loadpatents
name:-0.023538112640381
name:-0.021521091461182
name:-0.0059409141540527
Pai; Chih-Yang Patent Filings

Pai; Chih-Yang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pai; Chih-Yang.The latest application filed is for "metal-insulator-metal (mim) capacitor structure and method for forming the same".

Company Profile
4.17.18
  • Pai; Chih-Yang - Hsinchu TW
  • PAI; Chih-Yang - Hsinchu City TW
  • Pai, Chih-Yang - Hsin-Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 11,362,170 - Huang , et al. June 14, 2
2022-06-14
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 11,031,458 - Huang , et al. June 8, 2
2021-06-08
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20210013301 - HUANG; Chih-Fan ;   et al.
2021-01-14
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20200035780 - HUANG; Chih-Fan ;   et al.
2020-01-30
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 10,468,478 - Huang , et al. No
2019-11-05
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20190131385 - HUANG; Chih-Fan ;   et al.
2019-05-02
Method of fabricating semiconductor device
Grant 9,614,025 - Pai , et al. April 4, 2
2017-04-04
Method Of Fabricating Semiconductor Device
App 20160172435 - Pai; Chih-Yang ;   et al.
2016-06-16
Method of fabricating semiconductor device
Grant 9,269,760 - Pai , et al. February 23, 2
2016-02-23
Method of Forming an Embedded Memory Device
App 20150318292 - Ting; Yu-Wei ;   et al.
2015-11-05
Method of forming an embedded memory device
Grant 9,082,705 - Ting , et al. July 14, 2
2015-07-14
Method Of Fabricating Semiconductor Device
App 20150140774 - PAI; Chih-Yang ;   et al.
2015-05-21
Semiconductor device
Grant 8,969,937 - Pai , et al. March 3, 2
2015-03-03
Semiconductor Device
App 20140264749 - PAI; Chih-Yang ;   et al.
2014-09-18
Method of fabricating semiconductor device
Grant 8,759,193 - Pai , et al. June 24, 2
2014-06-24
Method Of Fabricating Semiconductor Device
App 20140120689 - PAI; Chih-Yang ;   et al.
2014-05-01
Method of Forming an Embedded Memory Device
App 20140035020 - Ting; Yu-Wei ;   et al.
2014-02-06
Semiconductor device
Grant 8,643,074 - Pai , et al. February 4, 2
2014-02-04
Semiconductor Device And Method Of Fabricating
App 20130292794 - PAI; Chih-Yang ;   et al.
2013-11-07
Semiconductor device and method for the same
App 20090051034 - Pai; Chih-Yang ;   et al.
2009-02-26
Method of forming contact plugs for eliminating tungsten seam issue
App 20080217775 - Pai; Chih-Yang ;   et al.
2008-09-11
Integrating a DRAM with an SRAM having butted contacts and resulting devices
App 20080116496 - Tzeng; Kuo-Chyuan ;   et al.
2008-05-22
Dual poly layer and method of manufacture
Grant 7,208,369 - Pai , et al. April 24, 2
2007-04-24
Microelectronic capacitor structure and method for fabrication thereof
App 20050164449 - Yu, Chi-Hsing ;   et al.
2005-07-28
Aqueous ammonium hydroxide amorphous silicon etch method for forming microelectronic capacitor structure
Grant 6,881,622 - Yu , et al. April 19, 2
2005-04-19
Dual poly layer and method of manufacture
App 20050056885 - Pai, Chih-Yang ;   et al.
2005-03-17
Method of forming shallow trench isolation with rounded corners and divot-free by using in-situ formed spacers
Grant 6,670,279 - Pai , et al. December 30, 2
2003-12-30
Aqueous Ammonium Hydroxise Amorphous Silicon Etch Method For Forming Microelectronic Capacitor Structure
App 20030222298 - Yu, Chi-Hsing ;   et al.
2003-12-04
Method of fabricating a DRAM device featuring alternate fin type capacitor structures
Grant 6,624,018 - Yu , et al. September 23, 2
2003-09-23
Method for forming a self aligned capping layer
Grant 6,566,250 - Tu , et al. May 20, 2
2003-05-20
Method of forming shallow trench isolation with rounded corner and divot-free by using disposable spacer
Grant 6,555,442 - Pai , et al. April 29, 2
2003-04-29

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