loadpatents
name:-0.0054829120635986
name:-0.0063679218292236
name:-0.0032351016998291
PAK; Jun So Patent Filings

PAK; Jun So

Patent Applications and Registrations

Patent applications and USPTO patent grants for PAK; Jun So.The latest application filed is for "semiconductor package and semiconductor device including the same".

Company Profile
2.4.4
  • PAK; Jun So - Seongnam-si KR
  • Pak; Jun So - Suwon-si KR
  • Pak; Jun-So - Daejeon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package And Semiconductor Device Including The Same
App 20220068870 - PAK; Jun So ;   et al.
2022-03-03
Semiconductor package
Grant 11,257,741 - Pu , et al. February 22, 2
2022-02-22
Stack packages
Grant 11,205,614 - Pak , et al. December 21, 2
2021-12-21
Method of modeling high speed channel in semiconductor package, method of designing semiconductor package using the same and method of manufacturing semiconductor package using the same
Grant 11,080,460 - Pu , et al. August 3, 2
2021-08-03
Method Of Modeling High Speed Channel In Semiconductor Package, Method Of Designing Semiconductor Package Using The Same And Method Of Manufacturing Semiconductor Package Using The Same
App 20210110096 - Pu; Bo ;   et al.
2021-04-15
Semiconductor Package
App 20200381347 - PU; Bo ;   et al.
2020-12-03
Test device, semiconductor device and testing method thereof
Grant 9,459,309 - Pak , et al. October 4, 2
2016-10-04
Test Device, Semiconductor Device And Testing Method Thereof
App 20140049284 - Pak; Jun-So ;   et al.
2014-02-20

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