loadpatents
name:-0.0017650127410889
name:-0.00972580909729
name:-0.00058317184448242
Osuna, Jr.; Jose A. Patent Filings

Osuna, Jr.; Jose A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Osuna, Jr.; Jose A..The latest application filed is for "vinyl compounds".

Company Profile
0.11.0
  • Osuna, Jr.; Jose A. - Albany OR
  • Osuna, Jr.; Jose A. - San Diego CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Vinyl compounds
Grant 7,645,899 - Dershem , et al. January 12, 2
2010-01-12
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Grant 7,309,724 - Dershem , et al. December 18, 2
2007-12-18
Maleimide compounds in liquid form
Grant 7,102,015 - Dershem , et al. September 5, 2
2006-09-05
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Grant 6,916,856 - Dershem , et al. July 12, 2
2005-07-12
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Grant 6,852,814 - Dershem , et al. February 8, 2
2005-02-08
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Grant 6,825,245 - Dershem , et al. November 30, 2
2004-11-30
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Grant 6,790,597 - Dershem , et al. September 14, 2
2004-09-14
Thermosetting resin compositions containing maleimide and/or vinyl compounds
Grant 6,034,195 - Dershem , et al. March 7, 2
2000-03-07
Bismaleimide-divinyl adhesive compositions and uses therefor
Grant 6,034,194 - Dershem , et al. March 7, 2
2000-03-07
Propargyl ether-containing compositions useful for underfill applications
Grant 5,714,086 - Osuna, Jr. , et al. February 3, 1
1998-02-03
Adhesive bonding composition with bond line limiting spacer system
Grant 5,232,962 - Dershem , et al. August 3, 1
1993-08-03

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