Osuki; Yohei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Osuki; Yohei.The latest application filed is for "element substrate, liquid ejection head, liquid ejection apparatus, and manufacturing method".

Company Profile

7.8.9

Osuki; Yohei - Nagareyama JP
OSUKI; YOHEI - Chiba JP
Osuki; Yohei - Nagareyama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Element substrate, liquid discharge head, and printing apparatus Grant 11,383,515 - Sakuma , et al. July 12, 2	2022-07-12
Element Substrate, Liquid Ejection Head, Liquid Ejection Apparatus, And Manufacturing Method App 20220184950 - OSUKI; YOHEI	2022-06-16
Element substrate, liquid discharge head, and printing apparatus Grant 11,338,581 - Osuki , et al. May 24, 2	2022-05-24
Recording element board, liquid ejection apparatus and method of manufacturing recording element board Grant 10,889,113 - Oohashi , et al. January 12, 2	2021-01-12
Element Substrate, Liquid Discharge Head, And Printing Apparatus App 20200338887 - Osuki; Yohei ; et al.	2020-10-29
Element Substrate, Liquid Discharge Head, And Printing Apparatus App 20200338888 - Sakuma; Sadayoshi ; et al.	2020-10-29
Print element substrate, method of manufacturing print element substrate, and method of manufacturing printhead Grant 10,632,741 - Tamura , et al.	2020-04-28
Recording Element Board, Liquid Ejection Apparatus And Method Of Manufacturing Recording Element Board App 20200016896 - Oohashi; Ryoji ; et al.	2020-01-16
Print element substrate, printhead, and printing apparatus Grant 10,532,565 - Osuki , et al. Ja	2020-01-14
Print element substrate, printhead, and printing apparatus Grant 10,500,851 - Osuki , et al. Dec	2019-12-10
Print Element Substrate, Method Of Manufacturing Print Element Substrate, And Method Of Manufacturing Printhead App 20190001663 - Tamura; Hideo ; et al.	2019-01-03
Print Element Substrate, Printhead, And Printing Apparatus App 20180370224 - Osuki; Yohei ; et al.	2018-12-27
Element substrate for liquid ejecting head and wafer Grant 9,950,525 - Oohashi , et al. April 24, 2	2018-04-24
Print Element Substrate, Printhead, And Printing Apparatus App 20180104954 - Osuki; Yohei ; et al.	2018-04-19
Recording-element substrate, recording head, and recording apparatus Grant 9,833,992 - Taniguchi , et al. December 5, 2	2017-12-05
Recording-element Substrate, Recording Head, And Recording Apparatus App 20170173953 - Taniguchi; Suguru ; et al.	2017-06-22
Element Substrate For Liquid Ejecting Head And Wafer App 20170100930 - Oohashi; Ryoji ; et al.	2017-04-13

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