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Cover Opening/closing Apparatus, Thermal Processing Apparatus Using The Same, And Cover Opening/closing Method App 20140064885 - Oyama; Katsuhiko ;   et al. | 2014-03-06 |
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Substrate Conveying Method, Recording Medium In Which Program Is Recorded For Causing Substrate Conveying Method To Be Executed, And Substrate Conveyor App 20120230805 - YAMAGISHI; Daisuke ;   et al. | 2012-09-13 |
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Semiconductor device and manufacturing method therefor App 20040115863 - Oyama, Katsuhiko | 2004-06-17 |
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Laminated-chip semiconductor device App 20020180030 - Oyama, Katsuhiko ;   et al. | 2002-12-05 |
Method of manufacturing semiconductor devices Grant 5,677,246 - Maeta , et al. October 14, 1 | 1997-10-14 |