Ozmat; Burhan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ozmat; Burhan.The latest application filed is for "method of metalizing a semiconductor power device ceramic member".

Company Profile

0.10.1

Ozmat; Burhan - Voorheesville NY
Ozmat; Burhan - Dallas TX
Ozmat; Burhan - Peekskill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam therein Grant 6,397,450 - Ozmat June 4, 2	2002-06-04
Power electronic module packaging Grant 6,377,461 - Ozmat , et al. April 23, 2	2002-04-23
Method of metalizing a semiconductor power device ceramic member App 20010026840 - Ozmat, Burhan ; et al.	2001-10-04
Power electronic module packaging Grant 6,232,151 - Ozmat , et al. May 15, 2	2001-05-15
High performance heat exchanger and method Grant 6,196,307 - Ozmat March 6, 2	2001-03-06
Integrated circuit packaging method and the package Grant 5,756,368 - Peterson , et al. May 26, 1	1998-05-26
Constraining core for surface mount technology Grant 5,754,403 - Ozmat , et al. May 19, 1	1998-05-19
Heat transfer module for ultra high density and silicon on silicon packaging applications Grant 5,402,004 - Ozmat March 28, 1	1995-03-28
Module for packaging semiconductor integrated circuit chips on a base substrate Grant 4,866,507 - Jacobs , et al. September 12, 1	1989-09-12
Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure Grant 4,817,093 - Jacobs , et al. March 28, 1	1989-03-28
High performance integrated circuit packaging structure Grant 4,811,082 - Jacobs , et al. March 7, 1	1989-03-07

Company Registrations

NCAGE Code	6S1E5	OZMAT, BURHAN!DBA R&D IN SCIENCE & ENGINEERING
CAGE Code	6S1E5	OZMAT, BURHAN R&D IN SCIENCE & ENGINEERING
DUNS	141820014	OZMAT, BURHAN

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