Palmer, William Devereux
Patent Applications and Registrations
Patent applications and USPTO patent grants for Palmer, William Devereux.The latest application filed is for "through-via vertical interconnects, through-via heat sinks and associated fabrication methods".
- Palmer, William Devereux - Durham NC
| Patent | Date |
|---|---|
| Through-via vertical interconnects, through-via heat sinks and associated fabrication methods App 20040201095 - Palmer, William Devereux ; et al. | 2004-10-14 |
| Flexible optoelectronic circuit and associated method Grant 6,763,156 - Palmer , et al. July 13, 2 | 2004-07-13 |
| Flexible optoelectronic circuit and associated method App 20030231819 - Palmer, William Devereux ; et al. | 2003-12-18 |
| Through-via vertical interconnects, through-via heat sinks and associated fabrication methods App 20030038344 - Palmer, William Devereux ; et al. | 2003-02-27 |
| Closed-loop cold cathode current regulator Grant 6,492,781 - Palmer , et al. December 10, 2 | 2002-12-10 |
| Closed-loop cold cathode current regulator App 20020130625 - Palmer, William Devereux ; et al. | 2002-09-19 |
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