| Patent | Date |
|---|
Connecting a component to a substrate by adhesion to an oxidized solder surface
Grant 11,228,124 - Hoffmeyer , et al. January 18, 2 | 2022-01-18 |
Electronic apparatus having inter-chip stiffener
Grant 11,211,262 - Sinha , et al. December 28, 2 | 2021-12-28 |
Chip Corner Guard For Chip-package Interaction Failure Mitigation
App 20210233824 - Li; Shidong ; et al. | 2021-07-29 |
Electronic Apparatus Having Inter-chip Stiffener
App 20210225665 - SINHA; TUHIN ; et al. | 2021-07-22 |
Multipart lid for a semiconductor package with multiple components
Grant 10,777,482 - Arvin , et al. Sept | 2020-09-15 |
Multipart Lid For A Semiconductor Package With Multiple Components
App 20190259683 - ARVIN; CHARLES L. ; et al. | 2019-08-22 |
Multipart lid for a semiconductor package with multiple components
Grant 10,325,830 - Arvin , et al. | 2019-06-18 |
Multipart Lid For A Semiconductor Package With Multiple Components
App 20190164864 - ARVIN; CHARLES L. ; et al. | 2019-05-30 |
Determining crackstop strength of integrated circuit assembly at the wafer level
Grant 9,947,598 - Tunga , et al. April 17, 2 | 2018-04-17 |
Under die surface mounted electrical elements
Grant 9,601,423 - Arvin , et al. March 21, 2 | 2017-03-21 |
Method for shaping a laminate substrate
Grant 9,543,253 - Blackshear , et al. January 10, 2 | 2017-01-10 |
Determining magnitude of compressive loading
Grant 9,366,591 - Bodenweber , et al. June 14, 2 | 2016-06-14 |
Precast thermal interface adhesive for easy and repeated, separation and remating
Grant 9,272,498 - Colgan , et al. March 1, 2 | 2016-03-01 |
Laminate peripheral clamping to control microelectronic module BSM warpage
Grant 9,219,051 - Allard , et al. December 22, 2 | 2015-12-22 |
Fixture for shaping a laminate substrate
Grant 9,059,240 - Blackshear , et al. June 16, 2 | 2015-06-16 |
Method for shaping a laminate substrate
Grant 9,048,245 - Blackshear , et al. June 2, 2 | 2015-06-02 |
Method For Shaping A Laminate Substrate
App 20150136838 - Blackshear; Edmund ; et al. | 2015-05-21 |
Laminate Peripheral Clamping To Control Microelectronic Module Bsm Warpage
App 20140359996 - Allard; Stephanie ; et al. | 2014-12-11 |
Multichip electronic packages and methods of manufacture
Grant 8,906,809 - Beaumier , et al. December 9, 2 | 2014-12-09 |
Multichip electronic packages and methods of manufacture
Grant 8,900,927 - Beaumier , et al. December 2, 2 | 2014-12-02 |
Determining Magnitude Of Compressive Loading
App 20140331792 - Bodenweber; Paul F. ; et al. | 2014-11-13 |
Determining magnitude of compressive loading
Grant 8,794,079 - Bodenweber , et al. August 5, 2 | 2014-08-05 |
Fixture For Shaping A Laminate Substrate
App 20130323345 - Blackshear; Edmund D. ; et al. | 2013-12-05 |
Method For Shaping A Laminate Substrate
App 20130320069 - Blackshear; Edmund ; et al. | 2013-12-05 |
Reworkable underfills for ceramic MCM C4 protection
Grant 8,492,199 - Coffin , et al. July 23, 2 | 2013-07-23 |
Determining Magnitude Of Compressive Loading
App 20130112006 - BODENWEBER; PAUL F. ; et al. | 2013-05-09 |
Implementing loading and heat removal for hub module assembly
Grant 8,363,404 - Colbert , et al. January 29, 2 | 2013-01-29 |
Precast Thermal Interface Adhesive For Easy And Repeated, Separation And Remating
App 20120276375 - Colgan; Evan George ; et al. | 2012-11-01 |
Multichip Electronic Packages And Methods Of Manufacture
App 20120241944 - BEAUMIER; Martin M. ; et al. | 2012-09-27 |
Precast thermal interface adhesive for easy and repeated, separation and remating
Grant 8,268,389 - Colgan , et al. September 18, 2 | 2012-09-18 |
Module Assembly Holding Workboard
App 20120217986 - Benner; Alan F. ; et al. | 2012-08-30 |
Implementing Loading And Heat Removal For Hub Module Assembly
App 20120147563 - Colbert; John L. ; et al. | 2012-06-14 |
Multichip Electronic Packages And Methods Of Manufacture
App 20120039046 - BEAUMIER; Martin M. ; et al. | 2012-02-16 |
Novel Reworkable Underfills For Ceramic Mcm C4 Protection
App 20120021567 - Coffin; Jeffrey T. ; et al. | 2012-01-26 |
Precast Thermal Interface Adhesive For Easy And Repeated, Separation And Remating
App 20110171466 - Colgan; Evan George ; et al. | 2011-07-14 |
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
Grant 7,816,785 - Iruvanti , et al. October 19, 2 | 2010-10-19 |
Apparatus for crack prevention in integrated circuit packages
Grant 7,786,579 - Audet , et al. August 31, 2 | 2010-08-31 |
Low Compressive Force, Non-silicone, High Thermal Conducting Formulation For Thermal Interface Material And Package
App 20100181663 - IRUVANTI; SUSHUMNA ; et al. | 2010-07-22 |
Enhanced Thermal Conducting Formulations
App 20080311381 - Kumar; Rajneesh ; et al. | 2008-12-18 |
Enhanced thermal conducting formulations
Grant 7,462,294 - Kumar , et al. December 9, 2 | 2008-12-09 |
Apparatus For Crack Prevention In Integrated Circuit Packages
App 20080290510 - Audet; Jean ; et al. | 2008-11-27 |
Enhanced Thermal Conducting Formulations
App 20080266809 - Kumar; Rajneesh ; et al. | 2008-10-30 |
Novel Reworkable Underfills For Ceramic Mcm C4 Protection
App 20070290378 - Coffin; Jeffrey T. ; et al. | 2007-12-20 |
Standoff Structures For Surface Mount Components
App 20070007323 - Russell; David J. ; et al. | 2007-01-11 |
Fluidic cooling systems and methods for electronic components
Grant 7,079,393 - Colgan , et al. July 18, 2 | 2006-07-18 |
Preparing MCM hat for removal
Grant 6,908,025 - Coico , et al. June 21, 2 | 2005-06-21 |
Preparing Mcm Hat For Removal
App 20040262371 - Coico, Patrick A. ; et al. | 2004-12-30 |
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
Grant 6,827,505 - Shinde , et al. December 7, 2 | 2004-12-07 |
Redundant configurable VCSEL laser array optical light source
Grant 6,821,026 - Devine , et al. November 23, 2 | 2004-11-23 |
Optical land grid array interposer
Grant 6,819,813 - Howland , et al. November 16, 2 | 2004-11-16 |
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
App 20040114884 - Shinde, Subhash L. ; et al. | 2004-06-17 |
Optical land grid array interposer
App 20040047538 - Howland, Stephen R. ; et al. | 2004-03-11 |
Redundant configurable VCSEL laser array optical light source
App 20040042737 - Devine, William T. ; et al. | 2004-03-04 |
Process for making ultra-fine stabilized zirconia particles
Grant 5,716,565 - Stangle , et al. February 10, 1 | 1998-02-10 |
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