Pamarthy; Sharma V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pamarthy; Sharma V..The latest application filed is for "method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor".

Company Profile

0.7.9

Pamarthy; Sharma V. - Fremont CA
Pamarthy; Sharma V. - Hayward CA
Pamarthy; Sharma V - Hayward CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor Grant 9,070,633 - Nangoy , et al. June 30, 2	2015-06-30
Method And Apparatus For High Efficiency Gas Dissociation In Inductive Coupled Plasma Reactor App 20140256148 - NANGOY; Roy C. ; et al.	2014-09-11
Method and apparatus for high efficiency gas dissociation in inductive couple plasma reactor Grant 8,753,474 - Nangoy , et al. June 17, 2	2014-06-17
Method of forming a deep trench in a substrate Grant 8,158,522 - Sirajuddin , et al. April 17, 2	2012-04-17
Method Of Filling A Deep Trench In A Substrate App 20110217832 - Raorane; Digvijay ; et al.	2011-09-08
Method Of Forming A Deep Trench In A Substrate App 20110201205 - Sirajuddin; Khalid M. ; et al.	2011-08-18
Method And Apparatus For High Efficiency Gas Dissociation In Inductive Couple Plasma Reactor App 20110073564 - Nangoy; Roy C. ; et al.	2011-03-31
Method And Apparatus Of A Substrate Etching System And Process App 20090272717 - Pamarthy; Sharma V. ; et al.	2009-11-05
Etching multi-shaped openings in silicon Grant 6,979,652 - Khan , et al. December 27, 2	2005-12-27
Method of releasing devices from a substrate Grant 6,905,616 - Kumar , et al. June 14, 2	2005-06-14
Method for etching high-aspect-ratio features Grant 6,897,155 - Kumar , et al. May 24, 2	2005-05-24
Method of releasing devices from a substrate App 20040173575 - Kumar, Ajay ; et al.	2004-09-09
Method for etching high-aspect-ratio features App 20040033697 - Kumar, Ajay ; et al.	2004-02-19
Etching multi-shaped openings in silicon App 20030189024 - Khan, Anisul ; et al.	2003-10-09
Method and apparatus for providing modulated bias power to a plasma etch reactor App 20030153195 - Weikmann, Elisabeth ; et al.	2003-08-14

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