loadpatents
name:-0.012170076370239
name:-0.012989044189453
name:-0.018133163452148
Ou Yang; Liang-Yueh Patent Filings

Ou Yang; Liang-Yueh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ou Yang; Liang-Yueh.The latest application filed is for "conductive interconnect structures in integrated circuits".

Company Profile
14.10.9
  • Ou Yang; Liang-Yueh - New Taipei TW
  • Ou Yang; Liang-Yueh - New Taipei City TW
  • Ou Yang; Liang-Yueh - Taipei TW
  • Ou Yang; Liang-Yueh - Taipei City TW
  • Ou Yang; Liang-Yueh - Hsin-Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods for forming contact plugs with reduced corrosion
Grant 10,985,061 - Wang , et al. April 20, 2
2021-04-20
Conductive fill
Grant 10,879,114 - Wu , et al. December 29, 2
2020-12-29
Conductive interconnect structures in integrated circuits
Grant 10,872,815 - Wu , et al. December 22, 2
2020-12-22
Semiconductor device and method
Grant 10,867,845 - Wang , et al. December 15, 2
2020-12-15
Conductive Interconnect Structures in Integrated Circuits
App 20200258777 - A1
2020-08-13
Conductive interconnect structures in integrated circuits
Grant 10,636,702 - Wu , et al.
2020-04-28
Conductive Interconnect Structures in Integrated Circuits
App 20200105593 - Wu; Jung-Tang ;   et al.
2020-04-02
Methods for Forming Contact Plugs with Reduced Corrosion
App 20200075407 - Wang; Yu-Sheng ;   et al.
2020-03-05
Semiconductor Device and Method
App 20200043781 - Wang; Yu-Sheng ;   et al.
2020-02-06
Semiconductor device and method
Grant 10,497,615 - Wang , et al. De
2019-12-03
Methods for forming contact plugs with reduced corrosion
Grant 10,483,165 - Wang , et al. Nov
2019-11-19
Methods for Forming Contact Plugs with Reduced Corrosion
App 20190115256 - Wang; Yu-Sheng ;   et al.
2019-04-18
Semiconductor Device and Method
App 20190109043 - Wang; Yu-Sheng ;   et al.
2019-04-11
Methods for forming contact plugs with reduced corrosion
Grant 10,186,456 - Wang , et al. Ja
2019-01-22
Semiconductor device and method
Grant 10,157,785 - Wang , et al. Dec
2018-12-18
Semiconductor Device and Method
App 20180315647 - Wang; Yu-Sheng ;   et al.
2018-11-01
Methods for Forming Contact Plugs with Reduced Corrosion
App 20180308751 - Wang; Yu-Sheng ;   et al.
2018-10-25
Metal cap apparatus and method
Grant 9,786,604 - Kao , et al. October 10, 2
2017-10-10
Metal Cap Apparatus and Method
App 20160064332 - Kao; Chen-Yuan ;   et al.
2016-03-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed