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Patent applications and USPTO patent grants for Pan; Chi-Liang.The latest application filed is for "semiconductor package with an internal heat sink and method for manufacturing the same".
Patent | Date |
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Semiconductor Package With An Internal Heat Sink And Method For Manufacturing The Same App 20200312734 - Su; Ting-Feng ;   et al. | 2020-10-01 |
Semiconductor package and manufacturing method thereof Grant 10,276,545 - Huang , et al. | 2019-04-30 |
Chip structure having redistribution layer Grant 10,177,077 - Pan , et al. J | 2019-01-08 |
Chip Structure Having Redistribution Layer App 20180301396 - Pan; Chi-Liang ;   et al. | 2018-10-18 |
ESD protection structure Grant 7,894,172 - Pan , et al. February 22, 2 | 2011-02-22 |
ESD protection substrate and integrated circuit utilizing the same Grant 7,649,723 - Chiu , et al. January 19, 2 | 2010-01-19 |
Esd Protection Structure App 20090180225 - Pan; Chi-Liang ;   et al. | 2009-07-16 |
Esd Protection Substrate And Integrated Circuit Utilizing The Same App 20090097175 - Chiu; Chen-Hsuan ;   et al. | 2009-04-16 |
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