Otsuka; Kazuhisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Otsuka; Kazuhisa.The latest application filed is for "food providing system, food providing method, and program".

Company Profile

1.23.17

Otsuka; Kazuhisa - Yamanashi JP
OTSUKA; Kazuhisa - Minamitsuru-gun JP
Otsuka; Kazuhisa - Chikusei JP
Otsuka; Kazuhisa - Shimodate JP
Otsuka; Kazuhisa - Shimodate-shi JP
Otsuka; Kazuhisa - Chikusei-shi JP
Otsuka, Kazuhisa - Minamitsura-gun JP
Otsuka; Kazuhisa - Oshino-mura JP
Otsuka; Kazuhisa - Minamitsuru JP
Otsuka; Kazuhisa - Hino JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Production planning apparatus Grant 11,385,626 - Sasaki , et al. July 12, 2	2022-07-12
Food Providing System, Food Providing Method, And Program App 20220148703 - INABA; Kiyonori ; et al.	2022-05-12
Production Planning Apparatus App 20200174459 - SASAKI; Masaaki ; et al.	2020-06-04
Masking system using masking piece Grant 9,533,482 - Oda , et al. January 3, 2	2017-01-03
Masking System Using Masking Piece App 20140261963 - ODA; Masaru ; et al.	2014-09-18
Masking system using masking piece Grant 8,770,247 - Oda , et al. July 8, 2	2014-07-08
Masking System Using Masking Piece App 20120199289 - ODA; Masaru ; et al.	2012-08-09
Insulation material, film, circuit board and method of producing them Grant 7,700,185 - Kumashiro , et al. April 20, 2	2010-04-20
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device Grant 7,592,250 - Shimada , et al. September 22, 2	2009-09-22
Workpiece regrasping system for robot Grant 7,406,362 - Hariki , et al. July 29, 2	2008-07-29
Object handling apparatus Grant 7,244,093 - Watanabe , et al. July 17, 2	2007-07-17
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device Grant 7,239,013 - Shimada , et al. July 3, 2	2007-07-03
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device App 20070108588 - Shimada; Yasushi ; et al.	2007-05-17
Insulation material, film, circuit board and method of producing them App 20070060672 - Kumashiro; Yasushi ; et al.	2007-03-15
Laser welding method and laser welding robot App 20060226128 - Otsuka; Kazuhisa ; et al.	2006-10-12
Food dishing robot system Grant 7,107,123 - Watanabe , et al. September 12, 2	2006-09-12
Laser processing robot system and method for controlling the same App 20060113392 - Otsuka; Kazuhisa ; et al.	2006-06-01
Machining system Grant 7,035,711 - Watanabe , et al. April 25, 2	2006-04-25
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device App 20060063367 - Shimada; Yasushi ; et al.	2006-03-23
Laser processing apparatus App 20060037951 - Otsuka; Kazuhisa ; et al.	2006-02-23
Manufacturing method of electronic circuit including multilayer circuit board Grant 6,889,431 - Okabe , et al. May 10, 2	2005-05-10
Workpiece regrasping system for robot App 20050065654 - Hariki, Kazuo ; et al.	2005-03-24
Connector gripping device, connector inspection system comprising the device, and connector connection system App 20040266276 - Hariki, Kazuo ; et al.	2004-12-30
Target shape portion cutting apparatus, robot equipped with the apparatus and target shape portion cutting method Grant 6,729,214 - Otsuka , et al. May 4, 2	2004-05-04
Machining system App 20040039484 - Watanabe, Atsushi ; et al.	2004-02-26
Object handling apparatus App 20040037689 - Watanabe, Atsushi ; et al.	2004-02-26
Manufacturing method of electronic circuit including multilayer circuit board App 20030097750 - Okabe, Hiroshi ; et al.	2003-05-29
Food dishing robot system App 20030075051 - Watanabe, Atsushi ; et al.	2003-04-24
Target shape portion cutting apparatus, robot equipped with the apparatus and target shape portion cutting method App 20020005099 - Otsuka, Kazuhisa ; et al.	2002-01-17
Production of insulating varnishes and multilayer printed circuit boards using these varnishes Grant 6,197,149 - Kobayashi , et al. March 6, 2	2001-03-06
Process for producing multilayer printed circuit board for wire bonding Grant 5,879,568 - Urasaki , et al. March 9, 1	1999-03-09
Robot controlling method for tracking a moving object using a visual sensor Grant 5,727,132 - Arimatsu , et al. March 10, 1	1998-03-10
Process for producing multilayer printed circuit board Grant 5,690,837 - Nakaso , et al. November 25, 1	1997-11-25
Bifinger hand for an industrial robot and a method of controlling the operation of the bifinger hand Grant 5,671,962 - Otsuka , et al. September 30, 1	1997-09-30
Overtravel detecting device for an industrial robot Grant 5,508,686 - Nihei , et al. April 16, 1	1996-04-16
Method for detecting a collision and stopping drive of a machine driven by servomotors Grant 5,214,362 - Torii , et al. May 25, 1	1993-05-25
Industrial robot swivel shaft apparatus Grant 4,953,992 - Torii , et al. September 4, 1	1990-09-04
Apparatus for setting turning movement region of trunk body of industrial robot Grant 4,934,504 - Torii , et al. June 19, 1	1990-06-19
Cable supporting arrangement in industrial robots Grant 4,712,972 - Nakashima , et al. December 15, 1	1987-12-15

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