Pan; Chi-Liang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pan; Chi-Liang.The latest application filed is for "semiconductor package with an internal heat sink and method for manufacturing the same".
- Pan; Chi-Liang - Hukou Township TW
- Pan; Chi-Liang - Hsinchu County TW
- Pan; Chi-Liang - Keelung TW
- Pan; Chi-Liang - Keelung City TW
| Patent | Date |
|---|---|
| Semiconductor Package With An Internal Heat Sink And Method For Manufacturing The Same App 20200312734 - Su; Ting-Feng ; et al. | 2020-10-01 |
| Semiconductor package and manufacturing method thereof Grant 10,276,545 - Huang , et al. | 2019-04-30 |
| Chip structure having redistribution layer Grant 10,177,077 - Pan , et al. J | 2019-01-08 |
| Chip Structure Having Redistribution Layer App 20180301396 - Pan; Chi-Liang ; et al. | 2018-10-18 |
| ESD protection structure Grant 7,894,172 - Pan , et al. February 22, 2 | 2011-02-22 |
| ESD protection substrate and integrated circuit utilizing the same Grant 7,649,723 - Chiu , et al. January 19, 2 | 2010-01-19 |
| Esd Protection Structure App 20090180225 - Pan; Chi-Liang ; et al. | 2009-07-16 |
| Esd Protection Substrate And Integrated Circuit Utilizing The Same App 20090097175 - Chiu; Chen-Hsuan ; et al. | 2009-04-16 |
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