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Patent applications and USPTO patent grants for Ou Yang; Liang-Yueh.The latest application filed is for "conductive interconnect structures in integrated circuits".
Patent | Date |
---|---|
Methods for forming contact plugs with reduced corrosion Grant 10,985,061 - Wang , et al. April 20, 2 | 2021-04-20 |
Conductive fill Grant 10,879,114 - Wu , et al. December 29, 2 | 2020-12-29 |
Conductive interconnect structures in integrated circuits Grant 10,872,815 - Wu , et al. December 22, 2 | 2020-12-22 |
Semiconductor device and method Grant 10,867,845 - Wang , et al. December 15, 2 | 2020-12-15 |
Conductive Interconnect Structures in Integrated Circuits App 20200258777 - A1 | 2020-08-13 |
Conductive interconnect structures in integrated circuits Grant 10,636,702 - Wu , et al. | 2020-04-28 |
Conductive Interconnect Structures in Integrated Circuits App 20200105593 - Wu; Jung-Tang ;   et al. | 2020-04-02 |
Methods for Forming Contact Plugs with Reduced Corrosion App 20200075407 - Wang; Yu-Sheng ;   et al. | 2020-03-05 |
Semiconductor Device and Method App 20200043781 - Wang; Yu-Sheng ;   et al. | 2020-02-06 |
Semiconductor device and method Grant 10,497,615 - Wang , et al. De | 2019-12-03 |
Methods for forming contact plugs with reduced corrosion Grant 10,483,165 - Wang , et al. Nov | 2019-11-19 |
Methods for Forming Contact Plugs with Reduced Corrosion App 20190115256 - Wang; Yu-Sheng ;   et al. | 2019-04-18 |
Semiconductor Device and Method App 20190109043 - Wang; Yu-Sheng ;   et al. | 2019-04-11 |
Methods for forming contact plugs with reduced corrosion Grant 10,186,456 - Wang , et al. Ja | 2019-01-22 |
Semiconductor device and method Grant 10,157,785 - Wang , et al. Dec | 2018-12-18 |
Semiconductor Device and Method App 20180315647 - Wang; Yu-Sheng ;   et al. | 2018-11-01 |
Methods for Forming Contact Plugs with Reduced Corrosion App 20180308751 - Wang; Yu-Sheng ;   et al. | 2018-10-25 |
Metal cap apparatus and method Grant 9,786,604 - Kao , et al. October 10, 2 | 2017-10-10 |
Metal Cap Apparatus and Method App 20160064332 - Kao; Chen-Yuan ;   et al. | 2016-03-03 |
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