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Patent applications and USPTO patent grants for Palanisamy; Ponnuswamy.The latest application filed is for "low temperature co-fired ceramic-metal packaging technology".
Patent | Date |
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Low temperature co-fired ceramic-metal packaging technology Grant 6,713,862 - Palanisamy , et al. March 30, 2 | 2004-03-30 |
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology Grant 6,455,930 - Palanisamy , et al. September 24, 2 | 2002-09-24 |
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