loadpatents
Patent applications and USPTO patent grants for Otsuka; Mari.The latest application filed is for "manufacturing method of semiconductor device, semiconductor substrate, and camera module".
Patent | Date |
---|---|
Manufacturing method of semiconductor device, semiconductor substrate, and camera module Grant 8,778,778 - Tanida , et al. July 15, 2 | 2014-07-15 |
Manufacturing Method Of Semiconductor Device, Semiconductor Substrate, And Camera Module App 20120049312 - TANIDA; Kazumasa ;   et al. | 2012-03-01 |
Semiconductor device and method of manufacturing the same Grant 8,053,268 - Otsuka , et al. November 8, 2 | 2011-11-08 |
Semiconductor Device And Method Of Manufacturing The Same App 20110248368 - OTSUKA; Mari ;   et al. | 2011-10-13 |
Semiconductor Device And Method Of Manufacturing The Same App 20090108388 - OTSUKA; Mari ;   et al. | 2009-04-30 |
Semiconductor device having a conductive layer and a manufacturing method thereof App 20040211958 - Osamura, Hideki ;   et al. | 2004-10-28 |
Method of manufacturing semiconductor device having a multilayer wiring Grant 5,834,367 - Otsuka , et al. November 10, 1 | 1998-11-10 |
Contact plug forming method Grant 5,607,878 - Otsuka , et al. March 4, 1 | 1997-03-04 |
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