Oyamada; Seisei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oyamada; Seisei.The latest application filed is for "thin-film capacitor structure and semiconductor device including the thin-film capacitor structure".

Company Profile

2.10.13

Oyamada; Seisei - Komaki JP
OYAMADA; Seisei - Komaki-shi Aichi
Oyamada; Seisei - Tokyo JP
OYAMADA; Seisei - Katsushika-ku Tokyo
Oyamada; Seisei - Kashiwa JP
Oyamada; Seisei - Kashiwa-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thin-film capacitor structure and semiconductor device including the thin-film capacitor structure Grant 10,833,028 - Oyamada November 10, 2	2020-11-10
Thin-film Capacitor Structure And Semiconductor Device Including The Thin-film Capacitor Structure App 20200126934 - OYAMADA; Seisei	2020-04-23
Intermediate connector, semiconductor device including intermediate connector, and method of manufacturing intermediate connector Grant 10,483,182 - Oyamada Nov	2019-11-19
Intermediate Connector, Semiconductor Device Including Intermediate Connector, And Method Of Manufacturing Intermediate Connector App 20190131202 - OYAMADA; Seisei	2019-05-02
Multi-layered circuit board and semiconductor device Grant 10,149,379 - Oyamada , et al. De	2018-12-04
Semiconductor Device App 20170263577 - OYAMADA; Seisei	2017-09-14
Semiconductor device Grant 9,761,544 - Oyamada September 12, 2	2017-09-12
Semiconductor memory device Grant 9,627,354 - Oyamada April 18, 2	2017-04-18
Semiconductor Memory Device App 20170092615 - OYAMADA; Seisei	2017-03-30
Multi-layered Circuit Board And Semiconductor Device App 20160262260 - OYAMADA; Seisei ; et al.	2016-09-08
Semiconductor device having an inner power supply plate structure Grant 9,431,337 - Oyamada August 30, 2	2016-08-30
Semiconductor Device App 20160204058 - OYAMADA; Seisei	2016-07-14
Semiconductor device Grant 9,153,549 - Oyamada , et al. October 6, 2	2015-10-06
Semiconductor Device App 20140070368 - Oyamada; Seisei ; et al.	2014-03-13
Semiconductor device and bypass capacitor module Grant 8,299,518 - Oyamada October 30, 2	2012-10-30
BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure Grant 8,243,245 - Oyamada August 14, 2	2012-08-14
Wiring structure of a substrate Grant 8,089,005 - Oyamada January 3, 2	2012-01-03
Semiconductor device and bypass capacitor module App 20110260289 - Oyamada; Seisei	2011-10-27
Wiring structure of a substrate App 20090229866 - Oyamada; Seisei	2009-09-17
Power controller for a mounting substrate and a semiconductor substrate App 20090230780 - Oyamada; Seisei	2009-09-17
Method for producing a semiconductor device and the semiconductor device App 20090230522 - Oyamada; Seisei	2009-09-17
BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure App 20090235135 - Oyamada; Seisei	2009-09-17
Semiconductor device and bypass capacitor module App 20090230446 - Oyamada; Seisei	2009-09-17

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