Oyama; Kenshu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oyama; Kenshu.The latest application filed is for "steam reflow apparatus and steam reflow method".
- Oyama; Kenshu - Ogori JP
- Oyama; Kenshu - Ogoori JP
- Oyama; Kenshu - Ogoori-shi JP
- Oyama; Kenshu - Ogori-shi JP
- Oyama; Kenshu - Kakogawa JP
- Oyama, Kenshu - Kakogawa-shi JP
- Oyama; Kenshu - Ogouri JP
- Oyama; Kenshu - Umi JP
- Oyama; Kenshu - Fukuoka JP
| Patent | Date |
|---|---|
| Semiconductor device and fabrication method for same Grant 9,812,621 - Ishihara , et al. November 7, 2 | 2017-11-07 |
| LED illumination module and LED illumination apparatus Grant 9,698,327 - Ishihara , et al. July 4, 2 | 2017-07-04 |
| Steam reflow apparatus and steam reflow method Grant 9,682,438 - Oyama , et al. June 20, 2 | 2017-06-20 |
| Steam Reflow Apparatus And Steam Reflow Method App 20160167148 - Oyama; Kenshu ; et al. | 2016-06-16 |
| Led Illumination Module And Led Illumination Apparatus App 20150155459 - Ishihara; Masamichi ; et al. | 2015-06-04 |
| Semiconductor Device And Fabrication Method For Same App 20140327024 - Ishihara; Masamichi ; et al. | 2014-11-06 |
| Solder deposition method and solder bump forming method Grant 7,452,797 - Kukimoto , et al. November 18, 2 | 2008-11-18 |
| Solder deposition method and solder bump forming method App 20040209451 - Kukimoto, Youichi ; et al. | 2004-10-21 |
| Method of manufacturing an electronics package Grant 5,406,699 - Oyama April 18, 1 | 1995-04-18 |
| Electronic component mounting apparatus and method of mounting electronic component Grant 5,177,864 - Oyama January 12, 1 | 1993-01-12 |
| Electrical component placing apparatus Grant 5,131,139 - Oyama , et al. July 21, 1 | 1992-07-21 |
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