Ozono; Mitsuru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ozono; Mitsuru.The latest application filed is for "chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method".

Company Profile

0.17.15

Ozono; Mitsuru - Fukuoka JP
Ozono; Mitsuru - Chikushino JP
Ozono, Mitsuru - Chikushino-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component bonding method, component laminating method and bonded component structure Grant 8,614,118 - Haji , et al. December 24, 2	2013-12-24
Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method Grant 8,192,578 - Haji , et al. June 5, 2	2012-06-05
Electronic component soldering structure and electronic component soldering method Grant 8,148,253 - Ozono , et al. April 3, 2	2012-04-03
Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor Grant 7,632,374 - Ozono , et al. December 15, 2	2009-12-15
Method for soldering electronic component and soldering structure of electronic component Grant 7,632,710 - Sakai , et al. December 15, 2	2009-12-15
Chip Pickup Apparatus, Chip Pickup Method, Chip Releasing Device And Chip Releasing Method App 20090279995 - Haji; Hiroshi ; et al.	2009-11-12
Method For Soldering Electronic Component And Soldering Structure Of Electronic Component App 20090233117 - Sakai; Tadahiko ; et al.	2009-09-17
Electronic Component Pickup Method, Electronic Component Mounting Method And Electronic Component Mounting Apparatus App 20090202333 - Ozono; Mitsuru ; et al.	2009-08-13
Electronic Component Soldering Structure And Electronic Component Soldering Method App 20090075025 - Ozono; Mitsuru ; et al.	2009-03-19
Component Bonding Method, Component Laminating Method And Bonded Component Structure App 20090035892 - Haji; Hiroshi ; et al.	2009-02-05
Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting Apparatus App 20090000109 - Ozono; Mitsuru ; et al.	2009-01-01
Semiconductor device and method for assembling the same Grant 7,446,423 - Sakai , et al. November 4, 2	2008-11-04
Electronic component mounting apparatus and method of mounting electronic components Grant 7,409,761 - Haji , et al. August 12, 2	2008-08-12
Electronic Component Mounting Apparatus And method Of Mounting Electronic Components App 20080104831 - Haji; Hiroshi ; et al.	2008-05-08
Semiconductor device and method for assembling the same App 20050116323 - Sakai, Tadahiko ; et al.	2005-06-02
Method of manufacturing semiconductor device Grant 6,852,572 - Haji , et al. February 8, 2	2005-02-08
Paste ejection apparatus Grant 6,808,086 - Sasaguri , et al. October 26, 2	2004-10-26
Semiconductor device, method of manufacturing the device and method of mounting the device Grant 6,797,544 - Sakai , et al. September 28, 2	2004-09-28
Paste ejection apparatus App 20040069801 - Sasaguri, Shinji ; et al.	2004-04-15
Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor App 20040038498 - Ozono, Mitsuru ; et al.	2004-02-26
Paste applicator and paste application method for die bonding Grant 6,685,777 - Sato , et al. February 3, 2	2004-02-03
Semiconductor device and semiconductor device assembly Grant 6,617,675 - Sakai , et al. September 9, 2	2003-09-09
Bonding paste applicator and method of using it Grant 6,605,315 - Ozono , et al. August 12, 2	2003-08-12
Semiconductor device and semiconductor device assembly App 20020084470 - Sakai, Tadahiko ; et al.	2002-07-04
Semiconductor device, method of manufacturing the device and mehtod of mounting the device App 20020048906 - Sakai, Tadahiko ; et al.	2002-04-25
Paste applicator and paste application method for die bonding App 20020037372 - Sato, Seiichi ; et al.	2002-03-28
Paste application method for die bonding Grant 6,361,831 - Sato , et al. March 26, 2	2002-03-26
Method of applying bonding paste App 20020014519 - Ozono, Mitsuru ; et al.	2002-02-07
Method of manufacturing semiconductor device App 20010018233 - Haji, Hiroshi ; et al.	2001-08-30
Method of mounting bumped electronic components Grant 6,209,196 - Ozono , et al. April 3, 2	2001-04-03
Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps Grant 6,179,198 - Eifuku , et al. January 30, 2	2001-01-30

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