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Method for producing an optoelectronic component, and optoelectronic component
Grant 11,322,655 - Oszinda , et al. May 3, 2 | 2022-05-03 |
Semiconductor Switch Element and Method of Manufacturing the Same
App 20210183948 - Leomant; Sylvain ; et al. | 2021-06-17 |
Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip
Grant 11,011,504 - Oszinda , et al. May 18, 2 | 2021-05-18 |
Method For Producing An Optoelectronic Component, And Optoelectronic Component
App 20210091269 - Oszinda; Thomas ; et al. | 2021-03-25 |
Semiconductor device
Grant 10,867,923 - Ahn , et al. December 15, 2 | 2020-12-15 |
Optoelectronic Semiconductor Chip And Method Of Producing An Optoelectronic Semiconductor Chip
App 20190229102 - Oszinda; Thomas ; et al. | 2019-07-25 |
Semiconductor Device
App 20190019759 - AHN; Sang Hoon ; et al. | 2019-01-17 |
Methods for fabricating semiconductor devices including surface treatment processes
Grant 10,128,148 - Nguyen , et al. November 13, 2 | 2018-11-13 |
Semiconductor devices having interconnection structure
Grant 10,096,549 - Kim , et al. October 9, 2 | 2018-10-09 |
Semiconductor devices
Grant 9,972,528 - Nguyen , et al. May 15, 2 | 2018-05-15 |
Methods for Fabricating Semiconductor Devices Including Surface Treatment Processes
App 20180102280 - NGUYEN; Viet Ha ; et al. | 2018-04-12 |
Copper via with barrier layer and cap layer
Grant 9,929,098 - Yim , et al. March 27, 2 | 2018-03-27 |
Semiconductor Devices Having Interconnection Structure
App 20180076140 - KIM; Byung Hee ; et al. | 2018-03-15 |
Semiconductor Device And Method Of Manufacturing The Same
App 20170213786 - AHN; Sang Hoon ; et al. | 2017-07-27 |
Semiconductor Devices
App 20170178949 - Nguyen; VietHa ; et al. | 2017-06-22 |
Methods of forming wiring structures and methods of manufacturing semiconductor devices
Grant 9,666,478 - Oszinda , et al. May 30, 2 | 2017-05-30 |
Semiconductor device and method of manufacturing the same
Grant 9,653,400 - Yim , et al. May 16, 2 | 2017-05-16 |
Method of treating a porous dielectric layer and a method of fabricating a semiconductor device using the same
Grant 9,576,848 - Yim , et al. February 21, 2 | 2017-02-21 |
Methods Of Forming Wiring Structures And Methods Of Manufacturing Semiconductor Devices
App 20160329242 - OSZINDA; Thomas ; et al. | 2016-11-10 |
Semiconductor Devices And Methods Of Manufacturing The Same
App 20160293552 - YIM; Tae-Jin ; et al. | 2016-10-06 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160211211 - YIM; Tae-Jin ; et al. | 2016-07-21 |
Method Of Treating A Porous Dielectric Layer And A Method Of Fabricating A Semiconductor Device Using The Same
App 20160148837 - Yim; Taejin ; et al. | 2016-05-26 |
Repair of damaged surface areas of sensitive low-K dielectrics of microstructure devices after plasma processing by in situ treatment
Grant 8,575,041 - Schaller , et al. November 5, 2 | 2013-11-05 |
Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification
Grant 8,440,579 - Schaller , et al. May 14, 2 | 2013-05-14 |
Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models
Grant 8,423,320 - Schaller , et al. April 16, 2 | 2013-04-16 |
Repair of Damaged Surface Areas of Sensitive Low-K Dielectrics of Microstructure Devices After Plasma Processing by In Situ Treatment
App 20130072018 - Schaller; Matthias ; et al. | 2013-03-21 |
Re-Establishing Surface Characteristics of Sensitive Low-K Dielectrics in Microstructure Devices by Using an In Situ Surface Modification
App 20120049383 - Schaller; Matthias ; et al. | 2012-03-01 |
Re-establishing A Hydrophobic Surface Of Sensitive Low-k Dielectrics In Microstructure Devices
App 20100301494 - Schaller; Matthias ; et al. | 2010-12-02 |
Method And System For Quantitative Inline Material Characterization In Semiconductor Production Processes Based On Structural Measurements And Related Models
App 20090319196 - Schaller; Matthias ; et al. | 2009-12-24 |
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