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Semiconductor Device and Method
App 20220302116 - Wang; Chun-Chieh ; et al. | 2022-09-22 |
Semiconductor Device And Method
App 20220278197 - Wang; Chunchieh ; et al. | 2022-09-01 |
Gate structure, method of forming the same, and semiconductor device having the same
Grant 11,411,112 - Wang , et al. August 9, 2 | 2022-08-09 |
Semiconductor device and manufacturing method thereof
Grant 11,410,889 - Wang , et al. August 9, 2 | 2022-08-09 |
Semiconductor device and method
Grant 11,398,482 - Wang , et al. July 26, 2 | 2022-07-26 |
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20210343851 - WANG; Chun Chieh ; et al. | 2021-11-04 |
Contact Metallization Process
App 20210280462 - CHOU; Tien-Pei ; et al. | 2021-09-09 |
Methods for Forming Contact Plugs with Reduced Corrosion
App 20210257254 - Wang; Yu-Sheng ; et al. | 2021-08-19 |
Semiconductor Device And Manufacturing Method Thereof
App 20210202327 - WANG; Chun-Chieh ; et al. | 2021-07-01 |
Semiconductor Structure With Source/drain Multi-layer Structure And Method For Forming The Same
App 20210143278 - WANG; Chun-Chieh ; et al. | 2021-05-13 |
Methods for forming contact plugs with reduced corrosion
Grant 10,985,061 - Wang , et al. April 20, 2 | 2021-04-20 |
Formation And In-situ Etching Processes For Metal Layers
App 20210111027 - LIN; Po-Yu ; et al. | 2021-04-15 |
High-k metal gate process and device
Grant 10,971,602 - Liao , et al. April 6, 2 | 2021-04-06 |
Contact metallization process
Grant 10,964,590 - Chou , et al. March 30, 2 | 2021-03-30 |
Semiconductor structure with source/drain multi-layer structure and method for forming the same
Grant 10,937,910 - Wang , et al. March 2, 2 | 2021-03-02 |
Gate Structure, Method Of Forming The Same, And Semiconductor Device Having The Same
App 20210036147 - Wang; Chun-Chieh ; et al. | 2021-02-04 |
Formation and in-situ etching processes for metal layers
Grant 10,872,769 - Lin , et al. December 22, 2 | 2020-12-22 |
Semiconductor Device and Method
App 20200303378 - Wang; Chun-Chieh ; et al. | 2020-09-24 |
Material delivery system and method
Grant 10,752,995 - Liu , et al. A | 2020-08-25 |
High-K Metal Gate Process and Device
App 20200251574 - Kind Code | 2020-08-06 |
Semiconductor device and method
Grant 10,679,995 - Wang , et al. | 2020-06-09 |
Formation And In-situ Etching Processes For Metal Layers
App 20200135471 - LIN; Po-Yu ; et al. | 2020-04-30 |
Silicon Intermixing Layer for Blocking Diffusion
App 20200126797 - Wang; Chun-Chieh ; et al. | 2020-04-23 |
High-K metal gate process and device
Grant 10,629,700 - Liao , et al. | 2020-04-21 |
High-K Metal Gate Process and Device
App 20200105532 - Liao; Chien-Shun ; et al. | 2020-04-02 |
Methods for Forming Contact Plugs with Reduced Corrosion
App 20200075407 - Wang; Yu-Sheng ; et al. | 2020-03-05 |
Semiconductor Structure With Source/drain Multi-layer Structure And Method For Forming The Same
App 20200052126 - WANG; Chun-Chieh ; et al. | 2020-02-13 |
Semiconductor Device and Method
App 20200043927 - Wang; Chun-Chieh ; et al. | 2020-02-06 |
Formation and in-situ etching processes for metal layers
Grant 10,535,523 - Lin , et al. Ja | 2020-01-14 |
Methods for forming contact plugs with reduced corrosion
Grant 10,483,165 - Wang , et al. Nov | 2019-11-19 |
Semiconductor structure with source/drain multi-layer structure and method for forming the same
Grant 10,468,530 - Wang , et al. No | 2019-11-05 |
Semiconductor device with TiN adhesion layer for forming a contact plug
Grant 10,332,789 - Chou , et al. | 2019-06-25 |
Semiconductor Device With TiN Adhesion Layer For Forming A Contact Plug
App 20190164822 - CHOU; Tien-Pei ; et al. | 2019-05-30 |
Contact Metallization Process
App 20190148223 - CHOU; Tien-Pei ; et al. | 2019-05-16 |
Semiconductor Structure With Source/drain Multi-layer Structure And Method For Forming The Same
App 20190148556 - WANG; Chun-Chieh ; et al. | 2019-05-16 |
Methods for Forming Contact Plugs with Reduced Corrosion
App 20190115256 - Wang; Yu-Sheng ; et al. | 2019-04-18 |
Methods for forming contact plugs with reduced corrosion
Grant 10,186,456 - Wang , et al. Ja | 2019-01-22 |
Methods for Forming Contact Plugs with Reduced Corrosion
App 20180308751 - Wang; Yu-Sheng ; et al. | 2018-10-25 |
Material Delivery System and Method
App 20170167027 - Liu; Ke-Chih ; et al. | 2017-06-15 |
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