loadpatents
Patent applications and USPTO patent grants for Pai; Ching-Chung.The latest application filed is for "backside bevel protection".
Patent | Date |
---|---|
Method of fabricating an integrated circuit device having backside bevel protection Grant 8,658,483 - Hsu , et al. February 25, 2 | 2014-02-25 |
Backside Bevel Protection App 20130095647 - HSU; Jung-Tzu ;   et al. | 2013-04-18 |
Backside bevel protection Grant 8,338,242 - Hsu , et al. December 25, 2 | 2012-12-25 |
Backside Bevel Protection App 20120248510 - HSU; Jung-Tzu ;   et al. | 2012-10-04 |
Process for wafer bonding Grant 7,732,299 - Chang , et al. June 8, 2 | 2010-06-08 |
Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ;   et al. | 2008-08-14 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.