loadpatents
name:-0.015021085739136
name:-0.010838985443115
name:-0.0040428638458252
PAN; Binghua Patent Filings

PAN; Binghua

Patent Applications and Registrations

Patent applications and USPTO patent grants for PAN; Binghua.The latest application filed is for "electronic power package and heat sink/cold rail arrangement".

Company Profile
3.7.11
  • PAN; Binghua - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic Power Package And Heat Sink/cold Rail Arrangement
App 20220068753 - PAN; Binghua ;   et al.
2022-03-03
Object sensor assembly including stereoscopic cameras and range finders
Grant 10,830,887 - Low , et al. November 10, 2
2020-11-10
Object Sensor Assembly Including Stereoscopic Cameras And Range Finders
App 20190227168 - Low; Yew Kwang ;   et al.
2019-07-25
LIDAR device with heated cover useful for automated vehicles
Grant 10,351,103 - Yeo , et al. July 16, 2
2019-07-16
Lidar Device With Heated Cover Useful For Automated Vehicles
App 20190100167 - Yeo; Kok Wee ;   et al.
2019-04-04
Molded Camera
App 20160006908 - PAN; BINGHUA ;   et al.
2016-01-07
Ball grid array packaged camera device soldered to a substrate
Grant 9,231,124 - Pan , et al. January 5, 2
2016-01-05
Ball Grid Array Packaged Camera Device Soldered To A Substrate
App 20150084150 - PAN; BINGHUA ;   et al.
2015-03-26
Stripline To Waveguide Perpendicular Transition
App 20110037530 - Mangalahgari; Sankara N. ;   et al.
2011-02-17
Carbon nanotube via interconnect
Grant 7,453,154 - Teo , et al. November 18, 2
2008-11-18
Optical information processing circuit assembly
Grant 7,324,715 - Tan , et al. January 29, 2
2008-01-29
Electronic module with light-blocking features
Grant 7,294,827 - Tan , et al. November 13, 2
2007-11-13
Carbon nanotube via interconnect
App 20070228926 - Teo; Kiat Choon ;   et al.
2007-10-04
Method of forming a composite standoff on a circuit board
App 20070119911 - Chan; Su Liang ;   et al.
2007-05-31
Discrete electronic component arrangement including anchoring, thermally conductive pad
Grant 7,148,554 - Nah , et al. December 12, 2
2006-12-12
Discrete Electronic Component Arrangement Including Anchoring, Thermally Conductive Pad
App 20060131732 - Nah; Chih Kai ;   et al.
2006-06-22
Electronic Module With Light-blocking Features
App 20060061889 - Tan; Tech Tiong ;   et al.
2006-03-23
Optical information processing circuit assembly
App 20040114851 - Tan, Tecktiong ;   et al.
2004-06-17

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