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Patent applications and USPTO patent grants for Owens; Norman Lee.The latest application filed is for "semiconductor device having corrugated leads and method for forming".
Patent | Date |
---|---|
Semiconductor device having corrugated leads and method for forming Grant 10,134,660 - Tang , et al. November 20, 2 | 2018-11-20 |
Semiconductor Device Having Corrugated Leads And Method For Forming App 20180277464 - TANG; JINBANG ;   et al. | 2018-09-27 |
Multi-strand Substrate For Ball-grid Array Assemblies And Method App 20080289867 - OWENS; NORMAN LEE | 2008-11-27 |
Multi-strand Substrate For Ball-grid Array Assemblies And Method App 20070137889 - Owens; Norman Lee | 2007-06-21 |
Multi-strand substrate for ball-grid array assemblies and method Grant 7,199,306 - Owens April 3, 2 | 2007-04-03 |
Multi-strand substrate for ball-grid array assemblies and method App 20040129452 - Owens, Norman Lee | 2004-07-08 |
Multi-strand substrate for ball-grid array assemblies and method Grant 6,710,265 - Owens March 23, 2 | 2004-03-23 |
Multi-strand substrate for ball-grid array assemblies and method App 20030027377 - Owens, Norman Lee | 2003-02-06 |
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