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Patent applications and USPTO patent grants for Palm; Gerhard.The latest application filed is for "method and apparatus for joining members for downhole and high temperature applications".
Patent | Date |
---|---|
Method for securing electronic components to a substrate Grant 8,662,377 - Palm March 4, 2 | 2014-03-04 |
Method and Apparatus for Joining Members for Downhole and High Temperature Applications App 20120292009 - Kahler; Julian ;   et al. | 2012-11-22 |
Method for fastening microtool components to objects App 20050277244 - Galster, Norbert ;   et al. | 2005-12-15 |
Method for securing electronic components to a substrate App 20050247760 - Palm, Gerhard | 2005-11-10 |
Power module with improved transient thermal impedance Grant 6,812,559 - Palm , et al. November 2, 2 | 2004-11-02 |
Power module with improved transient thermal impedance App 20040056346 - Palm, Gerhard ;   et al. | 2004-03-25 |
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