OZAWA; Naoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for OZAWA; Naoto.The latest application filed is for "soldered product manufacturing device and method for manufacturing soldered product".

Company Profile

7.11.18

OZAWA; Naoto - Saitama-shi Saitama
Ozawa; Naoto - Saitama JP
Ozawa; Naoto - Tokyo N/A JP
Ozawa; Naoto - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Soldered Product Manufacturing Device And Method For Manufacturing Soldered Product App 20220266367 - OZAWA; Naoto ; et al.	2022-08-25
Heating Apparatus And Method For Manufacturing Soldered Object App 20220143729 - TAKEUCHI; Nanami ; et al.	2022-05-12
Method for manufacturing target object coated with coating substance Grant 11,260,418 - Suzuki , et al. March 1, 2	2022-03-01
Method for manufacturing coated object and coating substance spreading apparatus Grant 11,219,921 - Shinohara , et al. January 11, 2	2022-01-11
Method For Manufacturing Target Object Coated With Coating Substance App 20210245194 - SUZUKI; Takayuki ; et al.	2021-08-12
Flux, Solder Paste, Soldering Process, Method For Producing Soldered Product, And Method For Producing Bga Package App 20200398383 - SHIRAISHI; Arisa ; et al.	2020-12-24
Method For Manufacturing Coated Object And Coating Substance Spreading Apparatus App 20200384498 - SHINOHARA; Shinichi ; et al.	2020-12-10
Method for producing soldered product Grant 10,843,300 - Hayashi , et al. November 24, 2	2020-11-24
Work processing apparatus and method for manufacturing a processed work Grant 10,766,085 - Matsuda , et al. Sep	2020-09-08
Work Processing Apparatus And Method For Manufacturing A Processed Work App 20200122256 - MATSUDA; Jun ; et al.	2020-04-23
Solder paste for reduction gas, and method for producing soldered product Grant 10,610,981 - Hayashi , et al.	2020-04-07
Solder Paste For Reduction Gas, And Method For Producing Soldered Product App 20190009375 - HAYASHI; Yukiko ; et al.	2019-01-10
Heating Apparatus And Method For Producing Plate-like Object App 20190001425 - SHINOHARA; Shinichi ; et al.	2019-01-03
Method For Producing Soldered Product App 20180326545 - HAYASHI; Yukiko ; et al.	2018-11-15
Method for estimating carboxylic acid gas concentration and soldering apparatus Grant 9,956,635 - Kobayashi , et al. May 1, 2	2018-05-01
Method For Estimating Carboxylic Acid Gas Concentration And Soldering Apparatus App 20170072493 - KOBAYASHI; Hideo ; et al.	2017-03-16
Method for estimating carboxylic acid gas concentration and soldering apparatus Grant 9,513,211 - Kobayashi , et al. December 6, 2	2016-12-06
Method For Estimating Carboxylic Acid Gas Concentration And Soldering Apparatus App 20160334330 - KOBAYASHI; Hideo ; et al.	2016-11-17
Formic Acid Decomposition Apparatus And Formic Acid Decomposition Method App 20160220955 - OZAWA; Naoto	2016-08-04
Method and apparatus for forming resin film Grant 8,409,671 - Ozawa , et al. April 2, 2	2013-04-02
Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device Grant 8,053,878 - Iwamura , et al. November 8, 2	2011-11-08
Production method and production apparatus of optical disc Grant 7,842,202 - Ozawa , et al. November 30, 2	2010-11-30
Method And Apparatus For Forming Resin Film App 20100028558 - Ozawa; Naoto ; et al.	2010-02-04
Production Method and Production Apparatus of Optical Disc App 20090040913 - Ozawa; Naoto ; et al.	2009-02-12
Resin Film Forming Device, Method and Program of the Same App 20090029063 - Kokaji; Hideyuki ; et al.	2009-01-29
Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device App 20080105964 - Iwamura; Hiroki ; et al.	2008-05-08
Resin Layer Forming Method And Apparatus For The Same App 20080057181 - Kobayashi; Hideo ; et al.	2008-03-06
Optical disk and optical disk manufacturing method and device App 20060153054 - Kobayashi; Hideo ; et al.	2006-07-13

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