Otsuki; Keizo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Otsuki; Keizo.The latest application filed is for "lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member".
- Otsuki; Keizo - Higashiyamato JP
- Otsuki; Keizo - Higashiyamayo JP
- Otsuki; Keizo - Tokyo JA
| Patent | Date |
|---|---|
| Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member Grant 4,301,464 - Otsuki , et al. November 17, 1 | 1981-11-17 |
| Semiconductor Grant D260,986 - Mochizuki , et al. September 29, 1 | 1981-09-29 |
| Semiconductor Grant D260,091 - Mochizuki , et al. August 4, 1 | 1981-08-04 |
| Semiconductor Grant D259,783 - Mochizuki , et al. July 7, 1 | 1981-07-07 |
| Semiconductor Grant D259,782 - Mochizuki , et al. July 7, 1 | 1981-07-07 |
| Semiconductor Grant D259,560 - Mochizuki , et al. June 16, 1 | 1981-06-16 |
| Mold die Grant 4,126,292 - Saeki , et al. November 21, 1 | 1978-11-21 |
| Single in-line high power resin-packaged semiconductor device having an improved heat dissipator Grant 4,095,253 - Yoshimura , et al. June 13, 1 | 1978-06-13 |
| Structure For Plastic Encapsulation Of Semiconductor Devices Grant 3,659,821 - Sakamoto , et al. May 2, 1 | 1972-05-02 |
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