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Patent applications and USPTO patent grants for OTSUKA; YASUSHI.The latest application filed is for "semiconductor package, electronic apparatus, and method for manufacturing semiconductor package".
Patent | Date |
---|---|
Semiconductor Package, Electronic Apparatus, And Method For Manufacturing Semiconductor Package App 20220208718 - OTSUKA; YASUSHI | 2022-06-30 |
Elevator Control Device App 20220135367 - KIMURA; Tetsuya ;   et al. | 2022-05-05 |
Electric Motor Control Device App 20220029563 - KATO; Toshiaki ;   et al. | 2022-01-27 |
Electric motor control device Grant 11,101,760 - Kimura , et al. August 24, 2 | 2021-08-24 |
Electric Motor Control Device App 20210194402 - KIMURA; Tetsuya ;   et al. | 2021-06-24 |
Elevator apparatus Grant 9,809,419 - Otsuka , et al. November 7, 2 | 2017-11-07 |
Elevator apparatus Grant 9,676,591 - Banno , et al. June 13, 2 | 2017-06-13 |
Elevator Apparatus App 20160214832 - BANNO; Hirokazu ;   et al. | 2016-07-28 |
Elevator Apparatus App 20150336768 - OTSUKA; Yasushi ;   et al. | 2015-11-26 |
Semiconductor device and method of inspecting the same Grant 6,818,986 - Ikenaga , et al. November 16, 2 | 2004-11-16 |
Semiconductor device and method of inspecting the same App 20020063250 - Ikenaga, Yuichiro ;   et al. | 2002-05-30 |
Semiconductor device and method for manufacturing the same Grant 6,093,970 - Ohsawa , et al. July 25, 2 | 2000-07-25 |
Semiconductor chip housing having a reinforcing plate Grant 5,945,741 - Ohsawa , et al. August 31, 1 | 1999-08-31 |
Push-on fixer for screw engagement Grant 5,444,603 - Otsuka , et al. August 22, 1 | 1995-08-22 |
Strain or stress gauge and method for detecting strain or stress of structure using the same, and plastic composite material for foreknowing progress of breakdown of structure and method using the same Grant 5,379,644 - Yanagida , et al. January 10, 1 | 1995-01-10 |
Headlight for motor vehicle Grant 4,951,178 - Shirai , et al. August 21, 1 | 1990-08-21 |
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