| Patent | Date |
|---|
Soldering a conductor to an aluminum metallization
Grant 11,450,642 - Riedl , et al. September 20, 2 | 2022-09-20 |
Soldering a conductor to an aluminum layer
Grant 11,424,217 - Heinrich , et al. August 23, 2 | 2022-08-23 |
Method Of Fabricating A Semiconductor Package
App 20220230941 - Dinkel; Markus ; et al. | 2022-07-21 |
Multi-chip package
Grant 11,355,424 - Otremba , et al. June 7, 2 | 2022-06-07 |
Chip Package, Semiconductor Arrangement, Method Of Forming A Chip Package, And Method Of Forming A Semiconductor Arrangement
App 20220173006 - Gan; Thai Kee ; et al. | 2022-06-02 |
Package With Load Terminals On Which Coupled Power Component And Logic Component Are Mounted
App 20220173023 - OTREMBA; Ralf | 2022-06-02 |
Molded Semiconductor Package With Dual Integrated Heat Spreaders
App 20220157686 - Joanna Chye; Jo Ean ; et al. | 2022-05-19 |
Multi-Device Semiconductor Chip with Electrical Access to Devices at Either Side
App 20220149038 - Fuergut; Edward ; et al. | 2022-05-12 |
Linear Spacer For Spacing A Carrier Of A Package
App 20220148934 - Fuergut; Edward ; et al. | 2022-05-12 |
Package for a multi-chip power semiconductor device
Grant 11,329,000 - Otremba May 10, 2 | 2022-05-10 |
Semiconductor package and method of fabricating a semiconductor package
Grant 11,302,610 - Dinkel , et al. April 12, 2 | 2022-04-12 |
Semiconductor Package And Method Of Manufacturing A Semiconductor Package
App 20220102253 - Beer; Thomas ; et al. | 2022-03-31 |
Semiconductor Package Having A Chip Carrier With A Pad Offset Feature
App 20220102263 - Ng; Chee Yang ; et al. | 2022-03-31 |
Semiconductor Device Including a Bidirectional Switch
App 20220093496 - Otremba; Ralf ; et al. | 2022-03-24 |
Semiconductor Device Package Comprising Side Walls Connected with Contact Pads of a Semiconductor Die
App 20220037240 - Palm; Petteri ; et al. | 2022-02-03 |
Semiconductor device including a bidirectional switch
Grant 11,217,510 - Otremba , et al. January 4, 2 | 2022-01-04 |
Assembly and method for mounting an electronic component to a substrate
Grant 11,211,304 - Otremba , et al. December 28, 2 | 2021-12-28 |
Power Semiconductor Device and Method for Fabricating a Power Semiconductor Device
App 20210225795 - Otremba; Ralf ; et al. | 2021-07-22 |
Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip
App 20210175157 - Otremba; Ralf ; et al. | 2021-06-10 |
Semiconductor Package and Method for Fabricating a Semiconductor Package
App 20210134708 - Otremba; Ralf ; et al. | 2021-05-06 |
Soldering A Conductor To An Aluminum Metallization
App 20210118843 - Riedl; Edmund ; et al. | 2021-04-22 |
Multi-Chip Package
App 20210074614 - Otremba; Ralf ; et al. | 2021-03-11 |
Semiconductor Package Including A Cavity In Its Package Body
App 20210035876 - Otremba; Ralf ; et al. | 2021-02-04 |
Soldering A Conductor To An Aluminum Layer
App 20210035945 - Heinrich; Alexander ; et al. | 2021-02-04 |
Method of producing an SMD package with top side cooling
Grant 10,903,133 - Otremba , et al. January 26, 2 | 2021-01-26 |
Semiconductor Package, Semiconductor Assembly And Method For Fabricating A Semiconductor Package
App 20210020539 - Otremba; Ralf ; et al. | 2021-01-21 |
Soldering a conductor to an aluminum metallization
Grant 10,896,893 - Riedl , et al. January 19, 2 | 2021-01-19 |
Soldering a conductor to an aluminum metallization
Grant 10,892,247 - Riedl , et al. January 12, 2 | 2021-01-12 |
Semiconductor package system
Grant 10,886,186 - Scharf , et al. January 5, 2 | 2021-01-05 |
Semiconductor Package and Method of Forming a Semiconductor Package
App 20200365548 - Fuergut; Edward ; et al. | 2020-11-19 |
Chip Package, Method of Forming a Chip Package, Semiconductor Device, Semiconductor Arrangement, Three-Phase-System, Method of Forming a Semiconductor Device, and Method of Forming a Semiconductor Arrangement
App 20200328141 - Naeve; Tomasz ; et al. | 2020-10-15 |
Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material
Grant 10,763,246 - Otremba , et al. Sep | 2020-09-01 |
Package for a Multi-Chip Power Semiconductor Device
App 20200273802 - Otremba; Ralf | 2020-08-27 |
Multi-package top-side-cooling
Grant 10,755,999 - Otremba , et al. A | 2020-08-25 |
Method of manufacturing a package having a power semiconductor chip
Grant 10,734,250 - Basler , et al. | 2020-08-04 |
Soldering A Conductor To An Aluminum Metallization
App 20200243480 - Riedl; Edmund ; et al. | 2020-07-30 |
Soldering A Conductor To An Aluminum Metallization
App 20200219841 - Riedl; Edmund ; et al. | 2020-07-09 |
Device including a compound semiconductor chip
Grant 10,698,021 - Otremba , et al. | 2020-06-30 |
SMD package with flat contacts to prevent bottleneck
Grant 10,699,987 - Otremba , et al. | 2020-06-30 |
SMD package with top side cooling
Grant 10,699,978 - Otremba , et al. | 2020-06-30 |
Method of Producing an SMD Package with Top Side Cooling
App 20200144150 - Otremba; Ralf ; et al. | 2020-05-07 |
Semiconductor Package and Method of Fabricating a Semiconductor Package
App 20200135619 - Dinkel; Markus ; et al. | 2020-04-30 |
Soldering a conductor to an aluminum metallization
Grant 10,615,145 - Riedl , et al. | 2020-04-07 |
Method of Manufacturing a Multi-Chip Semiconductor Power Device
App 20200083207 - Otremba; Ralf ; et al. | 2020-03-12 |
SMD package with top side cooling
Grant 10,566,260 - Otremba , et al. Feb | 2020-02-18 |
Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof
App 20200006187 - Otremba; Ralf ; et al. | 2020-01-02 |
Semiconductor Package System
App 20190304858 - Scharf; Thorsten ; et al. | 2019-10-03 |
Multi-Package Top-Side-Cooling
App 20190295920 - Otremba; Ralf ; et al. | 2019-09-26 |
Semiconductor devices with improved thermal and electrical performance
Grant 10,373,897 - Otremba , et al. | 2019-08-06 |
Semiconductor device having die pads with exposed surfaces
Grant 10,373,895 - Fuergut , et al. | 2019-08-06 |
Method of Manufacturing a Package Having a Power Semiconductor Chip
App 20190198355 - Basler; Thomas ; et al. | 2019-06-27 |
Electronic component
Grant 10,290,566 - Otremba , et al. | 2019-05-14 |
Method of manufacturing a semiconductor power package
Grant 10,256,119 - Basler , et al. | 2019-04-09 |
SMD Package with Top Side Cooling
App 20190080980 - Otremba; Ralf ; et al. | 2019-03-14 |
SMD Package with Top Side Cooling
App 20190080973 - Otremba; Ralf ; et al. | 2019-03-14 |
Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
Grant 10,229,870 - Otremba | 2019-03-12 |
Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package
Grant 10,224,912 - Otremba , et al. | 2019-03-05 |
Assembly and Method for Mounting an Electronic Component to a Substrate
App 20190057923 - Otremba; Ralf ; et al. | 2019-02-21 |
Semiconductor chip package having a repeating footprint pattern
Grant 10,204,845 - Otremba , et al. Feb | 2019-02-12 |
Soldering A Conductor To An Aluminum Metallization
App 20190035764 - Riedl; Edmund ; et al. | 2019-01-31 |
Connection structure and electronic component
Grant 10,109,609 - Otremba , et al. October 23, 2 | 2018-10-23 |
SMD Package
App 20180301398 - Otremba; Ralf ; et al. | 2018-10-18 |
Device Including a Compound Semiconductor Chip
App 20180224496 - Otremba; Ralf ; et al. | 2018-08-09 |
Semiconductor chip package having contact pins at short side edges
Grant 10,037,934 - Otremba , et al. July 31, 2 | 2018-07-31 |
Semiconductor Devices Including Exposed Opposing Die Pads
App 20180166366 - Fuergut; Edward ; et al. | 2018-06-14 |
Leadframe and method of manufacturing the same
App 20180158758 - OTREMBA; Ralf ; et al. | 2018-06-07 |
Semiconductor component having inner and outer semiconductor component housings
Grant 9,991,183 - Hoeglauer , et al. June 5, 2 | 2018-06-05 |
Semiconductor Device Including a Bidirectional Switch
App 20180151481 - Otremba; Ralf ; et al. | 2018-05-31 |
Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards
Grant 9,986,636 - Mahler , et al. May 29, 2 | 2018-05-29 |
Power semiconductor device
Grant 9,978,671 - Otremba , et al. May 22, 2 | 2018-05-22 |
Semiconductor chip package comprising side wall marking
Grant 9,972,576 - Otremba , et al. May 15, 2 | 2018-05-15 |
Package and a method of manufacturing the same
Grant 9,961,798 - Otremba , et al. May 1, 2 | 2018-05-01 |
Compound semiconductor device including a sensing lead
Grant 9,952,273 - Otremba , et al. April 24, 2 | 2018-04-24 |
Method of Manufacturing a Semiconductor Power Package
App 20180102262 - Basler; Thomas ; et al. | 2018-04-12 |
Functionalized interface structure
Grant 9,922,910 - Otremba , et al. March 20, 2 | 2018-03-20 |
Semiconductor Chip Package Having a Repeating Footprint Pattern
App 20180061745 - Otremba; Ralf ; et al. | 2018-03-01 |
Electronic component and switch circuit
Grant 9,899,481 - Otremba , et al. February 20, 2 | 2018-02-20 |
Top side cooling for GaN power device
Grant 9,881,862 - Otremba , et al. January 30, 2 | 2018-01-30 |
Semiconductor device and method for producing the same
Grant 9,875,935 - Mauder , et al. January 23, 2 | 2018-01-23 |
Semiconductor power package and method of manufacturing the same
Grant 9,837,288 - Basler , et al. December 5, 2 | 2017-12-05 |
Chip carrier structure, chip package and method of manufacturing the same
Grant 9,824,958 - Otremba , et al. November 21, 2 | 2017-11-21 |
Semiconductor package with top side cooling heat sink thermal pathway
Grant 9,812,373 - Fachmann , et al. November 7, 2 | 2017-11-07 |
Device Including a Semiconductor Chip Monolithically Integrated with a Driver Circuit in a Semiconductor Material
App 20170317001 - Otremba; Ralf ; et al. | 2017-11-02 |
Transistor arrangement with semiconductor chips between two substrates
Grant 9,806,029 - Otremba , et al. October 31, 2 | 2017-10-31 |
Power semiconductor device including a cooling material
Grant 9,793,255 - Mahler , et al. October 17, 2 | 2017-10-17 |
Lateral element isolation device
Grant 9,786,584 - Otremba , et al. October 10, 2 | 2017-10-10 |
Half Bridge Circuit, Method of Operating a Half Bridge Circuit and a Half Bridge Circuit Package
App 20170288654 - Otremba; Ralf ; et al. | 2017-10-05 |
Redirecting solder material to visually inspectable package surface
App 20170278762 - KESSLER; Angela ; et al. | 2017-09-28 |
Semiconductor device having sensing functionality
Grant 9,754,854 - Otremba , et al. September 5, 2 | 2017-09-05 |
Compound semiconductor device including a multilevel carrier
Grant 9,754,862 - Otremba , et al. September 5, 2 | 2017-09-05 |
Semiconductor devices including control and load leads of opposite directions
Grant 9,748,166 - Otremba , et al. August 29, 2 | 2017-08-29 |
Electronic device and method of manufacturing the same
Grant 9,748,116 - Otremba , et al. August 29, 2 | 2017-08-29 |
Device including multiple semiconductor chips and multiple carriers
Grant 9,735,078 - Otremba , et al. August 15, 2 | 2017-08-15 |
Printed Circuit Boards Having a Dielectric Layer Which Includes a Polymer and Methods of Manufacturing Such Printed Circuit Boards
App 20170208684 - Mahler; Joachim ; et al. | 2017-07-20 |
Electronic Component and Switch Circuit
App 20170207306 - Otremba; Ralf ; et al. | 2017-07-20 |
Method for manufacturing a silicon carbide device and a silicon carbide device
Grant 9,704,718 - Mauder , et al. July 11, 2 | 2017-07-11 |
Semiconductor Devices With Improved Thermal And Electrical Performance
App 20170179009 - Otremba; Ralf ; et al. | 2017-06-22 |
Semiconductor chip package comprising side wall marking
App 20170148743 - OTREMBA; Ralf ; et al. | 2017-05-25 |
Printed circuit boards and methods of manufacturing thereof
Grant 9,648,735 - Mahler , et al. May 9, 2 | 2017-05-09 |
Semiconductor housing with rear-side structuring
Grant 9,627,292 - Otremba , et al. April 18, 2 | 2017-04-18 |
Method of manufacturing an electronic component
Grant 9,620,472 - Otremba , et al. April 11, 2 | 2017-04-11 |
Electronic component
Grant 9,620,467 - Haeberlen , et al. April 11, 2 | 2017-04-11 |
Functionalized interface structure
App 20170098598 - OTREMBA; Ralf ; et al. | 2017-04-06 |
Circuit arrangement and method for manufacturing the same
Grant 9,595,487 - Otremba , et al. March 14, 2 | 2017-03-14 |
Semiconductor device with bypass functionality and method thereof
Grant 9,589,904 - Otremba March 7, 2 | 2017-03-07 |
Method of Manufacturing a Multi-Chip Semiconductor Power Device
App 20170047315 - Otremba; Ralf ; et al. | 2017-02-16 |
Electronic device and method of manufacturing the same
App 20170005025 - OTREMBA; Ralf ; et al. | 2017-01-05 |
Electronic device and method of manufacturing the same
App 20160379919 - OTREMBA; Ralf ; et al. | 2016-12-29 |
Method of Manufacturing an Electronic Component
App 20160372439 - Otremba; Ralf ; et al. | 2016-12-22 |
Power semiconductor housing with redundant functionality
Grant 9,524,941 - Otremba December 20, 2 | 2016-12-20 |
Electronic Devices with Increased Creepage Distances
App 20160365296 - Otremba; Ralf ; et al. | 2016-12-15 |
Semiconductor Power Package and Method of Manufacturing the Same
App 20160358838 - Basler; Thomas ; et al. | 2016-12-08 |
Multi-chip semiconductor power device
Grant 9,515,060 - Otremba , et al. December 6, 2 | 2016-12-06 |
Device Including a Logic Semiconductor Chip Having a Contact Electrode for Clip Bonding
App 20160315033 - Otremba; Ralf ; et al. | 2016-10-27 |
Semiconductor packages and methods of formation thereof
Grant 9,478,484 - Otremba , et al. October 25, 2 | 2016-10-25 |
Compound Semiconductor Device Including a Multilevel Carrier
App 20160293543 - Otremba; Ralf ; et al. | 2016-10-06 |
Compound Semiconductor Device Including a Sensing Lead
App 20160293549 - Otremba; Ralf ; et al. | 2016-10-06 |
Semiconductor Devices Including Control And Load Leads Of Opposite Directions
App 20160293528 - Otremba; Ralf ; et al. | 2016-10-06 |
Semiconductor packages having multiple lead frames and methods of formation thereof
Grant 9,449,902 - Otremba , et al. September 20, 2 | 2016-09-20 |
Electronic component and method
Grant 9,443,787 - Otremba , et al. September 13, 2 | 2016-09-13 |
Chip-embedded packages with backside die connection
Grant 9,437,516 - Otremba , et al. September 6, 2 | 2016-09-06 |
Semiconductor Chip Package Having Contact Pins at Short Side Edges
App 20160233149 - Otremba; Ralf ; et al. | 2016-08-11 |
Method for manufacturing a chip arrangement
Grant 9,412,626 - Otremba , et al. August 9, 2 | 2016-08-09 |
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
Grant 9,397,018 - Otremba , et al. July 19, 2 | 2016-07-19 |
Electronic component with electronic chip between redistribution structure and mounting structure
Grant 9,385,111 - Mengel , et al. July 5, 2 | 2016-07-05 |
Module comprising a semiconductor chip
Grant 9,379,046 - Otremba , et al. June 28, 2 | 2016-06-28 |
High power electronic component with multiple leadframes
Grant 9,373,566 - Otremba , et al. June 21, 2 | 2016-06-21 |
Electronic component
Grant 9,368,434 - Otremba June 14, 2 | 2016-06-14 |
Electronic component
Grant 9,368,435 - Otremba , et al. June 14, 2 | 2016-06-14 |
Heat Spreader, Electronic Module Comprising a Heat Spreader and Method of Fabrication Thereof
App 20160163616 - Fachmann; Christian ; et al. | 2016-06-09 |
Electronic device
Grant 9,362,240 - Hosseini , et al. June 7, 2 | 2016-06-07 |
Device including two power semiconductor chips and manufacturing thereof
Grant 9,331,060 - Otremba , et al. May 3, 2 | 2016-05-03 |
Semiconductor Component Having Inner and Outer Semiconductor Component Housings
App 20160111346 - Hoeglauer; Josef ; et al. | 2016-04-21 |
Electronic Component
App 20160086897 - Haeberlen; Oliver ; et al. | 2016-03-24 |
Electronic Component
App 20160086876 - Otremba; Ralf ; et al. | 2016-03-24 |
Electronic Component
App 20160086878 - Otremba; Ralf ; et al. | 2016-03-24 |
Method For Manufacturing A Chip Arrangement
App 20160064255 - Otremba; Ralf ; et al. | 2016-03-03 |
Leadframe and method of manufacturing the same
App 20160056092 - OTREMBA; Ralf ; et al. | 2016-02-25 |
Power transistor arrangement and package having the same
Grant 9,263,440 - Otremba , et al. February 16, 2 | 2016-02-16 |
Semiconductor device package
Grant 9,263,563 - Otremba , et al. February 16, 2 | 2016-02-16 |
Circuit Arrangement And Method For Manufacturing The Same
App 20160035665 - OTREMBA; Ralf ; et al. | 2016-02-04 |
Electronic device and method for fabricating an electronic device
Grant 9,230,880 - Otremba , et al. January 5, 2 | 2016-01-05 |
Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low temperature co-fired ceramic
Grant 9,230,889 - Otremba , et al. January 5, 2 | 2016-01-05 |
Printed Circuit Boards and Methods of Manufacturing Thereof
App 20150359091 - Mahler; Joachim ; et al. | 2015-12-10 |
Semiconductor packaging arrangement
Grant 9,196,577 - Otremba , et al. November 24, 2 | 2015-11-24 |
Electronic component, arrangement and method
Grant 9,196,554 - Otremba , et al. November 24, 2 | 2015-11-24 |
Adjustable pick-up head and method for manufacturing a device
Grant 9,196,521 - Mohamed , et al. November 24, 2 | 2015-11-24 |
Chip arrangements and methods for manufacturing a chip arrangement
Grant 9,184,066 - Otremba , et al. November 10, 2 | 2015-11-10 |
Device Including Multiple Semiconductor Chips and Multiple Carriers
App 20150303128 - Otremba; Ralf ; et al. | 2015-10-22 |
Semiconductor device including a material to absorb thermal energy
Grant 9,165,847 - Mahler , et al. October 20, 2 | 2015-10-20 |
Module Comprising a Semiconductor Chip
App 20150294926 - Otremba; Ralf ; et al. | 2015-10-15 |
Semiconductor module with a semiconductor chip and a passive component and method for producing the same
Grant 9,159,720 - Otremba October 13, 2 | 2015-10-13 |
Semiconductor power device having a heat sink
Grant 9,147,631 - Otremba , et al. September 29, 2 | 2015-09-29 |
Package-in-packages and methods of formation thereof
Grant 9,147,628 - Otremba , et al. September 29, 2 | 2015-09-29 |
Module including a discrete device mounted on a DCB substrate
Grant 9,147,637 - Otremba , et al. September 29, 2 | 2015-09-29 |
Power Semiconductor Device
App 20150270208 - OTREMBA; Ralf ; et al. | 2015-09-24 |
Electronic Component And Leadframe
App 20150270194 - Otremba; Ralf ; et al. | 2015-09-24 |
Semiconductor die and package with source down and sensing configuration
Grant 9,123,701 - Otremba , et al. September 1, 2 | 2015-09-01 |
Chip module, an insulation material and a method for fabricating a chip module
Grant 9,117,786 - Otremba , et al. August 25, 2 | 2015-08-25 |
Semiconductor package with top-side insulation layer
Grant 9,099,391 - Otremba , et al. August 4, 2 | 2015-08-04 |
Power transistor arrangement and method for manufacturing the same
Grant 9,099,441 - Otremba , et al. August 4, 2 | 2015-08-04 |
Molded semiconductor package with backside die metallization
Grant 9,099,454 - Wachter , et al. August 4, 2 | 2015-08-04 |
Electronic Device and Method for Fabricating an Electronic Device
App 20150214133 - Otremba; Ralf ; et al. | 2015-07-30 |
Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
Grant 9,093,437 - Otremba July 28, 2 | 2015-07-28 |
Connection Structure and Electronic Component
App 20150200178 - Otremba; Ralf ; et al. | 2015-07-16 |
Semiconductor packages and methods of formation thereof
Grant 9,082,759 - Otremba , et al. July 14, 2 | 2015-07-14 |
Method of fabricating a power semiconductor chip package
Grant 9,082,878 - Otremba July 14, 2 | 2015-07-14 |
Chip-Embedded Packages with Backside Die Connection
App 20150194362 - Otremba; Ralf ; et al. | 2015-07-09 |
Semiconductor Packaging Arrangement
App 20150194373 - Otremba; Ralf ; et al. | 2015-07-09 |
Electronic Device
App 20150162287 - Hosseini; Khalil ; et al. | 2015-06-11 |
Device Including Two Power Semiconductor Chips and Manufacturing Thereof
App 20150155271 - Otremba; Ralf ; et al. | 2015-06-04 |
Switching circuit
Grant 9,048,838 - Otremba , et al. June 2, 2 | 2015-06-02 |
Electronic Component
App 20150145112 - Otremba; Ralf | 2015-05-28 |
Electronic component with electronic chip between redistribution structure and mounting structure
App 20150145111 - MENGEL; Manfred ; et al. | 2015-05-28 |
Chip-housing module and a method for forming a chip-housing module
Grant 9,041,184 - Otremba May 26, 2 | 2015-05-26 |
Multi-level semiconductor package
Grant 9,041,170 - Otremba , et al. May 26, 2 | 2015-05-26 |
Packaged device comprising non-integer lead pitches and method of manufacturing the same
Grant 9,035,437 - Otremba , et al. May 19, 2 | 2015-05-19 |
Power Semiconductor Device Including A Cooling Material
App 20150123142 - Mahler; Joachim ; et al. | 2015-05-07 |
Semiconductor Device Package
App 20150115313 - Otremba; Ralf ; et al. | 2015-04-30 |
Switching Circuit
App 20150116025 - Otremba; Ralf ; et al. | 2015-04-30 |
Switching Circuit
App 20150115324 - Otremba; Ralf ; et al. | 2015-04-30 |
Semiconductor device having a clip contact
Grant 9,018,744 - Otremba , et al. April 28, 2 | 2015-04-28 |
Electronic Component, Arrangement and Method
App 20150091176 - Otremba; Ralf ; et al. | 2015-04-02 |
Transistor arrangement with semiconductor chips between two substrates
App 20150092375 - Otremba; Ralf ; et al. | 2015-04-02 |
Semiconductor device including a contact clip having protrusions and manufacturing thereof
Grant 8,987,879 - Otremba March 24, 2 | 2015-03-24 |
Chip module and a method for manufacturing a chip module
Grant 8,987,880 - Hoeglauer , et al. March 24, 2 | 2015-03-24 |
Semiconductor device using diffusion soldering
Grant 8,975,117 - Otremba , et al. March 10, 2 | 2015-03-10 |
Redistribution board, electronic component and module
Grant 8,975,735 - Otremba , et al. March 10, 2 | 2015-03-10 |
Device including two power semiconductor chips and manufacturing thereof
Grant 8,975,711 - Otremba , et al. March 10, 2 | 2015-03-10 |
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof
App 20150060878 - Otremba; Ralf ; et al. | 2015-03-05 |
Chip module and method for fabricating a chip module
Grant 8,970,032 - Otremba , et al. March 3, 2 | 2015-03-03 |
Electronic Component and Method
App 20150041984 - Otremba; Ralf ; et al. | 2015-02-12 |
Redistribution Board, Electronic Component and Module
App 20150041859 - Otremba; Ralf ; et al. | 2015-02-12 |
Molded Semiconductor Package with Backside Die Metallization
App 20150041967 - Wachter; Ulrich ; et al. | 2015-02-12 |
Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
Grant 8,952,545 - Otremba , et al. February 10, 2 | 2015-02-10 |
Semiconductor Die And Package With Source Down And Sensing Configuration
App 20150014858 - Otremba; Ralf ; et al. | 2015-01-15 |
Semiconductor chip package
Grant 8,933,555 - Otremba , et al. January 13, 2 | 2015-01-13 |
Circuit Arrangement And Method For Manufacturing The Same
App 20140374913 - Otremba; Ralf ; et al. | 2014-12-25 |
Semiconductor modules and methods of formation thereof
Grant 8,916,474 - Otremba , et al. December 23, 2 | 2014-12-23 |
Semiconductor packages having multiple lead frames and methods of formation thereof
Grant 8,896,106 - Otremba , et al. November 25, 2 | 2014-11-25 |
Manufacturing electronic device having contact elements with a specified cross section
Grant 8,871,630 - Otremba , et al. October 28, 2 | 2014-10-28 |
Semiconductor Power Device Having a Heat Sink
App 20140312360 - Otremba; Ralf ; et al. | 2014-10-23 |
Semiconductor Device Including a Material to Absorb Thermal Energy
App 20140312394 - Mahler; Joachim ; et al. | 2014-10-23 |
Chip And Chip Arrangement
App 20140306331 - Otremba; Ralf ; et al. | 2014-10-16 |
Electro-thermal cooling devices and methods of fabrication thereof
Grant 8,860,071 - Otremba October 14, 2 | 2014-10-14 |
Package And A Method Of Manufacturing The Same
App 20140301039 - Otremba; Ralf ; et al. | 2014-10-09 |
Chip arrangements, a chip package and a method for manufacturing a chip arrangement
Grant 8,853,835 - Otremba , et al. October 7, 2 | 2014-10-07 |
Package arrangement and a method of manufacturing a package arrangement
Grant 8,853,849 - Otremba , et al. October 7, 2 | 2014-10-07 |
Multi-Level Semiconductor Package
App 20140291849 - Otremba; Ralf ; et al. | 2014-10-02 |
Method For Manufacturing A Silicon Carbide Device And A Silicon Carbide Device
App 20140284615 - Mauder; Anton ; et al. | 2014-09-25 |
Multi-Chip Semiconductor Power Device
App 20140284777 - Otremba; Ralf ; et al. | 2014-09-25 |
Semiconductor Package with Top-Side Insulation Layer
App 20140264944 - Otremba; Ralf ; et al. | 2014-09-18 |
Packaged Device Comprising Non-Integer Lead Pitches and Method of Manufacturing the Same
App 20140264798 - Otremba; Ralf ; et al. | 2014-09-18 |
Semiconductor Device and Method for Producing the Same
App 20140252373 - Mauder; Anton ; et al. | 2014-09-11 |
Chip Carrier Structure, Chip Package And Method Of Manufacturing The Same
App 20140252577 - Otremba; Ralf ; et al. | 2014-09-11 |
Package Arrangement And A Method Of Manufacturing A Package Arrangement
App 20140252537 - Otremba; Ralf ; et al. | 2014-09-11 |
Chip package and a method for manufacturing a chip package
Grant 8,815,647 - Otremba , et al. August 26, 2 | 2014-08-26 |
Semiconductor Modules and Methods of Formation Thereof
App 20140232015 - Otremba; Ralf ; et al. | 2014-08-21 |
Method of making an electronic device
Grant 8,806,741 - Otremba August 19, 2 | 2014-08-19 |
Power Transistor Arrangement And Package Having The Same
App 20140225124 - Otremba; Ralf ; et al. | 2014-08-14 |
Semiconductor Device with Bypass Functionality and Method Thereof
App 20140225661 - Otremba; Ralf | 2014-08-14 |
Power Transistor Arrangement And Method For Manufacturing The Same
App 20140217596 - Otremba; Ralf ; et al. | 2014-08-07 |
Chip Arrangement And Chip Package
App 20140210061 - Otremba; Ralf ; et al. | 2014-07-31 |
Chip Arrangement, A Method For Manufacturing A Chip Arrangement, Integrated Circuits And A Method For Manufacturing An Integrated Circuit
App 20140197552 - Otremba; Ralf ; et al. | 2014-07-17 |
Chip Arrangement And A Method For Forming A Chip Arrangement
App 20140197523 - Otremba; Ralf ; et al. | 2014-07-17 |
Semiconductor modules and methods of formation thereof
Grant 8,766,430 - Otremba , et al. July 1, 2 | 2014-07-01 |
Packaged Semiconductor Device with Tensile Stress and Method of Making a Packaged Semiconductor Device with Tensile Stress
App 20140151866 - Otremba; Ralf | 2014-06-05 |
Packaged Vertical Power Device Comprising Compressive Stress and Method of Making a Packaged Vertical Power Device
App 20140151717 - Otremba; Ralf | 2014-06-05 |
Chip Module, an Insulation Material and a Method for Fabricating a Chip Module
App 20140151856 - Otremba; Ralf ; et al. | 2014-06-05 |
Semiconductor Packages and Methods of Formation Thereof
App 20140145318 - Otremba; Ralf ; et al. | 2014-05-29 |
Chip Arrangements And Methods For Manufacturing A Chip Arrangement
App 20140138803 - Otremba; Ralf ; et al. | 2014-05-22 |
Adjustable Pick-up Head and Method for Manufacturing a Device
App 20140123454 - Mohamed; Abdul Rahman ; et al. | 2014-05-08 |
Chip-housing Module And A Method For Forming A Chip-housing Module
App 20140118959 - Otremba; Ralf | 2014-05-01 |
Module Comprising a Semiconductor Chip
App 20140110829 - Otremba; Ralf ; et al. | 2014-04-24 |
Semiconductor Packages and Methods of Formation Thereof
App 20140110828 - Otremba; Ralf ; et al. | 2014-04-24 |
Semiconductor Device Having Sensing Functionality
App 20140103902 - Otremba; Ralf ; et al. | 2014-04-17 |
Module with silicon-based layer
Grant 8,697,497 - Otremba , et al. April 15, 2 | 2014-04-15 |
Multi-chip package and method of manufacturing thereof
Grant 8,698,293 - Otremba , et al. April 15, 2 | 2014-04-15 |
Chip Arrangements, A Chip Package And A Method For Manufacturing A Chip Arrangement
App 20140097528 - Otremba; Ralf ; et al. | 2014-04-10 |
Device including two mounting surfaces
Grant 8,691,631 - Otremba April 8, 2 | 2014-04-08 |
Power Semiconductor Housing With Redundant Functionality
App 20140091401 - Otremba; Ralf | 2014-04-03 |
Semiconductor Device Having a Clip Contact
App 20140084433 - Otremba; Ralf ; et al. | 2014-03-27 |
Semiconductor Housing with Rear-Side Structuring
App 20140084449 - Otremba; Ralf ; et al. | 2014-03-27 |
Chip Package And A Method For Manufacturing A Chip Package
App 20140061669 - Otremba; Ralf ; et al. | 2014-03-06 |
Lateral Element Isolation Device
App 20140063766 - Otremba; Ralf ; et al. | 2014-03-06 |
Semiconductor device
Grant 8,658,472 - Otremba February 25, 2 | 2014-02-25 |
Semiconductor device
Grant 8,642,408 - Otremba , et al. February 4, 2 | 2014-02-04 |
Power semiconductor chip having two metal layers on one face
Grant 8,643,176 - Otremba , et al. February 4, 2 | 2014-02-04 |
Method of manufacturing electronic device on leadframe
Grant 8,642,394 - Mohamed , et al. February 4, 2 | 2014-02-04 |
Semiconductor module
Grant 8,637,341 - Otremba , et al. January 28, 2 | 2014-01-28 |
Module comprising a semiconductor chip
Grant 8,633,102 - Otremba , et al. January 21, 2 | 2014-01-21 |
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof
App 20140008702 - Otremba; Ralf ; et al. | 2014-01-09 |
Chip-housing module and a method for forming a chip-housing module
Grant 8,624,378 - Otremba January 7, 2 | 2014-01-07 |
Package-In-Packages and Methods of Formation Thereof
App 20140001615 - Otremba; Ralf ; et al. | 2014-01-02 |
Lead Frame Packages and Methods of Formation Thereof
App 20140001480 - Otremba; Ralf ; et al. | 2014-01-02 |
Electronic device and manufacturing thereof
Grant 08618644 - | 2013-12-31 |
Electronic device and manufacturing thereof
Grant 8,618,644 - Otremba , et al. December 31, 2 | 2013-12-31 |
Electro-Thermal Cooling Devices and Methods of Fabrication Thereof
App 20130341777 - Otremba; Ralf | 2013-12-26 |
Semiconductor Modules and Methods of Formation Thereof
App 20130334677 - Otremba; Ralf ; et al. | 2013-12-19 |
Die structure, die arrangement and method of processing a die
Grant 8,610,274 - Hosseini , et al. December 17, 2 | 2013-12-17 |
Electronic Device Including A Carrier And A Semiconductor Chip Attached To The Carrier And Manufacturing Thereof
App 20130328213 - Otremba; Ralf ; et al. | 2013-12-12 |
Multi-Chip Package and Method of Manufacturing Thereof
App 20130313712 - Otremba; Ralf ; et al. | 2013-11-28 |
Power Semiconductor Chip Package
App 20130295724 - Otremba; Ralf | 2013-11-07 |
Semiconductor Devices and Methods of Manufacturing and Using Thereof
App 20130285197 - Otremba; Ralf ; et al. | 2013-10-31 |
Semiconductor Module With a Semiconductor Chip and a Passive Component and Method for Producing the Same
App 20130285132 - Otremba; Ralf | 2013-10-31 |
Chip Arrangements And Methods For Forming A Chip Arrangement
App 20130229777 - Otremba; Ralf ; et al. | 2013-09-05 |
Electronic device comprising a chip disposed on a pin
Grant 8,519,545 - Otremba August 27, 2 | 2013-08-27 |
Power semiconductor chip package
Grant 8,513,798 - Otremba August 20, 2 | 2013-08-20 |
Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
Grant 8,507,320 - Otremba , et al. August 13, 2 | 2013-08-13 |
Semiconductor Device Using Diffusion Soldering
App 20130200532 - Otremba; Ralf ; et al. | 2013-08-08 |
Module Including a Discrete Device Mounted on a DCB Substrate
App 20130161801 - Otremba; Ralf ; et al. | 2013-06-27 |
Semiconductor Device and Fabrication Method
App 20130154123 - Poh; Yong Chern ; et al. | 2013-06-20 |
Semiconductor module with a power semiconductor chip and a passive component and method for producing the same
Grant 8,466,561 - Otremba June 18, 2 | 2013-06-18 |
Device Including Two Power Semiconductor Chips and Manufacturing Thereof
App 20130146991 - Otremba; Ralf ; et al. | 2013-06-13 |
Power semiconductor device
Grant 8,461,645 - Otremba , et al. June 11, 2 | 2013-06-11 |
Semiconductor Device
App 20130143368 - Otremba; Ralf | 2013-06-06 |
Integrated circuit device with semiconductor device components embedded in plastic housing composition
Grant 8,450,861 - Otremba May 28, 2 | 2013-05-28 |
Semiconductor device and method for producing the same
Grant 8,410,592 - Otremba , et al. April 2, 2 | 2013-04-02 |
Semiconductor module with multiple semiconductor chips
Grant 8,410,591 - Otremba April 2, 2 | 2013-04-02 |
Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
Grant 8,410,590 - Otremba April 2, 2 | 2013-04-02 |
Chip Module and Method for Fabricating a Chip Module
App 20130069243 - Otremba; Ralf ; et al. | 2013-03-21 |
Chip Module And A Method For Manufacturing A Chip Module
App 20130062722 - Hoeglauer; Josef ; et al. | 2013-03-14 |
Chip-housing Module And A Method For Forming A Chip-housing Module
App 20130056877 - Otremba; Ralf | 2013-03-07 |
Power Semiconductor Chip Having Two Metal Layers on One Face
App 20130027113 - Otremba; Ralf ; et al. | 2013-01-31 |
Vertical semiconductor power switch, electronic component and methods of producing the same
Grant 8,354,692 - Otremba January 15, 2 | 2013-01-15 |
Semiconductor Device Including a Contact Clip Having Protrusions and Manufacturing Thereof
App 20130009295 - Otremba; Ralf | 2013-01-10 |
Semiconductor device
Grant 8,343,811 - Otremba January 1, 2 | 2013-01-01 |
Electronic Device And Manufacturing Thereof
App 20120319109 - Otremba; Ralf ; et al. | 2012-12-20 |
Stacked semiconductor chips with separate encapsulations
Grant 8,334,586 - Otremba , et al. December 18, 2 | 2012-12-18 |
Semiconductor device
Grant 8,324,739 - Otremba December 4, 2 | 2012-12-04 |
Semiconductor chip, semiconductor device and methods for producing the same
Grant 8,324,115 - Otremba , et al. December 4, 2 | 2012-12-04 |
Electronic Device And Manufacturing Thereof
App 20120286293 - Otremba; Ralf ; et al. | 2012-11-15 |
Module Comprising a Semiconductor Chip
App 20120276693 - Otremba; Ralf ; et al. | 2012-11-01 |
Power semiconductor device
Grant 8,299,585 - Otremba October 30, 2 | 2012-10-30 |
Power Semiconductor Device
App 20120235227 - Otremba; Ralf ; et al. | 2012-09-20 |
Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof
Grant 8,253,225 - Otremba , et al. August 28, 2 | 2012-08-28 |
Module comprising a semiconductor chip
Grant 8,237,268 - Otremba , et al. August 7, 2 | 2012-08-07 |
Electronic device having contact elements with a specified cross section and manufacturing thereof
Grant 8,227,908 - Otremba , et al. July 24, 2 | 2012-07-24 |
Device Including Two Mounting Surfaces
App 20120178216 - Otremba; Ralf | 2012-07-12 |
Multi-chip module
Grant 8,188,596 - Otremba May 29, 2 | 2012-05-29 |
Semiconductor component and method for producing the same
Grant 8,169,063 - Otremba , et al. May 1, 2 | 2012-05-01 |
Panel, semiconductor device and method for the production thereof
Grant 8,164,173 - Koller , et al. April 24, 2 | 2012-04-24 |
Electronic Device
App 20120068186 - Otremba; Ralf | 2012-03-22 |
Module With Silicon-based Layer
App 20120070941 - Otremba; Ralf ; et al. | 2012-03-22 |
Device including two mounting surfaces
Grant 8,138,587 - Otremba March 20, 2 | 2012-03-20 |
Die Structure, Die Arrangement And Method Of Processing A Die
App 20120061835 - Hosseini; Khalil ; et al. | 2012-03-15 |
Power Semiconductor Chip Package
App 20120061812 - Otremba; Ralf | 2012-03-15 |
Electronic module with switching functions and method for producing the same
Grant 8,134,236 - Otremba March 13, 2 | 2012-03-13 |
Power transistor
Grant 8,124,983 - Otremba February 28, 2 | 2012-02-28 |
Semiconductor module including semiconductor chips coupled to external contact elements
Grant 8,120,161 - Otremba , et al. February 21, 2 | 2012-02-21 |
Multichip module with improved system carrier
Grant 8,115,294 - Otremba , et al. February 14, 2 | 2012-02-14 |
Electronic Device
App 20120027928 - Otremba; Ralf | 2012-02-02 |
Circuit arrangement having two semiconductor switching elements and one freewheeling element
Grant 8,098,499 - Otremba January 17, 2 | 2012-01-17 |
Semiconductor device
Grant 8,097,944 - Landau , et al. January 17, 2 | 2012-01-17 |
Module with silicon-based layer
Grant 8,093,713 - Otremba , et al. January 10, 2 | 2012-01-10 |
Semiconductor module
Grant 8,084,816 - Otremba , et al. December 27, 2 | 2011-12-27 |
Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
Grant 8,084,861 - Otremba December 27, 2 | 2011-12-27 |
Electronic device
Grant 8,077,475 - Otremba December 13, 2 | 2011-12-13 |
Semiconductor device
Grant 8,044,523 - Otremba October 25, 2 | 2011-10-25 |
Semiconductor module
Grant 8,030,131 - Otremba , et al. October 4, 2 | 2011-10-04 |
Circuit arrangement comprising having plurality of half bridges
Grant 8,023,276 - Otremba September 20, 2 | 2011-09-20 |
Stacked Semiconductor Chips
App 20110215460 - Otremba; Ralf ; et al. | 2011-09-08 |
Semiconductor Device
App 20110189821 - Otremba; Ralf ; et al. | 2011-08-04 |
Stacked semiconductor chips with separate encapsulations
Grant 7,969,018 - Otremba , et al. June 28, 2 | 2011-06-28 |
Power semiconductor device and method for its production
Grant 7,947,532 - Otremba , et al. May 24, 2 | 2011-05-24 |
Power transistor and power semiconductor device
Grant 7,936,048 - Otremba May 3, 2 | 2011-05-03 |
Semiconductor Device
App 20110096519 - Otremba; Ralf | 2011-04-28 |
Semiconductor Device
App 20110097855 - Otremba; Ralf | 2011-04-28 |
Power Semiconductor Device and Method for Its Production
App 20100297810 - Otremba; Ralf ; et al. | 2010-11-25 |
Electronic Device And Method
App 20100295171 - Otremba; Ralf ; et al. | 2010-11-25 |
Semiconductor Chip Package
App 20100289135 - Otremba; Ralf ; et al. | 2010-11-18 |
Semiconductor Device
App 20100276797 - Landau; Stefan ; et al. | 2010-11-04 |
Panel, Semiconductor Device and Method for the Production Thereof
App 20100264523 - Koller; Adolf ; et al. | 2010-10-21 |
Device Including Two Mounting Surfaces
App 20100078783 - Otremba; Ralf | 2010-04-01 |
Device Including A Power Semiconductor Chip
App 20100078784 - Otremba; Ralf | 2010-04-01 |
Power Transistor
App 20100051963 - Otremba; Ralf | 2010-03-04 |
Electronic Device and Method of Manufacturing Same
App 20100032816 - MAHLER; Joachim ; et al. | 2010-02-11 |
Stacked Semiconductor Chips
App 20100013106 - Otremba; Ralf ; et al. | 2010-01-21 |
Electronic Device And Manufacturing Thereof
App 20100001291 - Otremba; Ralf ; et al. | 2010-01-07 |
Circuit Arrangement Having Two Semiconductor Switching Elements And One Freewheeling Element
App 20090273913 - Otremba; Ralf | 2009-11-05 |
Semiconductor Module
App 20090261468 - Kroeninger; Werner ; et al. | 2009-10-22 |
Electronic Device And Manufacturing Thereof
App 20090236749 - Otremba; Ralf ; et al. | 2009-09-24 |
Semiconductor Device
App 20090230519 - OTREMBA; Ralf ; et al. | 2009-09-17 |
Semiconductor Module
App 20090230535 - Otremba; Ralf ; et al. | 2009-09-17 |
Semiconductor Module
App 20090227071 - Otremba; Ralf ; et al. | 2009-09-10 |
Electronic Device And Manufacturing Thereof
App 20090212284 - Otremba; Ralf ; et al. | 2009-08-27 |
| 