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Patent applications and USPTO patent grants for Owei; Abayomi I..The latest application filed is for "adhesion promotion in printed circuit boards".
Patent | Date |
---|---|
Adhesion Promotion in Printed Circuit Boards App 20160234947 - Owei; Abayomi I. ;   et al. | 2016-08-11 |
Adhesion promotion in printed circuit boards Grant 9,338,896 - Owei , et al. May 10, 2 | 2016-05-10 |
Adhesion promotion in printed circuit boards Grant 9,040,117 - Owei , et al. May 26, 2 | 2015-05-26 |
Adhesion Promotion In Printed Circuit Boards App 20140030425 - OWEI; Abayomi I. ;   et al. | 2014-01-30 |
Adhesion Promotion In Printed Circuit Boards App 20130078367 - Owei; Abayomi I. ;   et al. | 2013-03-28 |
Adhesion Promotion Of Metal To Laminate With Multi-functional Molecular System App 20120168075 - Abys; Joseph A. ;   et al. | 2012-07-05 |
Adhesion promotion in printed circuit boards Grant 8,142,840 - Owei , et al. March 27, 2 | 2012-03-27 |
Adhesion promotion in printed circuit boards Grant 7,682,432 - Owei , et al. March 23, 2 | 2010-03-23 |
Adhesion Promotion In Printed Circuit Boards App 20070227625 - Owei; Abayomi I. ;   et al. | 2007-10-04 |
Adhesion Promotion In Printed Circuit Boards App 20070228333 - Owei; Abayomi I. ;   et al. | 2007-10-04 |
Adhesion promotion in printed circuit boards Grant 7,232,478 - Owei , et al. June 19, 2 | 2007-06-19 |
Adhesion promotion in printed circuit boards App 20050011400 - Owei, Abayomi I. ;   et al. | 2005-01-20 |
Bismuth coating protection for copper Grant 6,331,201 - McGrath , et al. December 18, 2 | 2001-12-18 |
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