| Patent | Date |
|---|
High Adhesion Resistive Composition
App 20220238261 - Palanisamy; Ponnusamy ; et al. | 2022-07-28 |
Conductive Thick Film Paste For Silicon Nitride And Other Substrates
App 20220225501 - Kumar; Umesh ; et al. | 2022-07-14 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
Grant RE42,542 - Palanisamy July 12, 2 | 2011-07-12 |
Thermal management in electronic displays
Grant RE41,914 - Palanisamy November 9, 2 | 2010-11-09 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
Grant RE41,669 - Palanisamy September 14, 2 | 2010-09-14 |
Woven electronic textile, yarn and article
Grant 7,592,276 - Hill , et al. September 22, 2 | 2009-09-22 |
Hearing aid with large diaphragm microphone element including a printed circuit board
App 20070121967 - Sjursen; Walter P. ; et al. | 2007-05-31 |
Hearing aid with large diaphragm microphone element including a printed circuit board
Grant 7,221,768 - Sjursen , et al. May 22, 2 | 2007-05-22 |
Hearing aid with large diaphragm microphone element including a printed circuit board
App 20060177083 - Sjursen; Walter P. ; et al. | 2006-08-10 |
Hearing aid with large diaphragm microphone element including a printed circuit board
Grant 7,003,127 - Sjursen , et al. February 21, 2 | 2006-02-21 |
Interconnecting large area display panels
Grant 7,002,562 - Palanisamy February 21, 2 | 2006-02-21 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
Grant 6,939,737 - Palanisamy September 6, 2 | 2005-09-06 |
Thermal management in electronic displays
Grant 6,914,379 - Palanisamy July 5, 2 | 2005-07-05 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
App 20050095878 - Palanisamy, Ponnusamy | 2005-05-05 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
Grant 6,849,935 - Palanisamy February 1, 2 | 2005-02-01 |
Facilitating the spread of encapsulant between surfaces of electronic devices
Grant 6,743,069 - Palanisamy June 1, 2 | 2004-06-01 |
Making interconnections to a non-flat surface
Grant 6,706,556 - Palanisamy , et al. March 16, 2 | 2004-03-16 |
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
App 20040016568 - Palanisamy, Ponnusamy | 2004-01-29 |
Woven electronic textile, yarn and article
App 20040009729 - Hill, Ian Gregory ; et al. | 2004-01-15 |
Solid oxide fuel cells and interconnectors
Grant 6,653,009 - Wang , et al. November 25, 2 | 2003-11-25 |
Thermal management in electronic displays
App 20030209977 - Palanisamy, Ponnusamy | 2003-11-13 |
Passivating organic light emitting devices
App 20030132702 - Palanisamy, Ponnusamy ; et al. | 2003-07-17 |
Solid oxide fuel cells and interconnectors
App 20030082434 - Wang, Conghua ; et al. | 2003-05-01 |
Making interconnections to a non-flat surface
App 20030057565 - Palanisamy, Ponnusamy ; et al. | 2003-03-27 |
Low temperature co-fired ceramic-metal packaging technology
App 20030034564 - Palanisamy, Ponnusamy ; et al. | 2003-02-20 |
Facilitating the spread of encapsulant between surfaces of elecronic devices
App 20030011302 - Palanisamy, Ponnusamy | 2003-01-16 |
Surface Mounting To An Irregular Surface
App 20030010807 - Matthies, Dennis L. ; et al. | 2003-01-16 |
Interconnecting large area display panels
App 20030011298 - Palanisamy, Ponnusamy | 2003-01-16 |
Making Interconnections To A Non-flat Surface
App 20030013286 - Palanisamy, Ponnusamy ; et al. | 2003-01-16 |
Passivating organic light emitting devices
App 20030011300 - Palanisamy, Ponnusamy ; et al. | 2003-01-16 |
Microphone assembly for hearing aid with JFET flip-chip buffer
App 20020090102 - Madaffari, Peter ; et al. | 2002-07-11 |
Microphone assembly for hearing aid with JFET flip-chip buffer
Grant 6,366,678 - Madaffari , et al. April 2, 2 | 2002-04-02 |
Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
Grant 5,395,679 - Myers , et al. March 7, 1 | 1995-03-07 |
Post-termination apparatus and process for thick film resistors of printed circuit boards
Grant 5,169,679 - Palanisamy December 8, 1 | 1992-12-08 |
Interface device for thermally coupling an integrated circuit to a heat sink
Grant 5,151,777 - Akin , et al. September 29, 1 | 1992-09-29 |
Method of achieving selective inhibition and control of adhesion in thick-film conductors
Grant 5,122,929 - Palanisamy , et al. June 16, 1 | 1992-06-16 |
Controlled adhesion conductor
Grant 5,121,298 - Sarma , et al. June 9, 1 | 1992-06-09 |
Moisture sensor and method of fabrication thereof
Grant 4,970,122 - Palanisamy November 13, 1 | 1990-11-13 |
Electrical conductors
Grant 4,939,022 - Palanisamy July 3, 1 | 1990-07-03 |
Method of fabrication a curved glass sheet with a conductive oxide coating
Grant 4,846,869 - Palanisamy July 11, 1 | 1989-07-11 |
Moisture sensor and method of fabrication thereof
Grant 4,797,605 - Palanisamy January 10, 1 | 1989-01-10 |
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