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Patent applications and USPTO patent grants for Paek; Soo-Jin.The latest application filed is for "semiconductor package having improved heat spreading performance".
Patent | Date |
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Semiconductor package having improved heat spreading performance Grant 8,786,067 - Paek , et al. July 22, 2 | 2014-07-22 |
Semiconductor Package Having Improved Heat Spreading Performance App 20110193214 - Paek; Soo-Jin ;   et al. | 2011-08-11 |
Semiconductor package having improved heat spreading performance Grant 7,973,400 - Paek , et al. July 5, 2 | 2011-07-05 |
Phase locked loops capable of burn-in testing with increased locking range and burn-in testing method thereof Grant 7,826,584 - Paek , et al. November 2, 2 | 2010-11-02 |
Semiconductor Package Having Improved Heat Spreading Performance App 20080116557 - PAEK; Soo-Jin ;   et al. | 2008-05-22 |
Phase locked loops capable of burn-in testing with increased locking range and burn-in testing method thereof App 20080112524 - Paek; Soo-Jin ;   et al. | 2008-05-15 |
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