Pachamuthu; Ashok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pachamuthu; Ashok.The latest application filed is for "sintering powder".

Company Profile

13.8.11

Pachamuthu; Ashok - Bangalore IN
Pachamuthu; Ashok - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sintering Powder App 20220169905 - Ghosal; Shamik ; et al.	2022-06-02
Sintering paste Grant 11,162,007 - Ghosal , et al. November 2, 2	2021-11-02
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies App 20210272932 - Yoo; Chan H. ; et al.	2021-09-02
Semiconductor device having laterally offset stacked semiconductor dies Grant 11,037,910 - Yoo , et al. June 15, 2	2021-06-15
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies App 20200350293 - Yoo; Chan H. ; et al.	2020-11-05
Thrumold post package with reverse build up hybrid additive structure Grant 10,593,568 - Yoo , et al.	2020-03-17
Semiconductor device modules including a die electrically connected to posts and related methods Grant 10,586,780 - Pachamuthu , et al.	2020-03-10
Semiconductor Device Modules And Related Methods App 20190252342 - Pachamuthu; Ashok ; et al.	2019-08-15
Sintering Powder App 20190194517 - Ghosal; Shamik ; et al.	2019-06-27
Device module having a plurality of dies electrically connected by posts Grant 10,325,874 - Pachamuthu , et al.	2019-06-18
Sintering powder Grant 10,259,980 - Ghosal , et al.	2019-04-16
Thrumold Post Package With Reverse Build Up Hybrid Additive Structure App 20190067038 - Yoo; Chan H. ; et al.	2019-02-28
High-yield Semiconductor Device Modules And Related Systems App 20190067233 - Pachamuthu; Ashok ; et al.	2019-02-28
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies App 20190067248 - Yoo; Chan H. ; et al.	2019-02-28
Hybrid Additive Structure Stackable Memory Die Using Wire Bond App 20190067034 - Pachamuthu; Ashok ; et al.	2019-02-28
Methods Of Making Semiconductor Device Modules With Increased Yield App 20190035755 - Pachamuthu; Ashok ; et al.	2019-01-31
Methods of making semiconductor device modules with increased yield Grant 10,192,843 - Pachamuthu , et al. Ja	2019-01-29
Thrumold post package with reverse build up hybrid additive structure Grant 10,103,038 - Yoo , et al. October 16, 2	2018-10-16
Sintering Powder App 20150353804 - Ghosal; Shamik ; et al.	2015-12-10

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