Palmateer; Paul H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Palmateer; Paul H..The latest application filed is for "sealing and stress relief layers and use thereof".
- Palmateer; Paul H. - Wappingers Falls NY
| Patent | Date |
|---|---|
| Sealing and stress relief layers and use thereof Grant 4,880,684 - Boss , et al. November 14, 1 | 1989-11-14 |
| Bonding of pure metal films to ceramics Grant 4,764,341 - Flaitz , et al. August 16, 1 | 1988-08-16 |
| High melting point copper-gold-tin brazing alloy for chip carriers Grant 4,634,638 - Ainslie , et al. * January 6, 1 | 1987-01-06 |
| High melting point process for Au:Sn:80:20 brazing alloy for chip carriers Grant 4,418,857 - Ainslie , et al. December 6, 1 | 1983-12-06 |
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