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OYAMA; Toshikatsu Patent Filings

OYAMA; Toshikatsu

Patent Applications and Registrations

Patent applications and USPTO patent grants for OYAMA; Toshikatsu.The latest application filed is for "polyethylene-based thermally-shrinkable multilayer film for packaging, and package and packaging method therefor".

Company Profile
0.1.1
  • OYAMA; Toshikatsu - Tokyo JP
  • Oyama; Toshikatsu - Kumamoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polyethylene-based Thermally-shrinkable Multilayer Film For Packaging, And Package And Packaging Method Therefor
App 20170297312 - OYAMA; Toshikatsu
2017-10-19
Heat shrinkable polypropylene laminate film
Grant 5,620,803 - Oyama , et al. April 15, 1
1997-04-15

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