510 - Jang, Ruei-Hung ; et al.	2005-08-25
Method to enhance the adhesion between dry film and seed metal Grant 6,926,818 - Lin , et al. August 9, 2	2005-08-09
Photoresist stripper using nitrogen bubbler Grant 6,911,097 - Chen , et al. June 28, 2	2005-06-28
Method to improve passivation openings by reflow of photoresist to eliminate tape residue Grant 6,878,642 - Hsu , et al. April 12, 2	2005-04-12
High transmittance overcoat for microlens arrays in semiconductor color imagers App 20050041296 - Hsiao, Yu-Kung ; et al.	2005-02-24
Method for fabricating microelectronic product with attenuated bond pad corrosion Grant 6,849,533 - Chang , et al. February 1, 2	2005-02-01
High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagers Grant 6,821,810 - Hsiao , et al. November 23, 2	2004-11-23
Method for fabricating microelectronic product with attenuated bond pad corrosion App 20040147105 - Chang, Chih-Kung ; et al.	2004-07-29
Material to improve CMOS image sensor yield during wafer sawing Grant 6,759,276 - Hsu , et al. July 6, 2	2004-07-06
Bump reflow method by inert gas plasma Grant 6,712,260 - Kuo , et al. March 30, 2	2004-03-30
Novel material to improve image sensor yield during wafer sawing App 20040023470 - Hsu, Hung-Jen ; et al.	2004-02-05
Plasma etch method for forming uniform linewidth residue free patterned composite silicon containing dielectric layer/silicon stack layer Grant 6,686,292 - Yang , et al. February 3, 2	2004-02-03
Method for forming crack resistant planarizing layer within microelectronic fabrication Grant 6,660,641 - Kuo , et al. December 9, 2	2003-12-09
Method and apparatus for thick film photoresist stripping App 20030211427 - Tseng, Wen-Hsiang ; et al.	2003-11-13
Selective electroplating method employing annular edge ring cathode electrode contact Grant 6,638,688 - Ching , et al. October 28, 2	2003-10-28
Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist Grant 6,623,912 - Ching , et al. September 23, 2	2003-09-23
Method of making a bump on a substrate using multiple photoresist layers Grant 6,586,322 - Chiu , et al. July 1, 2	2003-07-01
Method Of Making A Bump On A Substrate Using Multiple Photoresist Layers App 20030119300 - Chiu, Chih-Cheng ; et al.	2003-06-26
Method for forming micro lens structures Grant 6,582,988 - Hsiao , et al. June 24, 2	2003-06-24
Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process Grant 6,495,813 - Fan , et al. December 17, 2	2002-12-17
Method for making long focal length micro-lens for color filters Grant 6,417,022 - Hsiao , et al. July 9, 2	2002-07-09
Selective electroplating method employing annular edge ring cathode electrode contact App 20020064729 - Ching, Kai-Ming ; et al.	2002-05-30
High efficiency color filter process to improve color balance in semiconductor array imaging devices Grant 6,395,576 - Chang , et al. May 28, 2	2002-05-28
Method of reducing the roughness of a gate insulator layer after exposure of the gate insulator layer to a threshold voltage implantation procedure Grant 6,281,140 - Chen , et al. August 28, 2	2001-08-28
High efficiency color filter process for semiconductor array imaging devices Grant 6,274,917 - Fan , et al. August 14, 2	2001-08-14
High efficiency color filter process for semiconductor array imaging devices Grant 6,171,885 - Fan , et al. January 9, 2	2001-01-09
Method for cleaning metal precipitates in semiconductor processes Grant 6,103,633 - Shen , et al. August 15, 2	2000-08-15
Insitu contact descum for self-aligned contact process Grant 5,880,019 - Hsieh , et al. March 9, 1	1999-03-09
Anti-corrosion etch process for etching metal interconnections extending over and within contact openings Grant 5,776,832 - Hsieh , et al. July 7, 1	1998-07-07

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