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name:-0.055657863616943
name:-0.048890829086304
name:-0.0025360584259033
OTSUKA; Jun Patent Filings

OTSUKA; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for OTSUKA; Jun.The latest application filed is for "method for manufacturing carbon nanotube, method for manufacturing carbon nanotube assembled wire, method for manufacturing carbon nanotube assembled wire bundle, carbon nanotube manufacturing apparatus, carbon nanotube assembled wire manufacturing apparatus, and carbon nanotube assembled wire bundl".

Company Profile
2.54.45
  • OTSUKA; Jun - Osaka-shi JP
  • OTSUKA; Jun - Nagoya-shi JP
  • OTSUKA; Jun - Iwaki-shi JP
  • Otsuka; Jun - Seki JP
  • Otsuka; Jun - Osaka JP
  • OTSUKA; Jun - Fukushima JP
  • Otsuka; Jun - Tokyo JP
  • Otsuka; Jun - Iwaki JP
  • Otsuka; Jun - Konan JP
  • OTSUKA; Jun - Konan-shi JP
  • Otsuka; Jun - Gifu-ken JP
  • Otsuka; Jun - Hino-shi JP
  • Otsuka; Jun - Hino N/A JP
  • Otsuka; Jun - Aichi JP
  • Otsuka; Jun - Kobe JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Manufacturing Carbon Nanotube, Method For Manufacturing Carbon Nanotube Assembled Wire, Method For Manufacturing Carbon Nanotube Assembled Wire Bundle, Carbon Nanotube Manufacturing Apparatus, Carbon Nanotube Assembled Wire Manufacturing Apparatus, And Carbon Nanotube Assembled Wire Bundl
App 20220153585 - HIKATA; Takeshi ;   et al.
2022-05-19
Immunoglobulin Purification Method And Immunoglobulin Purification Device, And Immunoglobulin Production Method And Immunoglobulin Production Device
App 20220119498 - KATO; Katsuya ;   et al.
2022-04-21
Porous Zirconia Particles, And Aggregate For Immobilizing Protein
App 20220089453 - KATO; Katsuya ;   et al.
2022-03-24
Method For Manufacturing Carbon Nanotube, Method For Manufacturing Carbon Nanotube Assembled Wire, Method For Manufacturing Carbon Nanotube Assembled Wire Bundle, Carbon Nanotube Manufacturing Apparatus, Carbon Nanotube Assembled Wire Manufacturing Apparatus, And Carbon Nanotube Assembled Wire Bundl
App 20220064003 - FUJIMORI; Toshihiko ;   et al.
2022-03-03
Cutting Tool
App 20210370412 - KATO; Tatsumi ;   et al.
2021-12-02
Kitchen knife
Grant D937,049 - Otsuka , et al. November 30, 2
2021-11-30
Multicore cable
Grant 11,087,904 - Kobayashi , et al. August 10, 2
2021-08-10
Kitchen knife
Grant D926,534 - Otsuka , et al. August 3, 2
2021-08-03
Cutting Insert And Turning Tool Using Cutting Insert
App 20210213540 - IDA; Takehiro ;   et al.
2021-07-15
System, Authorization Server, Control Method, And Storage Medium
App 20210044587 - Otsuka; Jun
2021-02-11
Multicore Cable
App 20210012928 - KOBAYASHI; Yuto ;   et al.
2021-01-14
Mach-zehnder modulator
Grant 10,317,770 - Kono , et al.
2019-06-11
Mach-zehnder Modulator
App 20190094649 - KONO; Naoya ;   et al.
2019-03-28
Rotary cutting tool having adjacent cutting inserts with wave-shaped edges and overlapping rotational trajectories coinciding in phase
Grant 10,124,423 - Otsuka November 13, 2
2018-11-13
Safety razor
Grant D827,202 - Otsuka August 28, 2
2018-08-28
Rotary Cutting Tool Having Adjacent Cutting Inserts With Wave-shaped Edges And Overlapping Rotational Trajectories Coinciding In Phase
App 20170189974 - OTSUKA; Jun
2017-07-06
Capacitor
Grant 9,653,220 - Murakami , et al. May 16, 2
2017-05-16
Safety razor blade cartridge
Grant D772,484 - Otsuka November 22, 2
2016-11-22
Capacitor
App 20160027591 - MURAKAMI; Kenji ;   et al.
2016-01-28
Razor holder
Grant D731,120 - Otsuka June 2, 2
2015-06-02
Information Processing System, Print System, And Method And Computer-readable Storage Medium For Controlling Information Processing System
App 20150062647 - Miyazawa; Hiroyasu ;   et al.
2015-03-05
Information processing system, print system, and method and computer-readable storage medium for controlling information processing system
Grant 8,908,220 - Miyazawa , et al. December 9, 2
2014-12-09
Method of manufacturing a dielectric structure
Grant 8,813,353 - Inui , et al. August 26, 2
2014-08-26
Electric grinder for sharpening knives
Grant D703,018 - Otsuka April 22, 2
2014-04-22
Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
Grant 8,697,534 - Sato , et al. April 15, 2
2014-04-15
Safety razor
Grant D698,999 - Otsuka February 4, 2
2014-02-04
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
Grant 8,546,700 - Yamamoto , et al. October 1, 2
2013-10-01
Content printing system, print relay system, control method, and storage medium
Grant 8,542,390 - Takahashi , et al. September 24, 2
2013-09-24
Method for manufacturing ceramic capacitor
Grant 8,444,791 - Ichiyanagi , et al. May 21, 2
2013-05-21
Ceramic capacitor and wiring board
Grant 8,369,064 - Ichiyanagi , et al. February 5, 2
2013-02-05
Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
Grant 8,350,306 - Sato , et al. January 8, 2
2013-01-08
Capacitor To Be Incorporated In Wiring Substrate, Method For Manufacturing The Capacitor, And Wiring Substrate
App 20130000820 - SATO; Motohiko ;   et al.
2013-01-03
Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
Grant 8,304,321 - Sato , et al. November 6, 2
2012-11-06
Safety razor
Grant D669,221 - Otsuka October 16, 2
2012-10-16
Safety razor
Grant D669,219 - Otsuka October 16, 2
2012-10-16
Safety razor
Grant D669,220 - Otsuka October 16, 2
2012-10-16
Information Processing System, Print System, And Method And Computer Readable Storage Medium For Controlling Information Processing System
App 20120218595 - Miyazawa; Hiroyasu ;   et al.
2012-08-30
Content Printing System, Print Relay System, Control Method, And Storage Medium
App 20120019855 - Takahashi; Takeshi ;   et al.
2012-01-26
Content Printing System, Print Relay System, Control Method, And Storage Medium
App 20120019865 - Takahashi; Takeshi ;   et al.
2012-01-26
Capacitor and wiring board including the capacitor
Grant 8,072,732 - Sato , et al. December 6, 2
2011-12-06
Capacitor For Incorporation In Wiring Board, Wiring Board, Method Of Manufacturing Wiring Board, And Ceramic Chip For Embedment
App 20110157763 - YAMAMOTO; Hiroshi ;   et al.
2011-06-30
Wiring board with built-in component and method for manufacturing the same
Grant 7,936,567 - Takashima , et al. May 3, 2
2011-05-03
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
Grant 7,932,471 - Yamamoto , et al. April 26, 2
2011-04-26
Capacitor To Be Incorporated In Wiring Substrate, Method For Manufacturing The Capacitor, And Wiring Substrate
App 20110090615 - SATO; Motohiko ;   et al.
2011-04-21
Capacitor To Be Incorporated In Wiring Substrate, Method For Manufacturing The Capacitor, And Wiring Substrate
App 20110083794 - Sato; Motohiko ;   et al.
2011-04-14
Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
Grant 7,863,662 - Sato , et al. January 4, 2
2011-01-04
Ceramic Capacitor and Wiring Board
App 20100300740 - Ichiyanagi; Seiji ;   et al.
2010-12-02
Method for Manufacturing Ceramic Capacitor
App 20100300602 - ICHIYANAGI; Seiji ;   et al.
2010-12-02
Dielectric Lamination Structure, Manufacturing Method Of A Dielectric Lamination Structure, And Wiring Board Including A Dielectric Lamination Structure
App 20100242271 - Inui; Yasuhiko ;   et al.
2010-09-30
Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure
Grant 7,750,248 - Inui , et al. July 6, 2
2010-07-06
Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same
Grant 7,580,240 - Yamamoto , et al. August 25, 2
2009-08-25
Built-in capacitor type wiring board and method for manufacturing the same
Grant 7,532,453 - Yamamoto , et al. May 12, 2
2009-05-12
Wiring board construction including embedded ceramic capacitors(s)
Grant 7,473,988 - Urashima , et al. January 6, 2
2009-01-06
Wiring Board and Wiring Board Manufacturing Method
App 20080289866 - Yuri; Shinji ;   et al.
2008-11-27
Wiring Board With Built-in Component And Method For Manufacturing The Same
App 20080277150 - Takashima; Tsuneaki ;   et al.
2008-11-13
Capacitor And Wiring Board Including The Capacitor
App 20080251285 - Sato; Motohiko ;   et al.
2008-10-16
Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate
Grant 7,348,069 - Ichiyanagi , et al. March 25, 2
2008-03-25
Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
Grant 7,332,231 - Ichiyanagi , et al. February 19, 2
2008-02-19
Assembly of semiconductor device, interposer and substrate
Grant 7,327,554 - Otsuka , et al. February 5, 2
2008-02-05
Capacitor and method for manufacturing the same
Grant 7,321,495 - Hayashi , et al. January 22, 2
2008-01-22
Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
App 20070145449 - Sato; Motohiko ;   et al.
2007-06-28
Capacitor and method for manufacturing the same
Grant 7,233,480 - Hayashi , et al. June 19, 2
2007-06-19
Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure
App 20070125575 - Inui; Yasuhiko ;   et al.
2007-06-07
Built-in capacitor type wiring board and method for manufacturing the same
App 20070121273 - Yamamoto; Hiroshi ;   et al.
2007-05-31
Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same
App 20070117338 - Yamamoto; Hiroshi ;   et al.
2007-05-24
Wiring board construction including embedded ceramic capacitors(s)
App 20070045815 - Urashima; Kazuhiro ;   et al.
2007-03-01
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
App 20070030628 - Yamamoto; Hiroshi ;   et al.
2007-02-08
Capacitor and method for manufacturing the same
App 20060245142 - Hayashi; Kazuhiro ;   et al.
2006-11-02
Method for producing ceramic substrate, and ceramic substrate
Grant 7,105,070 - Tosa , et al. September 12, 2
2006-09-12
Capacitor and method for manufacturing the same
Grant 7,072,169 - Hayashi , et al. July 4, 2
2006-07-04
Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
Grant 6,961,230 - Otsuka , et al. November 1, 2
2005-11-01
Multi-layer capacitor and method for producing the same
Grant 6,905,936 - Murakami , et al. June 14, 2
2005-06-14
Capacitor and method for manufacturing the same
App 20050122662 - Hayashi, Kazuhiro ;   et al.
2005-06-09
Capacitor and method for manufacturing the same
App 20050121772 - Hayashi, Kazuhiro ;   et al.
2005-06-09
Capacitor, and capacitor manufacturing process
Grant 6,885,541 - Otsuka , et al. April 26, 2
2005-04-26
Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate
App 20050078433 - Ichiyanagi, Seiji ;   et al.
2005-04-14
Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
App 20050074627 - Ichiyanagi, Seiji ;   et al.
2005-04-07
Method for producing ceramic substrate, and ceramic substrate
App 20050051253 - Tosa, Akifumi ;   et al.
2005-03-10
Dielectric porcelain composition
Grant 6,844,284 - Tosa , et al. January 18, 2
2005-01-18
Multi-layer capacitor and method for producing the same
App 20050007724 - Murakami, Kenji ;   et al.
2005-01-13
Capacitor, and capacitor manufacturing process
App 20040264103 - Otsuka, Jun ;   et al.
2004-12-30
Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
App 20040257749 - Otsuka, Jun ;   et al.
2004-12-23
Method for producing multi-layer electronic component
App 20040226647 - Ito, Junichi ;   et al.
2004-11-18
Assembly of semiconductor device, interposer and substrate
App 20040184219 - Otsuka, Jun ;   et al.
2004-09-23
Multi-layer capacitor and method for producing the same
Grant 6,795,295 - Murakami , et al. September 21, 2
2004-09-21
Gate valve
Grant D495,035 - Otsuka August 24, 2
2004-08-24
Multi-layer capacitor and method for producing the same
App 20040125539 - Murakami, Kenji ;   et al.
2004-07-01
Dielectric composition for high frequency resonators
Grant 6,720,280 - Yamagiwa , et al. April 13, 2
2004-04-13
Dielectric composition for high frequency resonators
App 20030176273 - Yamagiwa, Katsuya ;   et al.
2003-09-18
Dielectric porcelain composition
App 20030119657 - Tosa, Akifumi ;   et al.
2003-06-26
Aluminum oxide-based sintered object and process for producing the same
Grant 5,286,684 - Otsuka , et al. February 15, 1
1994-02-15

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