| Patent | Date |
|---|
Semiconductor package and method of manufacturing a semiconductor package
Grant 11,444,017 - Yuferev , et al. September 13, 2 | 2022-09-13 |
Forming a lock structure in a semiconductor chip pad
Grant 11,430,669 - Palm August 30, 2 | 2022-08-30 |
Chip Assembling On Adhesion Layer Or Dielectric Layer, Extending Beyond Chip, On Substrate
App 20220238481 - PALM; Petteri ; et al. | 2022-07-28 |
Method Of Fabricating A Semiconductor Package
App 20220230941 - Dinkel; Markus ; et al. | 2022-07-21 |
Pre-packaged Chip, Method Of Manufacturing A Pre-packaged Chip, Semiconductor Package And Method Of Manufacturing A Semiconductor Package
App 20220230982 - Palm; Petteri ; et al. | 2022-07-21 |
Multiphase Inverter Apparatus Having Half-bridge Circuits And A Phase Output Lead For Each Half-bridge Circuit
App 20220224247 - Naeve; Tomasz ; et al. | 2022-07-14 |
Die package and method of forming a die package
Grant 11,373,944 - Palm June 28, 2 | 2022-06-28 |
Semiconductor package and method of manufacturing a semiconductor package
Grant 11,348,861 - Yuferev , et al. May 31, 2 | 2022-05-31 |
Stacked Transistor Chip Package With Source Coupling
App 20220122906 - YUFEREV; Sergey ; et al. | 2022-04-21 |
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
Grant 11,309,277 - Palm , et al. April 19, 2 | 2022-04-19 |
Semiconductor package and method of fabricating a semiconductor package
Grant 11,302,610 - Dinkel , et al. April 12, 2 | 2022-04-12 |
Multiphase inverter apparatus
Grant 11,303,222 - Naeve , et al. April 12, 2 | 2022-04-12 |
Semiconductor Module
App 20220108945 - Yuferev; Sergey ; et al. | 2022-04-07 |
Semiconductor Device Module Having Vertical Metallic Contacts And A Method For Fabricating The Same
App 20220102311 - Fuergut; Edward ; et al. | 2022-03-31 |
Semiconductor Device Package Comprising Side Walls Connected with Contact Pads of a Semiconductor Die
App 20220037240 - Palm; Petteri ; et al. | 2022-02-03 |
Circuit board structure and method for manufacturing a circuit board structure
App 20210392752 - Tuominen; Risto ; et al. | 2021-12-16 |
Electronic Module
App 20210321520 - Tuominen; Risto ; et al. | 2021-10-14 |
Circuit board structure and method for manufacturing a circuit board structure
Grant 11,134,572 - Tuominen , et al. September 28, 2 | 2021-09-28 |
Semiconductor Devices Including Parallel Electrically Conductive Layers
App 20210287964 - PALM; Petteri ; et al. | 2021-09-16 |
Semiconductor Packages And Methods Of Manufacturing Thereof
App 20210233823 - Cho; Eung San ; et al. | 2021-07-29 |
Semiconductor Package Having a Solderable Contact Pad Formed by a Load Terminal Bond Pad of a Power Semiconductor Die and Methods of Manufacturing Thereof
App 20210233837 - Cho; Eung San ; et al. | 2021-07-29 |
Space Efficient and Low Parasitic Half Bridge
App 20210225745 - Fehler; Robert ; et al. | 2021-07-22 |
Electronic module
Grant 11,071,207 - Tuominen , et al. July 20, 2 | 2021-07-20 |
Method of forming contacts to an embedded semiconductor die and related semiconductor packages
Grant 11,043,409 - Palm June 22, 2 | 2021-06-22 |
Device Including Semiconductor Chips And Method For Producing Such Device
App 20210151401 - Palm; Petteri ; et al. | 2021-05-20 |
Power Electronic Assembly and Method of Producing Thereof
App 20210127490 - Palm; Petteri ; et al. | 2021-04-29 |
Multiphase Inverter Apparatus
App 20210104957 - Naeve; Tomasz ; et al. | 2021-04-08 |
Methods Of Producing Inductor Modules And Power Semiconductor Systems Having Inductor Modules
App 20210036610 - Palm; Petteri ; et al. | 2021-02-04 |
Electronic module
App 20210037654 - Tuominen; Risto ; et al. | 2021-02-04 |
Device including semiconductor chips and method for producing such device
Grant 10,903,180 - Palm , et al. January 26, 2 | 2021-01-26 |
Chip Package and Method of Manufacturing a Chip Package
App 20210020458 - Palm; Petteri | 2021-01-21 |
Semiconductor Package and Method of Manufacturing a Semiconductor Package
App 20210005536 - Yuferev; Sergey ; et al. | 2021-01-07 |
Die Package and Method of Manufacturing a Die Package
App 20200402881 - Palm; Petteri ; et al. | 2020-12-24 |
Methods of manufacturing inductor modules and power semiconductor systems having inductor modules
Grant 10,833,583 - Palm , et al. November 10, 2 | 2020-11-10 |
Power stage device with carrier frame for power stage module and integrated inductor
Grant 10,818,646 - Palm , et al. October 27, 2 | 2020-10-27 |
Semiconductor package and method of manufacturing a semiconductor package
Grant 10,811,342 - Yuferev , et al. October 20, 2 | 2020-10-20 |
Chip Assembling On Adhesion Layer Or Dielectric Layer, Extending Beyond Chip, On Substrate
App 20200321309 - Palm; Petteri ; et al. | 2020-10-08 |
Electronic module
Grant 10,765,006 - Tuominen , et al. Sep | 2020-09-01 |
Die Package And Method Of Forming A Die Package
App 20200258830 - A1 | 2020-08-13 |
Power Stage Device with Carrier Frame for Power Stage Module and Integrated Inductor
App 20200258873 - A1 | 2020-08-13 |
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
Grant 10,734,351 - Palm , et al. | 2020-08-04 |
Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules
App 20200212798 - Palm; Petteri ; et al. | 2020-07-02 |
Die embedding
Grant 10,692,803 - Palm | 2020-06-23 |
Semiconductor Package and Method of Fabricating a Semiconductor Package
App 20200135619 - Dinkel; Markus ; et al. | 2020-04-30 |
Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules
Grant 10,601,314 - Palm , et al. | 2020-03-24 |
Semiconductor Package and Method of Manufacturing a Semiconductor Package
App 20200075484 - Yuferev; Sergey ; et al. | 2020-03-05 |
Method of Forming Contacts to an Embedded Semiconductor Die and Related Semiconductor Packages
App 20190273017 - Palm; Petteri | 2019-09-05 |
Semiconductor Package and Method of Manufacturing a Semiconductor Package
App 20190267309 - Yuferev; Sergey ; et al. | 2019-08-29 |
Power Semiconductor Systems Having Inductor Modules, and Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules
App 20190081562 - Palm; Petteri ; et al. | 2019-03-14 |
Electronic module with embedded jumper conductor
Grant 10,231,335 - Palm , et al. | 2019-03-12 |
Semiconductor modules with semiconductor dies bonded to a metal foil
Grant 10,192,849 - Palm , et al. Ja | 2019-01-29 |
Electronic module
App 20180376597 - Tuominen; Risto ; et al. | 2018-12-27 |
Chip Assembling On Adhesion Layer Or Dielectric Layer, Extending Beyond Chip, On Substrate
App 20180358326 - Palm; Petteri ; et al. | 2018-12-13 |
Manufacture of a circuit board and circuit board containing a component
Grant 10,085,347 - Tuominen , et al. September 25, 2 | 2018-09-25 |
Electronic module
Grant 10,085,345 - Tuominen , et al. September 25, 2 | 2018-09-25 |
Die Embedding
App 20180269146 - Palm; Petteri | 2018-09-20 |
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
Grant 10,056,348 - Palm , et al. August 21, 2 | 2018-08-21 |
Device Including Semiconductor Chips And Method For Producing Such Device
App 20180233469 - Palm; Petteri ; et al. | 2018-08-16 |
Device including semiconductor chips and method for producing such device
Grant 9,941,229 - Palm , et al. April 10, 2 | 2018-04-10 |
Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement
Grant 9,912,058 - Palm , et al. March 6, 2 | 2018-03-06 |
Circuit module and method of manufacturing the same
Grant 9,883,587 - Palm , et al. January 30, 2 | 2018-01-30 |
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
App 20170294403 - Palm; Petteri ; et al. | 2017-10-12 |
Redirecting solder material to visually inspectable package surface
App 20170278762 - KESSLER; Angela ; et al. | 2017-09-28 |
Electronic device package including metal blocks
Grant 9,768,037 - Palm , et al. September 19, 2 | 2017-09-19 |
Electronic component and methods of manufacturing the same
App 20170178993 - MEYER; Thorsten ; et al. | 2017-06-22 |
Method for manufacturing a circuit board structure
Grant 9,622,354 - Tuominen , et al. April 11, 2 | 2017-04-11 |
Semiconductor device and method for manufacturing a semiconductor device
Grant 9,613,930 - Palm April 4, 2 | 2017-04-04 |
Circuit board structure and method for manufacturing a circuit board structure
App 20170071061 - Tuominen; Risto ; et al. | 2017-03-09 |
Electronic component
Grant 9,553,051 - Palm , et al. January 24, 2 | 2017-01-24 |
Method for forming electronic components
Grant 9,530,752 - Nikitin , et al. December 27, 2 | 2016-12-27 |
Electronic Component
App 20160225717 - Palm; Petteri ; et al. | 2016-08-04 |
Circuit module and method of manufacturing the same
App 20160212855 - Palm; Petteri ; et al. | 2016-07-21 |
Method for manufacturing an electronic module and an electronic module
Grant 9,363,898 - Tuominen , et al. June 7, 2 | 2016-06-07 |
Circuit module and method of manufacturing the same
Grant 9,324,647 - Palm , et al. April 26, 2 | 2016-04-26 |
Hybrid Antenna, Antenna Arrangement And Method For Manufacturing An Antenna Arrangement
App 20160111787 - Palm; Petteri ; et al. | 2016-04-21 |
Semiconductor device including multiple semiconductor chips and a laminate
Grant 9,263,425 - Scharf , et al. February 16, 2 | 2016-02-16 |
Circuit module and method of manufacturing the same
App 20150348878 - Palm; Petteri ; et al. | 2015-12-03 |
Electronic Device Package Including Metal Blocks
App 20150332938 - Palm; Petteri ; et al. | 2015-11-19 |
Manufacture of a circuit board and circuit board containing a component
App 20150289379 - Tuominen; Risto ; et al. | 2015-10-08 |
Semiconductor Modules with Semiconductor Dies Bonded to a Metal Foil
App 20150228616 - Palm; Petteri ; et al. | 2015-08-13 |
Circuit module and method of manufacturing the same
Grant 9,107,324 - Palm , et al. August 11, 2 | 2015-08-11 |
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
App 20150221569 - PALM; Petteri ; et al. | 2015-08-06 |
Semiconductor Device Including Multiple Semiconductor Chips and a Laminate
App 20150162319 - Scharf; Thorsten ; et al. | 2015-06-11 |
Method for manufacturing an electronic module and an electronic module
App 20150163920 - Tuominen; Risto ; et al. | 2015-06-11 |
Electrically conductive frame on substrate for accommodating electronic chips
App 20150131247 - NIKITIN; Ivan ; et al. | 2015-05-14 |
Method For Manufacturing A Chip Arrangement, And Chip Arrangement
App 20150123255 - Palm; Petteri | 2015-05-07 |
Device Including Semiconductor Chips And Method For Producing Such Device
App 20150115475 - PALM; Petteri ; et al. | 2015-04-30 |
Semiconductor Device And Method For Manufacturing A Semiconductor Device
App 20150115458 - PALM; Petteri | 2015-04-30 |
Manufacture of a circuit board containing a component
Grant 8,984,746 - Tuominen , et al. March 24, 2 | 2015-03-24 |
Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier
Grant 8,956,918 - Palm February 17, 2 | 2015-02-17 |
Electronic Module
App 20150043177 - Tuominen; Risto ; et al. | 2015-02-12 |
Method For Manufacturing A Chip Arrangement, And A Chip Arrangement
App 20150041993 - Palm; Petteri | 2015-02-12 |
Electronic module with embedded jumper conductor
App 20140254107 - Palm; Petteri ; et al. | 2014-09-11 |
Single-layer component package
Grant 8,817,485 - Tuominen , et al. August 26, 2 | 2014-08-26 |
Method for manufacturing an electronic module and an electronic module
App 20140208588 - Tuominen; Risto ; et al. | 2014-07-31 |
Circuit module and method of manufacturing the same
App 20140210090 - Palm; Petteri ; et al. | 2014-07-31 |
Method For Manufacturing A Chip Arrangement, And Chip Arrangement
App 20140175624 - Palm; Petteri | 2014-06-26 |
Electronic module with embedded jumper conductor
Grant 8,735,735 - Palm , et al. May 27, 2 | 2014-05-27 |
Method for manufacturing an electronic module and an electronic module
Grant 8,704,359 - Tuominen , et al. April 22, 2 | 2014-04-22 |
Circuit module and method of manufacturing the same
Grant 8,699,233 - Palm , et al. April 15, 2 | 2014-04-15 |
Circuit board structure and method for manufacturing a circuit board structure
App 20140059851 - Tuominen; Risto ; et al. | 2014-03-06 |
Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component
Grant 8,631,566 - Palm , et al. January 21, 2 | 2014-01-21 |
Method for manufacturing a circuit board structure
Grant 8,581,109 - Tuominen , et al. November 12, 2 | 2013-11-12 |
Circuit board including an embedded component
Grant 8,487,194 - Tuominen , et al. July 16, 2 | 2013-07-16 |
Method of manufacturing a wiring board
Grant 8,286,341 - Palm , et al. October 16, 2 | 2012-10-16 |
Method for manufacturing a circuit board
Grant 8,240,033 - Tuominen , et al. August 14, 2 | 2012-08-14 |
Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
Grant 8,240,032 - Iihola , et al. August 14, 2 | 2012-08-14 |
Electronic module with vertical connector between conductor patterns
Grant 8,238,113 - Iihola , et al. August 7, 2 | 2012-08-07 |
Method for manufacturing a circuit board structure, and a circuit board structure
Grant 8,225,499 - Tuominen , et al. July 24, 2 | 2012-07-24 |
Electric module having a conductive pattern layer
Grant 8,222,723 - Tuominen , et al. July 17, 2 | 2012-07-17 |
Electronic Module With Vertical Connector Between Conductor Patterns
App 20120020044 - Iihola; Antti ; et al. | 2012-01-26 |
Electronic Module With Embedded Jumper Conductor
App 20120018203 - Palm; Petteri ; et al. | 2012-01-26 |
Heat conduction from an embedded component
Grant 8,076,586 - Tuominen , et al. December 13, 2 | 2011-12-13 |
Method For Manufacturing An Electronic Module And An Electronic Module
App 20110291293 - Tuominen; Risto ; et al. | 2011-12-01 |
Electronic module with a conductive-pattern layer and a method of manufacturing same
Grant 8,034,658 - Tuominen , et al. October 11, 2 | 2011-10-11 |
Circuit Module And Method Of Manufacturing The Same
App 20110061909 - Palm; Petteri ; et al. | 2011-03-17 |
Circuit Board Including An Embedded Component
App 20100202115 - TUOMINEN; Risto ; et al. | 2010-08-12 |
Electric Module
App 20100202114 - Tuominen; Risto ; et al. | 2010-08-12 |
Single-layer Component Package
App 20100103635 - TUOMINEN; Risto ; et al. | 2010-04-29 |
Electronic Module With A Conductive-pattern Layer And A Method Of Manufacturing Same
App 20100062568 - TUOMINEN; Risto ; et al. | 2010-03-11 |
Manufacture of a layer including a component
Grant 7,673,387 - Tuominen , et al. March 9, 2 | 2010-03-09 |
Circuit Board Structure Comprising An Electrical Component And A Method For Manufacturing A Circuit Board Structure Comprising An Electrical Component
App 20100046186 - Palm; Petteri ; et al. | 2010-02-25 |
Electronic module with a conductive-pattern layer and a method of manufacturing same
Grant 7,663,215 - Tuominen , et al. February 16, 2 | 2010-02-16 |
Electronic module
Grant 7,609,527 - Tuominen , et al. October 27, 2 | 2009-10-27 |
Wiring Board And Method For Manufacturing The Same
App 20090260866 - Palm; Petteri ; et al. | 2009-10-22 |
Manufacture Of A Circuit Board And Circuit Board Containing A Component
App 20090133251 - Tuominen; Risto ; et al. | 2009-05-28 |
Method For Manufacturing A Circuit Board Structure, And A Circuit Board Structure
App 20090014872 - Tuominen; Risto ; et al. | 2009-01-15 |
Manufacture of a Layer Including a Component
App 20080295326 - Tuominen; Risto ; et al. | 2008-12-04 |
Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer
App 20080261338 - Ilhola; Antti ; et al. | 2008-10-23 |
Circuit Board Structure and Method for Manufacturing a Circuit Board Structure
App 20080202801 - Tuominen; Risto ; et al. | 2008-08-28 |
Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure
App 20080196930 - Tuominen; Risto ; et al. | 2008-08-21 |
Electronic module
App 20080043441 - Tuominen; Risto ; et al. | 2008-02-21 |
Method for manufacturing an electronic module
Grant 7,299,546 - Tuominen , et al. November 27, 2 | 2007-11-27 |
Heat Conduction From an Embedded Component
App 20070227761 - Tuominen; Risto ; et al. | 2007-10-04 |
Method for manufacturing an electronic module, and an electronic module
App 20070131349 - Tuominen; Risto ; et al. | 2007-06-14 |
Method for manufacturing an electronic module and an electronic module
App 20060278967 - Tuominen; Risto ; et al. | 2006-12-14 |
Method for manufacturing an electronic module
App 20060218782 - Tuominen; Risto ; et al. | 2006-10-05 |
Method for manufacturing an electronic module, and an electronic module
App 20060076686 - Tuominen; Risto ; et al. | 2006-04-13 |
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