loadpatents
name:-0.0017940998077393
name:-0.024872064590454
name:-0.0013101100921631
Packard Hughes Interconnect Company Patent Filings

Packard Hughes Interconnect Company

Patent Applications and Registrations

Patent applications and USPTO patent grants for Packard Hughes Interconnect Company.The latest application filed is for "bumps with plural under-bump dielectric layers".

Company Profile
0.22.0
  • Packard Hughes Interconnect Company - Irvine CA
  • Packard Hughes Interconnect Co. - Irvine CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bumps with plural under-bump dielectric layers
Grant 6,166,333 - Crumly , et al. December 26, 2
2000-12-26
Snap lock connector for optical fiber systems
Grant 6,152,608 - Ghara , et al. November 28, 2
2000-11-28
Arrowhead retention feature for a terminal pin
Grant 6,149,471 - Kemp , et al. November 21, 2
2000-11-21
Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
Grant 6,085,414 - Swarbrick , et al. July 11, 2
2000-07-11
Printed circuit board to flexible printed circuit connection system
Grant 6,033,234 - Wang , et al. March 7, 2
2000-03-07
Layer to layer interconnect
Grant 6,007,669 - Crumly , et al. December 28, 1
1999-12-28
Membrane test probe
Grant 5,990,695 - Daugherty, Jr. November 23, 1
1999-11-23
Solderless electrical connector
Grant 5,971,773 - Riddle October 26, 1
1999-10-26
Wafer level decal for minimal packaging of chips
Grant 5,946,555 - Crumly , et al. August 31, 1
1999-08-31
Electrical connector system with pre-staged feature
Grant 5,934,926 - Gabrisko, Jr. , et al. August 10, 1
1999-08-10
Integrated circuit with a chip on dot and a heat sink
Grant 5,896,271 - Jensen , et al. April 20, 1
1999-04-20
Method of making contact pad having metallically anchored elastomeric electrical contacts
Grant 5,855,063 - Schreiber , et al. January 5, 1
1999-01-05
Four position two dome switch
Grant 5,834,716 - Lee November 10, 1
1998-11-10
Integral copper column with solder bump flip chip
Grant 5,790,377 - Schreiber , et al. August 4, 1
1998-08-04
Contact pad having metallically anchored elastomeric electrical contacts
Grant 5,738,530 - Schreiber , et al. April 14, 1
1998-04-14
Mechanism for multiple dome dual detent
Grant 5,719,361 - Lee February 17, 1
1998-02-17
Latching switch
Grant 5,714,732 - Lee February 3, 1
1998-02-03
Linear cam-assisted plunger switch
Grant 5,667,061 - Lee September 16, 1
1997-09-16
Alignment means for integrated circuit chips
Grant 5,657,207 - Schreiber , et al. August 12, 1
1997-08-12
Cam-assisted switch
Grant 5,626,223 - Lee May 6, 1
1997-05-06
Two-position latching two dome switch
Grant 5,622,254 - Lee April 22, 1
1997-04-22
Stamped and formed contacts for a power connector
Grant 5,588,884 - Rudoy , et al. December 31, 1
1996-12-31

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