PAN; Kuo Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for PAN; Kuo Lung.The latest application filed is for "chip package structure including a silicon substrate interposer and methods for forming the same".
Company Profile
24.35.46
- PAN; Kuo Lung - Zhunan Township TW
- Pan; Kuo-Lung - Hsinchu TW
- Pan; Kuo-Lung - Hsinchu city TW
- Pan; Kuo Lung - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| Chip Package Structure Including A Silicon Substrate Interposer And Methods For Forming The Same App 20220302003 - PAN; Kuo Lung ; et al. | 2022-09-22 |
| Package structure Grant 11,444,002 - Lai , et al. September 13, 2 | 2022-09-13 |
| Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure Grant 11,424,213 - Chang , et al. August 23, 2 | 2022-08-23 |
| Package Structure And Manufacturing Method Of Package Structure Thereof App 20220262758 - Teng; Po-Yuan ; et al. | 2022-08-18 |
| Integrated Fan-Out Packages and Methods of Forming the Same App 20220246590 - Yu; Chen-Hua ; et al. | 2022-08-04 |
| Package structure and manufacturing method of package structure thereof Grant 11,355,466 - Teng , et al. June 7, 2 | 2022-06-07 |
| Package Structure And Method Manufacturing The Same App 20220157689 - Chen; Shih-Wei ; et al. | 2022-05-19 |
| Package structure and method of forming the same Grant 11,322,421 - Chang , et al. May 3, 2 | 2022-05-03 |
| Integrated fan-out packages and methods of forming the same Grant 11,309,294 - Yu , et al. April 19, 2 | 2022-04-19 |
| Chip Package And Method Of Forming The Same App 20220102283 - Pan; Kuo-Lung ; et al. | 2022-03-31 |
| Semiconductor Structure And Method Of Fabricating The Same App 20220077102 - Chang; Mao-Yen ; et al. | 2022-03-10 |
| Package Structure App 20220037228 - Lai; Yu-Chia ; et al. | 2022-02-03 |
| Package structure and method of manufacturing the same Grant 11,239,135 - Chen , et al. February 1, 2 | 2022-02-01 |
| Package Structure And Method Of Forming The Same App 20220013422 - Chang; Mao-Yen ; et al. | 2022-01-13 |
| Packages with Thick RDLs and Thin RDLs Stacked Alternatingly App 20210398905 - Teng; Po-Yuan ; et al. | 2021-12-23 |
| Segregated Power and Ground Design for Yield Improvement App 20210391270 - Chun; Shu-Rong ; et al. | 2021-12-16 |
| Chip package and method of forming the same Grant 11,201,118 - Pan , et al. December 14, 2 | 2021-12-14 |
| Integrated circuit package and method Grant 11,183,487 - Lai , et al. November 23, 2 | 2021-11-23 |
| Semiconductor Package and Method App 20210327806 - Pan; Kuo Lung ; et al. | 2021-10-21 |
| Semicondcutor Package And Manufacturing Method Of Semicondcutor Package App 20210305212 - Hsieh; Wei-Kang ; et al. | 2021-09-30 |
| Integrated fan-out package Grant 11,121,070 - Chun , et al. September 14, 2 | 2021-09-14 |
| Segregated power and ground design for yield improvement Grant 11,107,771 - Chun , et al. August 31, 2 | 2021-08-31 |
| Integrated Circuit Package and Method App 20210265228 - Chun; Shu-Rong ; et al. | 2021-08-26 |
| Package Structure And Manufacturing Method Of Package Structure Thereof App 20210242159 - Teng; Po-Yuan ; et al. | 2021-08-05 |
| Integrated Circuit Package and Method App 20210233835 - Lai; Chi-Hui ; et al. | 2021-07-29 |
| Segregated Power and Ground Design for Yield Improvement App 20210202391 - Chun; Shu-Rong ; et al. | 2021-07-01 |
| Semiconductor package and method Grant 11,049,805 - Pan , et al. June 29, 2 | 2021-06-29 |
| Semiconductor package and manufacturing method of semiconductor package Grant 11,004,827 - Hsieh , et al. May 11, 2 | 2021-05-11 |
| Integrated circuit package and method Grant 11,004,758 - Chun , et al. May 11, 2 | 2021-05-11 |
| Integrated circuit package and method Grant 10,978,382 - Lai , et al. April 13, 2 | 2021-04-13 |
| Multi-Chip Semiconductor Package App 20210091059 - Lai; Yu-Chia ; et al. | 2021-03-25 |
| Bonding Passive Devices on Active Device Dies to Form 3D Packages App 20210066242 - Yu; Chen-Hua ; et al. | 2021-03-04 |
| Package Structure And Method Of Manufacturing The Same App 20210020538 - Chen; Shih-Wei ; et al. | 2021-01-21 |
| Integrated Circuit Package and Method App 20200395257 - Chun; Shu-Rong ; et al. | 2020-12-17 |
| Dual-sided integrated fan-out package Grant 10,861,823 - Pan , et al. December 8, 2 | 2020-12-08 |
| Multi-chip semiconductor package Grant 10,847,505 - Lai , et al. November 24, 2 | 2020-11-24 |
| Chip package with fan-out structure Grant 10,840,111 - Chen , et al. November 17, 2 | 2020-11-17 |
| Chip Package And Method Of Forming The Same App 20200279784 - Pan; Kuo-Lung ; et al. | 2020-09-03 |
| Integrated Fan-out Package And Method Of Forming Same App 20200251407 - Kind Code | 2020-08-06 |
| Integrated Circuit Package and Method App 20200243429 - Lai; Chi-Hui ; et al. | 2020-07-30 |
| Integrated Circuit Package and Method App 20200212018 - Lai; Chi-Hui ; et al. | 2020-07-02 |
| Integrated Circuit Package and Method App 20200211922 - Chun; Shu-Rong ; et al. | 2020-07-02 |
| Chip package and method of forming the same Grant 10,658,258 - Pan , et al. | 2020-05-19 |
| Semicondcutor Package And Manufacturing Method Of Semicondcutor Package App 20200091114 - Hsieh; Wei Kang ; et al. | 2020-03-19 |
| Integrated Fan-Out Packages and Methods of Forming the Same App 20200075562 - Yu; Chen-Hua ; et al. | 2020-03-05 |
| Semiconductor Package and Method App 20200006220 - Pan; Kuo Lung ; et al. | 2020-01-02 |
| Semiconductor packages and methods of forming the same Grant 10,461,023 - Chang , et al. Oc | 2019-10-29 |
| Multi-Chip Semiconductor Package App 20190312018 - Lai; Yu-Chia ; et al. | 2019-10-10 |
| Semiconductor Packages And Methods Of Forming The Same App 20190131223 - Chang; Mao-Yen ; et al. | 2019-05-02 |
| Dual-Sided Integrated Fan-Out Package App 20190123021 - Pan; Kuo Lung ; et al. | 2019-04-25 |
| Dual-sided integrated fan-out package Grant 10,153,249 - Pan , et al. Dec | 2018-12-11 |
| Warpage control of semiconductor die package Grant 10,134,706 - Pan , et al. November 20, 2 | 2018-11-20 |
| Integrated circuit package and method of forming same Grant 10,125,014 - Pan , et al. November 13, 2 | 2018-11-13 |
| Chip Package With Fan-out Structure App 20180233382 - CHEN; Shing-Chao ; et al. | 2018-08-16 |
| Integrated Circuit Package and Method of Forming Same App 20180111827 - Pan; Kuo Lung ; et al. | 2018-04-26 |
| Structure and formation method of chip package with fan-out structure Grant 9,947,552 - Chen , et al. April 17, 2 | 2018-04-17 |
| Hybrid interconnect for chip stacking Grant 9,935,081 - Pan , et al. April 3, 2 | 2018-04-03 |
| Integrated circuit package and method of forming same Grant 9,850,126 - Pan , et al. December 26, 2 | 2017-12-26 |
| Packaging device having plural microstructures disposed proximate to die mounting region Grant 9,837,346 - Pan , et al. December 5, 2 | 2017-12-05 |
| Warpage Control of Semiconductor Die Package App 20170345788 - Pan; Kuo Lung ; et al. | 2017-11-30 |
| Structure And Formation Method Of Chip Package With Fan-out Structure App 20170316957 - CHEN; Shing-Chao ; et al. | 2017-11-02 |
| Warpage control of semiconductor die package Grant 9,773,749 - Pan , et al. September 26, 2 | 2017-09-26 |
| Chip packages and methods of manufacture thereof Grant 9,735,130 - Pan , et al. August 15, 2 | 2017-08-15 |
| Dual-Sided Integrated Fan-Out Package App 20170213808 - Pan; Kuo Lung ; et al. | 2017-07-27 |
| Integrated Circuit Package and Method of Forming Same App 20170190572 - Pan; Kuo Lung ; et al. | 2017-07-06 |
| Packaging Device Having Plural Microstructures Disposed Proximate to Die Mounting Region App 20170186681 - Pan; Kuo Lung ; et al. | 2017-06-29 |
| Semiconductor device Grant 9,666,530 - Chen , et al. May 30, 2 | 2017-05-30 |
| Dual-sided integrated fan-out package Grant 9,620,465 - Pan , et al. April 11, 2 | 2017-04-11 |
| Packaging device having plural microstructures disposed proximate to die mounting region Grant 9,607,959 - Pan , et al. March 28, 2 | 2017-03-28 |
| Warpage Control of Semiconductor Die Package App 20170069594 - Pan; Kuo Lung ; et al. | 2017-03-09 |
| Warpage control of semiconductor die package Grant 9,508,674 - Pan , et al. November 29, 2 | 2016-11-29 |
| Chip Packages And Methods Of Manufacture Thereof App 20160064355 - Pan; Kuo Lung ; et al. | 2016-03-03 |
| Packaging Devices, Packaged Semiconductor Devices, and Packaging Methods App 20160064348 - Pan; Kuo Lung ; et al. | 2016-03-03 |
| Hybrid Interconnect for Chip Stacking App 20160056125 - Pan; Kuo Lung ; et al. | 2016-02-25 |
| Peripheral electrical connection of package on package Grant 9,070,667 - Hsiao , et al. June 30, 2 | 2015-06-30 |
| Packaging methods and packaged devices Grant 9,059,107 - Pan , et al. June 16, 2 | 2015-06-16 |
| Peripheral Electrical Connection of Package on Package App 20140239507 - Hsiao; Ching-Wen ; et al. | 2014-08-28 |
| Warpage Control of Semiconductor Die Package App 20140131858 - Pan; Kuo Lung ; et al. | 2014-05-15 |
| Packaging Methods and Packaged Devices App 20140070403 - Pan; Kuo Lung ; et al. | 2014-03-13 |
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