Pahl; Wolfgang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pahl; Wolfgang.The latest application filed is for "sensor arrangement and method for producing a sensor arrangement".

Company Profile

10.70.62

Pahl; Wolfgang - Munich DE
Pahl; Wolfgang - Munchen DE
Pahl; Wolfgang - Muenchen DE
Pahl, Wolfgang - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device with stud bumps Grant 11,444,015 - Pahl September 13, 2	2022-09-13
Sensor Arrangement and Method for Producing a Sensor Arrangement App 20220127137 - Pahl; Wolfgang	2022-04-28
Electric component with sensitive component structures and method for producing an electric component with sensitive component structures Grant 11,245,977 - Bauer , et al. February 8, 2	2022-02-08
Carrier substrate for stress sensitive device and method of manufacture Grant 11,234,082 - Pahl January 25, 2	2022-01-25
MEMS device stress-reducing structure Grant 11,142,453 - Mayer , et al. October 12, 2	2021-10-12
Method for measuring a behavior of a MEMS device Grant 11,137,253 - Barbul , et al. October 5, 2	2021-10-05
Electronic Device and Method for Manufacturing an Electronic Device App 20210139317 - Pahl; Wolfgang	2021-05-13
Mems Device With Particle Filter And Method Of Manufacture App 20210114866 - Pahl; Wolfgang	2021-04-22
Electronic Device with Stud Bumps App 20210104456 - Pahl; Wolfgang	2021-04-08
Electronic device with stud bumps Grant 10,903,156 - Pahl January 26, 2	2021-01-26
Resiliently mounted sensor system with damping Grant 10,683,201 - Rombach , et al.	2020-06-16
Method for Measuring a Behavior of a MEMS Device App 20200124419 - Barbul; Andreas ; et al.	2020-04-23
Carrier Substrate for Stress Sensitive Device and Method of Manufacture App 20200053484 - Pahl; Wolfgang	2020-02-13
Sensor component having two sensor functions Grant 10,544,035 - Pahl Ja	2020-01-28
Housing for an electric component, and method for producing a housing for an electric component Grant 10,542,630 - Pahl Ja	2020-01-21
MEMS Device App 20190375630 - Mayer; Klaus ; et al.	2019-12-12
Housing used for electric component and method for manufacturing same Grant 10,448,530 - Pahl , et al. Oc	2019-10-15
Electronic Device App 20190267318 - Pahl; Wolfgang	2019-08-29
Top port microphone and method for the production of same Grant 10,194,227 - Pahl Ja	2019-01-29
Housing Used for Electric Component and Method for Manufacturing Same App 20190008063 - Pahl; Wolfgang ; et al.	2019-01-03
MEMS component and method for encapsulating MEMS components Grant 10,164,166 - Kruger , et al. Dec	2018-12-25
Method for producing a cased electrical component Grant 10,154,582 - Pahl , et al. Dec	2018-12-11
Top-port MEMS microphone and method of manufacturing the same Grant 10,136,226 - Ravnkilde , et al. November 20, 2	2018-11-20
Microphone and method for producing a microphone Grant 10,117,027 - Pahl October 30, 2	2018-10-30
Resiliently Mounted Sensor System With Damping App 20180244515 - Rombach; Pirmin Hermann Otto ; et al.	2018-08-30
Top Port Microphone And Method For The Production Of Same App 20180213311 - Pahl; Wolfgang	2018-07-26
Multi-MEMS module Grant 10,015,600 - Pahl , et al. July 3, 2	2018-07-03
Mems Component And Method For Encapsulating Mems Components App 20180097172 - KRUGER; Hans ; et al.	2018-04-05
Cased Electrical Component App 20180054886 - PAHL; Wolfgang ; et al.	2018-02-22
MEMS component and method for encapsulating MEMS components Grant 9,853,204 - Kruger , et al. December 26, 2	2017-12-26
Microphone having increased rear volume, and method for production thereof Grant 9,854,350 - Pahl December 26, 2	2017-12-26
Cased electrical component Grant 9,844,128 - Pahl , et al. December 12, 2	2017-12-12
Simple To Produce Electric Component And Method For Producing An Electric Component App 20170272855 - BAUER; Christian ; et al.	2017-09-21
Component which can be produced at wafer level and method of production Grant 9,718,673 - Pahl August 1, 2	2017-08-01
Housing for an Electric Component, and Method for Producing a Housing for an Electric Component App 20170135240 - Pahl; Wolfgang	2017-05-11
Wafer-level package and method for production thereof Grant 9,647,196 - Bauer , et al. May 9, 2	2017-05-09
Sensor Component Having Two Sensor Functions App 20170113924 - Pahl; Wolfgang	2017-04-27
Microphone Having Increased Rear Volume, And Method For Production Thereof App 20170094402 - Pahl; Wolfgang	2017-03-30
Microphone and Method for Producing a Microphone App 20170070825 - Pahl; Wolfgang	2017-03-09
Method for applying a structured coating to a component Grant 9,556,022 - Pahl January 31, 2	2017-01-31
Multi-mems Module App 20160345106 - Pahl; Wolfgang ; et al.	2016-11-24
Encapsulated component comprising a MEMS component and method for the production thereof Grant 9,481,565 - Pahl November 1, 2	2016-11-01
Method For Applying A Structured Coating To A Component App 20160297676 - Pahl; Wolfgang	2016-10-13
MEMS Sensor Component App 20160297671 - Pahl; Wolfgang	2016-10-13
System support for electronic components and method for production thereof Grant 9,331,010 - Pahl , et al. May 3, 2	2016-05-03
Component Which Can be Produced at Wafer Level and Method of Production App 20160075552 - Pahl; Wolfgang	2016-03-17
Method for producing a sensor Grant 9,278,854 - Pahl , et al. March 8, 2	2016-03-08
Encapsulated Component Comprising A Mems Component And Method For The Production Thereof App 20150344296 - Pahl; Wolfgang	2015-12-03
MEMS Component and Method for Encapsulating MEMS Components App 20150325780 - Kruger; Hans ; et al.	2015-11-12
Top-Port MEMS Microphone and Method of Manufacturing the Same App 20150326979 - Ravnkilde; Jan Tue ; et al.	2015-11-12
Electric component having a shallow physical shape, and method of manufacture Grant 9,084,366 - Pahl July 14, 2	2015-07-14
Sensor module and method for producing sensor modules Grant 9,061,888 - Pahl , et al. June 23, 2	2015-06-23
Miniaturized electrical component comprising an MEMS and an ASIC and production method Grant 9,056,760 - Feiertag , et al. June 16, 2	2015-06-16
Method for encapsulating an MEMS component Grant 9,051,174 - Pahl , et al. June 9, 2	2015-06-09
Circuit board with flexible region and method for production thereof Grant 9,035,189 - Pahl , et al. May 19, 2	2015-05-19
Method For Producing A Sensor App 20150056725 - Pahl; Wolfgang ; et al.	2015-02-26
MEMS microphone and method for producing the MEMS microphone Grant 8,865,499 - Pahl , et al. October 21, 2	2014-10-21
Method of manufacturing a microphone Grant 8,713,789 - Leidl , et al. May 6, 2	2014-05-06
Wafer-Level Package and Method for Production Thereof App 20140111062 - Bauer; Christian ; et al.	2014-04-24
MEMS component, method for producing a MEMS component, and method for handling a MEMS component Grant 8,674,464 - Pahl , et al. March 18, 2	2014-03-18
Cased Electrical Component App 20140036466 - Pahl; Wolfgang ; et al.	2014-02-06
MEMS-microphone Grant 8,611,566 - Pahl , et al. December 17, 2	2013-12-17
Piezo Actuator With Protection Against Environmental Influences App 20130328448 - Gabl; Reinhard ; et al.	2013-12-12
MEMS microphone Grant 8,582,788 - Leidl , et al. November 12, 2	2013-11-12
MEMS microphone Grant 8,571,239 - Feiertag , et al. October 29, 2	2013-10-29
Component comprising a chip in a cavity and a stress-reduced attachment Grant 8,531,018 - Pahl September 10, 2	2013-09-10
MEMS Microphone And Method For Producing The MEMS Microphone App 20130140656 - Pahl; Wolfgang ; et al.	2013-06-06
Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method App 20130119492 - Feiertag; Gregor ; et al.	2013-05-16
Electric Component Having A Shallow Physical Shape, And Method Of Manufacture App 20130121523 - Pahl; Wolfgang	2013-05-16
MEMS package and method for the production thereof Grant 8,432,007 - Leidl , et al. April 30, 2	2013-04-30
Mems Microphone App 20120275634 - Leidl; Anton ; et al.	2012-11-01
Electrical component and production method Grant 8,294,535 - Feiertag , et al. October 23, 2	2012-10-23
Mems-microphone App 20120224726 - Pahl; Wolfgang ; et al.	2012-09-06
MEMS microphone, production method and method for installing Grant 8,229,139 - Pahl July 24, 2	2012-07-24
Component comprising a MEMS microphone and method for the production of said component Grant 8,218,794 - Pahl July 10, 2	2012-07-10
Electrical module comprising a MEMS microphone Grant 8,184,845 - Leidl , et al. May 22, 2	2012-05-22
MEMS package and method for the production thereof Grant 8,169,041 - Pahl , et al. May 1, 2	2012-05-01
Mems Microphone App 20120093346 - Feiertag; Gregor ; et al.	2012-04-19
Component with reduced temperature response, and method for production Grant 8,098,001 - Pahl , et al. January 17, 2	2012-01-17
Sensor Module And Method For Producing Sensor Modules App 20110298064 - Pahl; Wolfgang ; et al.	2011-12-08
Component Comprising A Chip In A Cavity And A Stress-reduced Attachment App 20110230068 - Pahl; Wolfgang	2011-09-22
Circuit Board with Flexible Region and Method for Production Thereof App 20110214905 - Pahl; Wolfgang ; et al.	2011-09-08
MEMS Package and Method for the Production Thereof App 20110186943 - Pahl; Wolfgang ; et al.	2011-08-04
Method For Encapsulating An Mems Component App 20110180885 - Pahl; Wolfgang ; et al.	2011-07-28
System Support For Electronic Components And Method For Production Thereof App 20110133315 - Pahl; Wolfgang ; et al.	2011-06-09
MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component App 20110018076 - Pahl; Wolfgang ; et al.	2011-01-27
Component with Reduced Temperature Response, and Method for Production App 20100187949 - Pahl; Wolfgang ; et al.	2010-07-29
Component Comprising a MEMS Microphone and Method for the Production of Said Component App 20090232336 - Pahl; Wolfgang	2009-09-17
Electrical component and production method App 20090224851 - Feiertag; Gregor ; et al.	2009-09-10
Microphone Membrane And Microphone Comprising The Same App 20090129611 - Leidl; Anton ; et al.	2009-05-21
Housing with a Cavity for a Mechanically-Sensitive Electronic Component and Method for Production App 20090127697 - Pahl; Wolfgang	2009-05-21
Mems Package and Method for the Production Thereof App 20090001553 - Pahl; Wolfgang ; et al.	2009-01-01
Mems Microphone, Production Method and Method for Installing App 20080279407 - Pahl; Wolfgang	2008-11-13
Mems Microphone App 20080267431 - Leidl; Anton ; et al.	2008-10-30
Electrical Module Comprising a Mems Microphone App 20080247585 - Leidl; Anton ; et al.	2008-10-09
SAW component with adhesive location and use thereof Grant 7,218,189 - Pahl May 15, 2	2007-05-15
SAW component with adhesive location and use thereof App 20060202781 - Pahl; Wolfgang	2006-09-14
Encapsulated component and method for the production thereof Grant 7,102,224 - Pahl September 5, 2	2006-09-05
Hermetically encapsulated component and waferscale method for the production thereof App 20060043601 - Pahl; Wolfgang	2006-03-02
Encapsulation for an electrical component and method for producing the same Grant 6,984,421 - Pahl , et al. January 10, 2	2006-01-10
Method of producing a surface wave component with a drain for pyroelectric voltage Grant 6,931,699 - Pahl , et al. August 23, 2	2005-08-23
Electronic component, in particular a component operating with surface acoustic waves Grant 6,528,924 - Stelzl , et al. March 4, 2	2003-03-04
Encapsulation for an electrical component and method for producing the same App 20030012884 - Pahl, Wolfgang ; et al.	2003-01-16
Component with drain for pyroelectrical voltages and a method for production thereof App 20020190605 - Pahl, Wolfgang ; et al.	2002-12-19
Method of producing a surface acoustic wave component Grant 6,449,828 - Pahl , et al. September 17, 2	2002-09-17
Method of producing a surface acoustic wave component App 20010010444 - Pahl, Wolfgang ; et al.	2001-08-02
Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production Grant 6,242,842 - Pahl , et al. June 5, 2	2001-06-05
Method of producing an electronic component, in particular a surface acoustic wave component Grant 6,136,175 - Stelzl , et al. October 24, 2	2000-10-24
Method for the production of flip-chip mounting-ready contacts of electrical components Grant 6,057,222 - Pahl , et al. May 2, 2	2000-05-02
Encapsulation for electronic components and method for producing the encapsulation Grant 5,831,369 - Furbacher , et al. November 3, 1	1998-11-03

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