OTSUBO; Yoshihito
Patent Applications and Registrations
Patent applications and USPTO patent grants for OTSUBO; Yoshihito.The latest application filed is for "module".
Company Profile
45.84.108
- OTSUBO; Yoshihito - Nagaokakyo-shi JP
- Otsubo; Yoshihito - Kyoto JP
- Otsubo; Yoshihito - Nagaokakyo JP
- Otsubo; Yoshihito - Kyoto-fu JP
Patent Activity
| Patent | Date |
|---|---|
| Module App 20220304201 - OTSUBO; Yoshihito ; et al. | 2022-09-22 |
| Coil component Grant 11,430,601 - Otsubo , et al. August 30, 2 | 2022-08-30 |
| Module Grant 11,419,215 - Otsubo , et al. August 16, 2 | 2022-08-16 |
| Electronic Component Module App 20220208690 - NOMURA; Tadashi ; et al. | 2022-06-30 |
| Inductor component and method for manufacturing inductor component Grant 11,373,796 - Otsubo , et al. June 28, 2 | 2022-06-28 |
| Module App 20220199568 - OTSUBO; Yoshihito ; et al. | 2022-06-23 |
| Module App 20220199485 - OTSUBO; Yoshihito ; et al. | 2022-06-23 |
| Module App 20220199504 - OTSUBO; Yoshihito ; et al. | 2022-06-23 |
| Module App 20220173085 - OTSUBO; Yoshihito ; et al. | 2022-06-02 |
| High-frequency module Grant 11,348,894 - Otsubo , et al. May 31, 2 | 2022-05-31 |
| Module App 20220159825 - OTSUBO; Yoshihito ; et al. | 2022-05-19 |
| Module App 20220159834 - OTSUBO; Yoshihito ; et al. | 2022-05-19 |
| High-frequency module and manufacturing method thereof Grant 11,335,645 - Otsubo , et al. May 17, 2 | 2022-05-17 |
| Module Grant 11,322,472 - Otsubo , et al. May 3, 2 | 2022-05-03 |
| High-frequency module Grant 11,302,606 - Otsubo , et al. April 12, 2 | 2022-04-12 |
| High-frequency module Grant 11,297,746 - Otsubo , et al. April 5, 2 | 2022-04-05 |
| Radio-frequency module with shield wall Grant 11,291,108 - Otsubo March 29, 2 | 2022-03-29 |
| Module Grant 11,264,366 - Otsubo , et al. March 1, 2 | 2022-03-01 |
| Inductor component manufacturing method and inductor component Grant 11,239,022 - Otsubo , et al. February 1, 2 | 2022-02-01 |
| Electronic module having improved shield performance Grant 11,227,840 - Otsubo , et al. January 18, 2 | 2022-01-18 |
| Module App 20220007494 - Yamamoto; Yukio ; et al. | 2022-01-06 |
| Module App 20210392738 - Otsubo; Yoshihito ; et al. | 2021-12-16 |
| Module App 20210366839 - OTSUBO; Yoshihito ; et al. | 2021-11-25 |
| Radio-frequency module Grant 11,183,465 - Otsubo November 23, 2 | 2021-11-23 |
| Module including heat dissipation structure Grant 11,177,189 - Otsubo , et al. November 16, 2 | 2021-11-16 |
| Module having a sealing resin layer with radiating member filled depressions Grant 11,171,067 - Otsubo November 9, 2 | 2021-11-09 |
| Inductor component Grant 11,164,695 - Otsubo , et al. November 2, 2 | 2021-11-02 |
| Stacked electronic component and method for manufacturing stacked electronic component Grant 11,152,157 - Yamamoto , et al. October 19, 2 | 2021-10-19 |
| Coil component Grant 11,139,101 - Otsubo , et al. October 5, 2 | 2021-10-05 |
| Ceramic Electronic Component App 20210259104 - MURAKITA; Naoya ; et al. | 2021-08-19 |
| Coil module Grant 11,075,029 - Banba , et al. July 27, 2 | 2021-07-27 |
| Module App 20210225779 - OTSUBO; Yoshihito ; et al. | 2021-07-22 |
| Module App 20210217704 - OTSUBO; Yoshihito ; et al. | 2021-07-15 |
| Module App 20210204456 - OTSUBO; Yoshihito ; et al. | 2021-07-01 |
| Ceramic electronic component Grant 11,051,398 - Matsushita , et al. June 29, 2 | 2021-06-29 |
| Module App 20210136917 - OTSUBO; Yoshihito ; et al. | 2021-05-06 |
| Module Grant 10,999,956 - Otsubo May 4, 2 | 2021-05-04 |
| High-frequency Module App 20210066237 - OTSUBO; Yoshihito ; et al. | 2021-03-04 |
| High-frequency component Grant 10,912,188 - Otsubo , et al. February 2, 2 | 2021-02-02 |
| Coil component Grant 10,886,059 - Otsubo , et al. January 5, 2 | 2021-01-05 |
| Radio-frequency module Grant 10,863,656 - Otsubo December 8, 2 | 2020-12-08 |
| High-frequency Module App 20200381336 - OTSUBO; Yoshihito ; et al. | 2020-12-03 |
| Radio Frequency Module App 20200365476 - OTSUBO; Yoshihito ; et al. | 2020-11-19 |
| High-frequency Module App 20200337187 - OTSUBO; Yoshihito ; et al. | 2020-10-22 |
| Module App 20200303336 - OTSUBO; Yoshihito ; et al. | 2020-09-24 |
| Module App 20200294980 - OTSUBO; Yoshihito ; et al. | 2020-09-17 |
| High-frequency module Grant 10,772,244 - Otsubo , et al. Sep | 2020-09-08 |
| High-frequency Module App 20200281102 - OTSUBO; Yoshihito ; et al. | 2020-09-03 |
| Inductor component Grant 10,734,156 - Otsubo , et al. | 2020-08-04 |
| Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device Grant 10,734,150 - Otsubo , et al. | 2020-08-04 |
| Resin Multilayer Substrate App 20200245473 - Kind Code | 2020-07-30 |
| Inductor component and manufacturing method for inductor component Grant 10,726,988 - Otsubo , et al. | 2020-07-28 |
| High-frequency Module And Manufacturing Method Thereof App 20200203288 - OTSUBO; Yoshihito ; et al. | 2020-06-25 |
| Inductor component and method for manufacturing the same Grant 10,672,554 - Sakai , et al. | 2020-06-02 |
| High-frequency module Grant 10,674,648 - Otsubo | 2020-06-02 |
| High frequency module Grant 10,667,381 - Otsubo | 2020-05-26 |
| High-frequency Module App 20200161259 - OTSUBO; Yoshihito ; et al. | 2020-05-21 |
| Resin multilayer substrate Grant 10,660,219 - Otsubo , et al. | 2020-05-19 |
| Stacked Electronic Component And Method For Manufacturing Stacked Electronic Component App 20200082990 - YAMAMOTO; Issei ; et al. | 2020-03-12 |
| Multilayer substrate Grant 10,575,399 - Otsubo Feb | 2020-02-25 |
| High-frequency module and manufacturing method therefor Grant 10,559,535 - Otsubo , et al. Feb | 2020-02-11 |
| Module App 20200043864 - OTSUBO; Yoshihito ; et al. | 2020-02-06 |
| Module App 20200043865 - OTSUBO; Yoshihito ; et al. | 2020-02-06 |
| Coil component and module including the same Grant 10,553,341 - Otsubo , et al. Fe | 2020-02-04 |
| Component-embedded resin substrate and method for manufacturing same Grant 10,555,421 - Otsubo Fe | 2020-02-04 |
| Radio-frequency Module App 20200022250 - OTSUBO; Yoshihito | 2020-01-16 |
| Module App 20200020605 - OTSUBO; Yoshihito ; et al. | 2020-01-16 |
| Module App 20200006172 - OTSUBO; Yoshihito | 2020-01-02 |
| Module App 20200008325 - OTSUBO; Yoshihito | 2020-01-02 |
| Resin multilayer substrate Grant 10,524,352 - Otsubo Dec | 2019-12-31 |
| Radio-frequency Module App 20190393166 - OTSUBO; Yoshihito | 2019-12-26 |
| Inductor component and method of manufacturing inductor component Grant 10,506,717 - Otsubo , et al. Dec | 2019-12-10 |
| Electrical element, mobile device, and method for manufacturing electrical element Grant 10,476,133 - Okamoto , et al. Nov | 2019-11-12 |
| Component built-in device Grant 10,467,516 - Osamura , et al. No | 2019-11-05 |
| Resin board structure and method for fabricating the same Grant 10,455,701 - Otsubo , et al. Oc | 2019-10-22 |
| Module and method for manufacturing the module Grant 10,424,430 - Nishide , et al. Sept | 2019-09-24 |
| Inductor and method for manufacturing the same Grant 10,418,168 - Otsubo , et al. Sept | 2019-09-17 |
| Coil module Grant 10,410,782 - Otsubo , et al. Sept | 2019-09-10 |
| Radio-frequency Module App 20190273312 - OTSUBO; Yoshihito | 2019-09-05 |
| High-frequency Module App 20190274237 - OTSUBO; Yoshihito | 2019-09-05 |
| High Frequency Module App 20190274212 - OTSUBO; Yoshihito | 2019-09-05 |
| Coil component, coil module, and method for manufacturing coil component Grant 10,403,431 - Banba , et al. Sep | 2019-09-03 |
| Resin multilayer substrate and method of manufacturing the same Grant 10,362,672 - Otsubo , et al. | 2019-07-23 |
| High-frequency module Grant 10,349,512 - Otsubo , et al. July 9, 2 | 2019-07-09 |
| Ceramic Electronic Component App 20190208622 - MATSUSHITA; Yosuke ; et al. | 2019-07-04 |
| High-frequency module Grant 10,342,116 - Otsubo , et al. | 2019-07-02 |
| Resin Multilayer Substrate App 20190174639 - OTSUBO; Yoshihito ; et al. | 2019-06-06 |
| High-frequency module Grant 10,312,172 - Otsubo | 2019-06-04 |
| Flexible substrate Grant 10,271,423 - Otsubo | 2019-04-23 |
| Multilayer wiring board and probe card having the same Grant 10,231,331 - Otsubo , et al. | 2019-03-12 |
| Resin Multilayer Substrate App 20190075649 - OTSUBO; Yoshihito | 2019-03-07 |
| ESD protection device Grant 10,219,362 - Otsubo Feb | 2019-02-26 |
| Ceramic electronic component and manufacturing method thereof Grant 10,178,774 - Iwakoshi , et al. J | 2019-01-08 |
| Inductor And Method For Manufacturing The Same App 20180366258 - Otsubo; Yoshihito ; et al. | 2018-12-20 |
| ESD protection device and method for producing the same Grant RE47,147 - Otsubo Nov | 2018-11-27 |
| Inductor Component And Method Of Manufacturing Inductor Component App 20180332709 - Otsubo; Yoshihito ; et al. | 2018-11-15 |
| Inductor Component And Method For Manufacturing The Same App 20180330870 - SAKAI; Norio ; et al. | 2018-11-15 |
| Inductor Component And Method For Manufacturing Inductor Component App 20180315543 - OTSUBO; Yoshihito ; et al. | 2018-11-01 |
| Component Built-in Device, Rfid Tag, And Method For Manufacturing Component Built-in Device App 20180293480 - OSAMURA; Makoto ; et al. | 2018-10-11 |
| Resin multilayer substrate Grant 10,080,280 - Sakai , et al. September 18, 2 | 2018-09-18 |
| Electronic circuit module Grant 10,056,311 - Otsubo , et al. August 21, 2 | 2018-08-21 |
| High-frequency Module App 20180204781 - OTSUBO; Yoshihito | 2018-07-19 |
| High-frequency Module App 20180199428 - OTSUBO; Yoshihito ; et al. | 2018-07-12 |
| Resin substrate combined structure Grant 10,021,787 - Otsubo , et al. July 10, 2 | 2018-07-10 |
| Resin Board Structure And Method For Fabricating The Same App 20180192518 - OTSUBO; Yoshihito ; et al. | 2018-07-05 |
| High-frequency Module And Manufacturing Method Therefor App 20180166394 - OTSUBO; Yoshihito ; et al. | 2018-06-14 |
| Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card Grant 9,961,768 - Otsubo , et al. May 1, 2 | 2018-05-01 |
| Resin multilayer substrate and component module Grant 9,936,575 - Otsubo April 3, 2 | 2018-04-03 |
| High-frequency Module App 20180092201 - Otsubo; Yoshihito ; et al. | 2018-03-29 |
| High-frequency Module App 20180092257 - Otsubo; Yoshihito ; et al. | 2018-03-29 |
| Inductor Component App 20180090263 - Otsubo; Yoshihito ; et al. | 2018-03-29 |
| Multilayer electronic device and manufacturing method therefor Grant 9,907,180 - Otsubo , et al. February 27, 2 | 2018-02-27 |
| Esd Protection Device App 20180049302 - OTSUBO; Yoshihito | 2018-02-15 |
| Multilayer substrate Grant 9,854,680 - Otsubo December 26, 2 | 2017-12-26 |
| ESD protection device Grant 9,837,795 - Otsubo , et al. December 5, 2 | 2017-12-05 |
| Resin Multilayer Substrate App 20170347447 - Sakai; Norio ; et al. | 2017-11-30 |
| ESD protection device Grant 9,826,611 - Otsubo November 21, 2 | 2017-11-21 |
| Electronic Circuit Module App 20170323838 - OTSUBO; Yoshihito ; et al. | 2017-11-09 |
| Coil Component App 20170316858 - OTSUBO; Yoshihito ; et al. | 2017-11-02 |
| Coil Component App 20170301456 - OTSUBO; Yoshihito ; et al. | 2017-10-19 |
| Module substrate and method for manufacturing module substrate Grant 9,781,828 - Yamamoto , et al. October 3, 2 | 2017-10-03 |
| Resin multilayer substrate Grant 9,769,917 - Sakai , et al. September 19, 2 | 2017-09-19 |
| Coil Component App 20170236635 - Otsubo; Yoshihito ; et al. | 2017-08-17 |
| High-frequency Component App 20170231085 - Otsubo; Yoshihito ; et al. | 2017-08-10 |
| Coil Component App 20170221624 - OTSUBO; Yoshihito ; et al. | 2017-08-03 |
| Inductor Component App 20170213638 - Otsubo; Yoshihito ; et al. | 2017-07-27 |
| Electronic component Grant 9,697,946 - Otsubo July 4, 2 | 2017-07-04 |
| Inductor Component And Manufacturing Method For Inductor Component App 20170186528 - Otsubo; Yoshihito ; et al. | 2017-06-29 |
| Inductor Component Manufacturing Method And Inductor Component App 20170178796 - OTSUBO; Yoshihito ; et al. | 2017-06-22 |
| Ceramic multilayer substrate Grant 9,681,534 - Otsubo June 13, 2 | 2017-06-13 |
| Resin Substrate Combined Structure App 20170094793 - OTSUBO; Yoshihito ; et al. | 2017-03-30 |
| Coil Module App 20170092415 - BANBA; Shinichiro ; et al. | 2017-03-30 |
| Coil Component App 20170084384 - OTSUBO; Yoshihito ; et al. | 2017-03-23 |
| ESD protective device Grant 9,590,417 - Otsubo March 7, 2 | 2017-03-07 |
| Coil Component And Module Including The Same App 20170062113 - Otsubo; Yoshihito ; et al. | 2017-03-02 |
| Resin Multilayer Substrate And Method Of Manufacturing The Same App 20170034911 - OTSUBO; Yoshihito ; et al. | 2017-02-02 |
| Multilayer Circuit Board And Probe Card Including The Same App 20170019990 - Takemura; Tadaji ; et al. | 2017-01-19 |
| Coil Module App 20170018349 - OTSUBO; Yoshihito ; et al. | 2017-01-19 |
| Module And Method For Manufacturing The Module App 20170004914 - NISHIDE; Mitsuyoshi ; et al. | 2017-01-05 |
| Method of manufacturing module Grant 9,538,649 - Ogawa , et al. January 3, 2 | 2017-01-03 |
| Electrical Element, Mobile Device, And Method For Manufacturing Electrical Element App 20160372819 - OKAMOTO; Bunta ; et al. | 2016-12-22 |
| Coil Component, Coil Module, And Method For Manufacturing Coil Component App 20160372259 - BANBA; Shinichiro ; et al. | 2016-12-22 |
| Inductor Device, Inductor Array, And Multilayered Substrate, And Method For Manufacturing Inductor Device App 20160372246 - OTSUBO; Yoshihito ; et al. | 2016-12-22 |
| Method of manufacturing multilayer wiring board, probe card including multilayer wiring board manufactured by the method, and multilayer wiring board Grant 9,523,709 - Otsubo December 20, 2 | 2016-12-20 |
| Component-embedded resin substrate Grant 9,526,176 - Sakai , et al. December 20, 2 | 2016-12-20 |
| ESD protection device Grant 9,502,891 - Otsubo November 22, 2 | 2016-11-22 |
| Multilayer Substrate App 20160330844 - OTSUBO; Yoshihito | 2016-11-10 |
| Multilayer wiring substrate Grant 9,468,100 - Otsubo October 11, 2 | 2016-10-11 |
| Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate Grant 9,456,494 - Sakai , et al. September 27, 2 | 2016-09-27 |
| Method for producing multi-layer substrate and multi-layer substrate Grant 9,451,700 - Otsubo September 20, 2 | 2016-09-20 |
| Resin Multilayer Substrate And Component Module App 20160270221 - OTSUBO; Yoshihito | 2016-09-15 |
| Multilayer Wiring Board And Probe Card Having The Same App 20160270222 - Otsubo; Yoshihito ; et al. | 2016-09-15 |
| Rigid-flexible substrate and method for manufacturing the same Grant 9,402,307 - Otsubo , et al. July 26, 2 | 2016-07-26 |
| ESD protection device and method for producing the same Grant 9,398,673 - Otsubo July 19, 2 | 2016-07-19 |
| Ceramic multilayer substrate and method for manufacturing the same Grant 9,380,699 - Otsubo June 28, 2 | 2016-06-28 |
| Multilayer Substrate App 20160150636 - OTSUBO; Yoshihito | 2016-05-26 |
| Esd Protection Device App 20160081172 - OTSUBO; Yoshihito | 2016-03-17 |
| Multilayer Wiring Substrate, Manufacturing Method Therefor, And Substrate For Probe Card App 20160044782 - Otsubo; Yoshihito ; et al. | 2016-02-11 |
| Multilayer flexible substrate Grant 9,253,881 - Sakai , et al. February 2, 2 | 2016-02-02 |
| Component-embedded resin substrate Grant 9,241,409 - Otsubo January 19, 2 | 2016-01-19 |
| Flexible multilayer substrate Grant 9,241,402 - Otsubo , et al. January 19, 2 | 2016-01-19 |
| Flexible Substrate App 20150289363 - OTSUBO; Yoshihito | 2015-10-08 |
| Multilayer Electronic Device And Manufacturing Method Therefor App 20150282327 - OTSUBO; Yoshihito ; et al. | 2015-10-01 |
| Esd Protection Device App 20150263489 - Otsubo; Yoshihito ; et al. | 2015-09-17 |
| Ceramic multilayer substrate and manufacturing method therefor Grant 9,056,442 - Otsubo June 16, 2 | 2015-06-16 |
| Flexible multilayer substrate Grant 9,012,785 - Otsubo April 21, 2 | 2015-04-21 |
| Method Of Manufacturing Multilayer Wiring Board, Probe Card Including Multilayer Wiring Board Manufactured By The Method, And Multilayer Wiring Board App 20150008951 - OTSUBO; Yoshihito | 2015-01-08 |
| Monolithic ceramic electronic component and producing method therefor Grant 8,912,874 - Otsubo December 16, 2 | 2014-12-16 |
| Electronic Component App 20140333407 - Otsubo; Yoshihito | 2014-11-13 |
| Multilayer Wiring Substrate App 20140318847 - Otsubo; Yoshihito | 2014-10-30 |
| Resin Multilayer Substrate App 20140321076 - Sakai; Norio ; et al. | 2014-10-30 |
| Module, Method For Manufacturing The Module, And Electronic Apparatus Including The Module App 20140251670 - SAKAI; Norio ; et al. | 2014-09-11 |
| Esd Protective Device App 20140240878 - OTSUBO; Yoshihito | 2014-08-28 |
| Component-embedded Resin Substrate App 20140226288 - Otsubo; Yoshihito | 2014-08-14 |
| Component-embedded Resin Substrate App 20140218884 - Sakai; Norio ; et al. | 2014-08-07 |
| Multilayer Wiring Substrate, Probe Card, And Method For Manufacturing Multilayer Wiring Substrate App 20140209356 - SAKAI; Norio ; et al. | 2014-07-31 |
| Method Of Manufacturing Module And Module App 20140185256 - Ogawa; Nobuaki ; et al. | 2014-07-03 |
| Esd Protection Device App 20140177114 - Otsubo; Yoshihito | 2014-06-26 |
| Flexible Multilayer Substrate App 20140110155 - OTSUBO; Yoshihito ; et al. | 2014-04-24 |
| Method For Producing Multi-layer Substrate And Multi-layer Substrate App 20140085843 - Otsubo; Yoshihito | 2014-03-27 |
| Ceramic Electronic Component And Manufacturing Method Thereof App 20140057080 - IWAKOSHI; Kunio ; et al. | 2014-02-27 |
| Flexible Multilayer Substrate App 20140034365 - OTSUBO; Yoshihito | 2014-02-06 |
| Ceramic Multilayer Substrate And Method For Manufacturing The Same App 20140036467 - OTSUBO; Yoshihito | 2014-02-06 |
| Rigid-flexible Substrate And Method For Manufacturing The Same App 20140034366 - OTSUBO; Yoshihito ; et al. | 2014-02-06 |
| Component-embedded Resin Substrate And Method For Manufacturing Same App 20140030471 - Otsubo; Yoshihito | 2014-01-30 |
| Ceramic Multilayer Substrate App 20130341080 - OTSUBO; Yoshihito | 2013-12-26 |
| Ceramic Multilayer Substrate And Manufacturing Method Therefor App 20130330509 - OTSUBO; Yoshihito | 2013-12-12 |
| Esd Protection Device And Method For Producing The Same App 20130279064 - Otsubo; Yoshihito | 2013-10-24 |
| Multilayer Flexible Substrate App 20130256001 - SAKAI; Norio ; et al. | 2013-10-03 |
| Module Substrate And Method For Manufacturing Module Substrate App 20130223038 - YAMAMOTO; Issei ; et al. | 2013-08-29 |
| Electronic Component And Method For Manufacturing The Same App 20130155639 - OGAWA; Nobuaki ; et al. | 2013-06-20 |
| Monolithic Ceramic Electronic Component And Producing Method Therefor App 20130113595 - OTSUBO; Yoshihito | 2013-05-09 |
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